US20170051184A1 - Pressure-sensitive adhesive composition - Google Patents

Pressure-sensitive adhesive composition Download PDF

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Publication number
US20170051184A1
US20170051184A1 US15/308,537 US201615308537A US2017051184A1 US 20170051184 A1 US20170051184 A1 US 20170051184A1 US 201615308537 A US201615308537 A US 201615308537A US 2017051184 A1 US2017051184 A1 US 2017051184A1
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United States
Prior art keywords
sensitive adhesive
pressure
composition
film
butylene
Prior art date
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Abandoned
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US15/308,537
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English (en)
Inventor
Hyun Jee Yoo
Hyun Suk Kim
Jung Ok MOON
Se Woo YANG
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LG Chem Ltd
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LG Chem Ltd
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Assigned to LG CHEM, LTD. reassignment LG CHEM, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, HYUN SUK, MOON, JUNG OK, YANG, SE WOO, YOO, HYUN JEE
Publication of US20170051184A1 publication Critical patent/US20170051184A1/en
Abandoned legal-status Critical Current

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    • C09J7/0214—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
    • C08F255/10—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
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    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
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    • C09J133/04—Homopolymers or copolymers of esters
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    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H01L51/004—
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    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
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    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
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    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • C—CHEMISTRY; METALLURGY
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C08K5/00—Use of organic ingredients
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the pressure-sensitive adhesive composition of the present application may be formed in an encapsulation film, for example, which seals the entire surfaces of an organic electronic element of the OED so as to protect the element from moisture or oxygen.
  • a pressure-sensitive adhesive composition may include a polymer derived from butylene and a compound satisfying Formula 1 shown below.
  • the compound of Formula 1 may include a monofunctional acrylate.
  • Such a moisture scavenger may be controlled in a suitable size according to use.
  • an average particle size of the moisture scavenger may be controlled to about 10 to 15000 nm.
  • the moisture scavenger having a size in the above range may be easily stored since a reaction speed of the moisture scavenger with moisture is not so fast, and effectively remove moisture without damage to an element to be encapsulated.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
US15/308,537 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition Abandoned US20170051184A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20150017620 2015-02-04
KR10-2015-0017620 2015-02-04
PCT/KR2016/001269 WO2016126129A1 (ko) 2015-02-04 2016-02-04 점착제 조성물

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US20170051184A1 true US20170051184A1 (en) 2017-02-23

Family

ID=56564373

Family Applications (5)

Application Number Title Priority Date Filing Date
US15/308,537 Abandoned US20170051184A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/309,153 Abandoned US20170077440A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/308,325 Active 2036-04-29 US10355239B2 (en) 2015-02-04 2016-02-04 Encapsulation film
US15/308,800 Active US10074827B2 (en) 2015-02-04 2016-02-04 Encapsulation film
US17/204,781 Active US12101958B2 (en) 2015-02-04 2021-03-17 Organic electronic device including encapsulation layer

Family Applications After (4)

Application Number Title Priority Date Filing Date
US15/309,153 Abandoned US20170077440A1 (en) 2015-02-04 2016-02-04 Pressure-sensitive adhesive composition
US15/308,325 Active 2036-04-29 US10355239B2 (en) 2015-02-04 2016-02-04 Encapsulation film
US15/308,800 Active US10074827B2 (en) 2015-02-04 2016-02-04 Encapsulation film
US17/204,781 Active US12101958B2 (en) 2015-02-04 2021-03-17 Organic electronic device including encapsulation layer

Country Status (7)

Country Link
US (5) US20170051184A1 (de)
EP (4) EP3138887B1 (de)
JP (5) JP6600644B2 (de)
KR (4) KR101742425B1 (de)
CN (4) CN106795400B (de)
TW (4) TWI612112B (de)
WO (4) WO2016126128A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10714708B2 (en) 2018-02-01 2020-07-14 Samsung Display Co., Ltd. Display and method of manufacturing the same
US20220136109A1 (en) * 2019-04-12 2022-05-05 Epiluvac Ab Device and method to provide planarity of a wafer during growth
US20220216451A1 (en) * 2021-01-07 2022-07-07 Samsung Display Co., Ltd. Apparatus and method for manufacturing display device
US11955355B2 (en) * 2021-02-25 2024-04-09 Applied Materials, Inc. Isolated volume seals and method of forming an isolated volume within a processing chamber

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150016878A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
CN104658990B (zh) * 2015-03-02 2017-05-17 京东方科技集团股份有限公司 一种封装件及其制备方法
EP3239747B1 (de) 2016-04-29 2023-01-18 Samsung Display Co., Ltd. Polarisationselement und anzeigevorrichtung damit
KR102159497B1 (ko) * 2016-08-22 2020-09-25 주식회사 엘지화학 점착제 조성물
KR102146529B1 (ko) * 2016-08-22 2020-08-20 주식회사 엘지화학 점착제 조성물
KR102047291B1 (ko) * 2016-09-23 2019-11-21 주식회사 엘지화학 접착제 조성물
KR102580443B1 (ko) * 2017-02-28 2023-09-20 닛토덴코 가부시키가이샤 화상 표시 장치 및 해당 화상 표시 장치의 제조 방법
CN109148732B (zh) * 2017-06-19 2020-08-18 Tcl科技集团股份有限公司 一种基于金属粒子与有机小分子交联的器件封装方法
JP2019014888A (ja) * 2017-07-06 2019-01-31 三菱ケミカル株式会社 樹脂組成物、シート、それを用いた積層体、画像表示装置
CN107201190B (zh) * 2017-07-13 2020-07-17 深圳市新创源电子材料有限公司 一种电子贴片封装薄膜材料及其制备方法、应用
JP7170387B2 (ja) * 2017-08-21 2022-11-14 リンテック株式会社 粘着シートおよび表示体
KR101962195B1 (ko) * 2017-08-22 2019-03-26 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101962743B1 (ko) * 2017-08-22 2019-03-27 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101999792B1 (ko) * 2017-08-22 2019-07-12 (주)이녹스첨단소재 유기전자장치 봉지재용 접착조성물 및 이를 포함하는 유기전자장치 봉지재용 접착필름
KR102398554B1 (ko) * 2017-08-31 2022-05-17 엘지디스플레이 주식회사 봉지층을 포함하는 유기 발광 표시 장치
US11795314B2 (en) 2017-09-12 2023-10-24 Lg Chem, Ltd. Encapsulating composition
KR102475857B1 (ko) 2017-09-18 2022-12-12 삼성디스플레이 주식회사 플렉서블 표시 장치
JP6566324B2 (ja) * 2017-09-29 2019-08-28 サイデン化学株式会社 粘着シート
WO2019079391A1 (en) * 2017-10-17 2019-04-25 Avery Dennison Corporation PRESSURE-SENSITIVE ADHESIVES COMPRISING (METH) ACRYLATES AND RUBBER
CN107785503B (zh) * 2017-10-24 2019-03-08 京东方科技集团股份有限公司 金属封装结构及制备方法、显示面板的封装方法、显示装置
KR102271843B1 (ko) * 2017-12-18 2021-07-01 주식회사 엘지화학 봉지 필름
KR102212920B1 (ko) * 2018-09-03 2021-02-08 주식회사 엘지화학 봉지 필름
CN109309172A (zh) * 2018-10-11 2019-02-05 信利半导体有限公司 柔性oled器件及其制造方法、显示装置
KR102335253B1 (ko) * 2018-11-05 2021-12-03 주식회사 엘지화학 봉지 필름
CN112996877B (zh) * 2018-11-12 2024-01-05 株式会社Lg化学 封装组合物
US20220010116A1 (en) * 2018-11-14 2022-01-13 Denka Company Limited Composition
KR20200070140A (ko) * 2018-12-07 2020-06-17 주식회사 엘지화학 봉지 조성물
CN109830619B (zh) * 2019-01-28 2021-02-26 信利半导体有限公司 柔性显示器件的制作方法及柔性显示器件
JP7346907B2 (ja) * 2019-05-21 2023-09-20 王子ホールディングス株式会社 粘着シート、剥離シート付き粘着シート及び積層体の製造方法
KR102183612B1 (ko) * 2019-07-02 2020-11-26 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR102248284B1 (ko) * 2019-07-05 2021-05-04 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR102325733B1 (ko) * 2019-11-19 2021-11-12 (주)이녹스첨단소재 상온에서 합착이 가능한 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
CN112909198B (zh) * 2019-11-19 2024-02-02 利诺士尖端材料有限公司 能常温下贴合的有机电子装置用封装材料及有机电子装置
KR102325732B1 (ko) * 2019-11-19 2021-11-12 (주)이녹스첨단소재 상온에서 합착이 가능한 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
WO2021230717A1 (ko) * 2020-05-14 2021-11-18 주식회사 엘지화학 봉지 필름
KR20220022876A (ko) * 2020-08-19 2022-02-28 주식회사 엘지화학 열경화성 수지 조성물, 및 이를 이용한 봉지 필름
KR102698631B1 (ko) * 2020-12-24 2024-08-26 (주)이녹스첨단소재 유기전자장치용 봉지재 및 이를 포함하는 유기전자장치
US20240317914A1 (en) * 2020-12-31 2024-09-26 Lg Chem, Ltd. Encapsulating composition and organic electronic device comprising same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203183A1 (en) * 2001-12-14 2003-10-30 3M Innovative Properties Company Membrane module elements
US20110105637A1 (en) * 2008-06-02 2011-05-05 Jun Fujita Adhesive encapsulating composition and electronic devices made therewith
WO2013013568A1 (en) * 2011-07-25 2013-01-31 Henkel (China) Company Limited Photo curable adhesive compositions and use thereof
WO2013103281A1 (ko) * 2012-01-06 2013-07-11 주식회사 엘지화학 봉지용 필름
US20130207093A1 (en) * 2010-07-07 2013-08-15 Lg Chem, Ltd. Organic light emitting device comprising encapsulating structure

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159864A (en) * 1981-03-30 1982-10-02 Bridgestone Corp Self-adhesive composition
JPH0570404A (ja) * 1991-09-13 1993-03-23 Chisso Corp 新規アクリレート
JP3145743B2 (ja) * 1991-09-19 2001-03-12 日東電工株式会社 感圧性接着剤ないし接着シ―トの製造法
JPH11317475A (ja) 1998-02-27 1999-11-16 Canon Inc 半導体用封止材樹脂および半導体素子
CA2385221C (en) * 2000-09-06 2011-01-11 Appleton Papers Inc. In situ microencapsulated adhesive
US20060100299A1 (en) * 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
JP4301544B2 (ja) * 2003-01-07 2009-07-22 日東電工株式会社 画像表示装置の製造方法、画像表示装置および粘着型光学フィルム
JP2005107068A (ja) * 2003-09-30 2005-04-21 Nippon Shokubai Co Ltd 光学シート用組成物
US7070051B2 (en) * 2004-03-26 2006-07-04 Atrion Medical Products, Inc. Needle counter device including troughs of cohesive material
JP4695348B2 (ja) * 2004-05-27 2011-06-08 株式会社リコー カード型メモリ、画像形成装置、画像形成装置起動方法
JP4353009B2 (ja) * 2004-07-02 2009-10-28 東亞合成株式会社 光硬化性樹脂組成物
JP4976075B2 (ja) * 2005-12-26 2012-07-18 リンテック株式会社 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2008102271A (ja) * 2006-10-18 2008-05-01 Nitto Denko Corp 表面保護フィルムおよび表面保護フィルム付き光学フィルム
US20110010448A1 (en) * 2007-10-22 2011-01-13 Gill Paramjit S Leveraging and influencing computing network activity
CN101998982A (zh) * 2008-04-11 2011-03-30 3M创新有限公司 透明粘合剂片材及包括所述透明粘合剂片材的图像显示装置
JP2010209168A (ja) * 2009-03-09 2010-09-24 Lintec Corp 粘着シート
DE102009036968A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009046362A1 (de) * 2009-11-03 2011-05-05 Tesa Se Haftklebestoff aus einem vernetzbaren Polyolefin und einem Klebharz
CN101705067B (zh) 2009-11-23 2012-01-18 南亚塑胶工业股份有限公司 一种使用于贴合偏光板的黏着剂组合物
JP5905880B2 (ja) 2010-07-02 2016-04-20 スリーエム イノベイティブ プロパティズ カンパニー バリア組立品
US8663407B2 (en) * 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
AU2011250831A1 (en) * 2010-12-03 2012-06-21 Bayer Intellectual Property Gmbh Security and/or valuable documents with a top layer with a scratch-resistant finish
JP2012238768A (ja) * 2011-05-12 2012-12-06 Okura Ind Co Ltd 太陽電池素子封止シートおよび太陽電池モジュール
CN102898958B (zh) * 2011-07-25 2016-11-02 汉高股份有限公司 一种粘合剂组合物
CN102898959B (zh) 2011-07-25 2016-07-06 汉高股份有限及两合公司 一种可光固化的粘合剂组合物及其用途
US9512247B2 (en) * 2011-09-27 2016-12-06 Kaneka Corporation (Meth)acryloyl-terminated polyisobutylene polymer, method for producing the same, and active energy ray-curable composition
DE102011085034A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
CN107634148B (zh) * 2011-11-14 2019-09-17 Lg化学株式会社 粘合膜
KR101424346B1 (ko) 2011-11-18 2014-08-01 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
EP2819555B1 (de) * 2012-03-01 2017-05-03 3M Innovative Properties Company Sperranordnung mit durchgehendem kantenschutz
JP6087375B2 (ja) 2012-04-27 2017-03-01 株式会社クラレ アクリル系粘着剤組成物および粘着製品
JP6087518B2 (ja) * 2012-05-14 2017-03-01 信越化学工業株式会社 熱伝導性シート供給体及び熱伝導性シートの供給方法
JP2013241542A (ja) * 2012-05-22 2013-12-05 Nippon Shokubai Co Ltd 接着剤組成物及びこれを用いた接着剤シート並びに半導体素子
KR20130135142A (ko) * 2012-05-30 2013-12-10 주식회사 엘지화학 유기전자장치
KR101424395B1 (ko) 2012-05-31 2014-07-28 주식회사 엘지화학 유기전자장치의 제조방법
KR101718185B1 (ko) 2012-12-24 2017-04-04 주식회사 엘지화학 봉지재, 봉지재용 수지 조성물 및 광전자 장치
JP6251575B2 (ja) * 2013-01-23 2017-12-20 日東電工株式会社 シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
CN104854646B (zh) 2013-02-20 2017-05-10 Lg化学株式会社 显示装置
WO2014129821A1 (ko) * 2013-02-20 2014-08-28 주식회사 엘지화학 디스플레이 장치용 패키징 필름
KR101589374B1 (ko) 2013-05-21 2016-01-28 주식회사 엘지화학 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법
WO2014189291A1 (ko) * 2013-05-21 2014-11-27 주식회사 엘지화학 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법
JP6378533B2 (ja) * 2013-06-01 2018-08-22 日東電工株式会社 熱伝導性粘着シート
JP6191252B2 (ja) 2013-06-07 2017-09-06 大日本印刷株式会社 太陽電池モジュール用の封止材組成物及び封止材
US10050204B2 (en) 2013-07-19 2018-08-14 Lg Chem, Ltd. Encapsulation composition (as amended)
KR20150016878A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
JP6152319B2 (ja) * 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203183A1 (en) * 2001-12-14 2003-10-30 3M Innovative Properties Company Membrane module elements
US20110105637A1 (en) * 2008-06-02 2011-05-05 Jun Fujita Adhesive encapsulating composition and electronic devices made therewith
US20130207093A1 (en) * 2010-07-07 2013-08-15 Lg Chem, Ltd. Organic light emitting device comprising encapsulating structure
WO2013013568A1 (en) * 2011-07-25 2013-01-31 Henkel (China) Company Limited Photo curable adhesive compositions and use thereof
WO2013103281A1 (ko) * 2012-01-06 2013-07-11 주식회사 엘지화학 봉지용 필름
EP2801476A1 (de) * 2012-01-06 2014-11-12 LG Chem, Ltd. Verkapselungsfolie

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Thermal Conductivity of common Materials and Gases." The Engineering ToolBox, http://www.engineeringtoolbox.com/thermal-conductivity-d_429.html. Accessed 10 May 2017. *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10714708B2 (en) 2018-02-01 2020-07-14 Samsung Display Co., Ltd. Display and method of manufacturing the same
US20220136109A1 (en) * 2019-04-12 2022-05-05 Epiluvac Ab Device and method to provide planarity of a wafer during growth
US20220216451A1 (en) * 2021-01-07 2022-07-07 Samsung Display Co., Ltd. Apparatus and method for manufacturing display device
US11955355B2 (en) * 2021-02-25 2024-04-09 Applied Materials, Inc. Isolated volume seals and method of forming an isolated volume within a processing chamber
US20240332046A1 (en) * 2021-02-25 2024-10-03 Applied Materials, Inc. Isolated volume seals and method of forming an isolated volume within a processing chamber

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