US20130276701A1 - Deposition device, and collection device - Google Patents

Deposition device, and collection device Download PDF

Info

Publication number
US20130276701A1
US20130276701A1 US13/976,443 US201113976443A US2013276701A1 US 20130276701 A1 US20130276701 A1 US 20130276701A1 US 201113976443 A US201113976443 A US 201113976443A US 2013276701 A1 US2013276701 A1 US 2013276701A1
Authority
US
United States
Prior art keywords
vapor deposition
film
vapor
deposited
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/976,443
Other languages
English (en)
Inventor
Tohru Sonoda
Shinichi Kawato
Satoshi Inoue
Satoshi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Assigned to SHARP KABUSHIKI KAISHA reassignment SHARP KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASHIMOTO, SATOSHI, INOUE, SATOSHI, KAWATO, SHINICHI, SONODA, TOHRU
Publication of US20130276701A1 publication Critical patent/US20130276701A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M33/00—Means for introduction, transport, positioning, extraction, harvesting, peeling or sampling of biological material in or from the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to a vapor deposition device and a collection device for collecting vapor deposition materials that are vapor-deposited on an unnecessary part.
  • an organic EL display device that (i) includes an organic electroluminescence (hereinafter abbreviated to “EL”) element which uses EL of an organic material and that (ii) is an all-solid-state flat-panel display which is excellent in, for example, low-voltage driving, high-speed response, self-emitting, and wide viewing angle characteristics.
  • EL organic electroluminescence
  • An organic EL display device includes, for example, (i) a substrate made up of members such as a glass substrate and TFTs (thin film transistors) provided to the glass substrate and (ii) organic EL elements provided on the substrate and connected to the TFTs.
  • An organic EL element is a light-emitting element capable of emitting high-luminance light by low-voltage direct-current drive.
  • the organic EL element has a structure in which a first electrode, an organic EL layer, and a second electrode are stacked in this order, and the first electrode is electrically connected to the TFT.
  • an organic layer having a structure in which a hole injection layer, a hole transfer layer, an electron blocking layer, a luminescent layer, a hole blocking layer, an electron transfer layer, an electron injection layer, and the like are stacked together is provided between the first electrode and the second electrode.
  • a full-color organic EL display device typically includes, as sub-pixels aligned on a substrate, organic EL elements of red (R), green (G), and blue (B).
  • the full-color organic EL display device carries out an image display by, with use of TFTs, selectively causing the organic EL elements to each emit light with a desired luminance.
  • a luminescent layer of a predetermined pattern made of an organic light-emitting material which emits light of the colors is formed for each organic EL element serving as a light-emitting element.
  • the organic EL layer and the second electrode can be prepared by, for example, (i) a vacuum vapor deposition method which uses a vapor deposition mask referred to as a shadow mask, (ii) an inkjet method, and (iii) a laser transfer method.
  • the vacuum vapor deposition method is most typically used.
  • a vapor deposition material contained in a heating container called a crucible or a boat is heated in a highly vacuum so as to be sublimated, and then a thin film made of the vapor deposition material is deposited on a substrate.
  • a vapor-deposited film only in a desired region of the substrate by (i) fixing a shadow mask in close contact with the substrate, the shadow mask being open in the desired region and (ii) vapor-depositing the vapor deposition material on the substrate via an opening of the shadow mask.
  • the vacuum vapor deposition method causes a loss of all the vapor deposition material except the vapor deposition material of which the vapor-deposited film deposited on the substrate is made. Therefore, the vapor deposition material except the vapor deposition material of which the vapor-deposited film deposited on the substrate is made is not made into a vapor-deposited film to be provided in an organic EL display device.
  • the vapor deposition material is all wasted which adheres to, for example, (i) a shutter which determines whether or not vapor deposition particles are emitted toward the substrate which is provided directly above, for example, the crucible containing the vapor deposition material, (ii) a vapor deposition preventing plate which is provided in a replaceable state so that an inside of a chamber of a vapor deposition device is not contaminated with the vapor deposition material, and (iii) a non-opening of the shadow mask.
  • the second electrode is typically made of metal, which is lower in unit material cost as compared to an organic material of which the organic EL layer is made.
  • the organic material of which the organic EL layer is made is a special functional material that possesses properties such as electroconductivity, a carrier transferring property, a light-emitting property, and thermal and electrical stability, and the organic material is extremely high in unit material cost.
  • a method for solving such a problem may be exemplified by a method for collecting and reusing materials adherent to a part other than a substrate.
  • Patent Literature 1 discloses a water jet device which causes water jet spraying to collect an adherent film adherent to a film formation jig.
  • FIG. 15 is a view schematically illustrating a configuration of the water jet device disclosed in Patent Literature 1.
  • the water jet device illustrated in FIG. 15 includes a table 126 which is a working table for carrying out a cleaning operation and a working chamber 122 which is box-shaped so as to cover the table 126 from above.
  • the working chamber 122 has, on its side surfaces, doors via which a film formation jig 125 that is an object to be cleaned is carried in/out onto/from the table 126 .
  • the working chamber 122 can be hermetically sealed so that during the cleaning operation, splashes of water jet can be prevented from leaking out of the working chamber 122 .
  • the working chamber 122 includes a robot 121 which has a tip capable of three-dimensionally moving in accordance with a shape of a surface of the film formation jig 125 on which surface an adherent film is formed, the film formation jig 125 being an object to be cleaned (a cleaning target).
  • the robot 121 has an arm whose tip is provided with a cleaning gun 151 .
  • a high-pressure water generating device 152 for generating high-pressure water is provided outside and in proximity to the working chamber 122 so as to supply high-pressure water to the cleaning gun 151 via the robot 121 .
  • a pure water producing device 151 supplies, to the high-pressure water generating device 152 , city water from which ions have been removed.
  • the working chamber 122 further includes a sprayer 159 for moistening an inner wall of the working chamber 122 and (ii) an exhaust fan 162 for setting a pressure inside the working chamber 122 to be negative.
  • the table 126 has many holes provided in a net-like pattern, and a centrifugal separator 157 is provided under the table 126 .
  • the centrifugal separator 157 includes a fixed container 154 and a rotating container 156 .
  • the rotating container 156 coaxially rotates at a high speed in the fixed container 154 whose skin has many holes and whose inner surface has a filtering member 155 which is provided so as to cover the many holes.
  • the cleaning gun 151 sprays water jet at a water pressure of 30 MPa to 200 MPa over the adherent film of the film formation jig 125 which is placed on a cleaning jig platen 153 provided on the table 126 of the working chamber 122 , high-pressure water sprayed over the film formation jig 125 becomes suspended water containing adherent film pieces from the adherent film of the film formation jig 125 .
  • the suspended water together with water burst from the sprayer 159 , flows, directly or along an inner wall surface of the working chamber 122 , downward via the many holes of the table 126 , and then enters the rotating container 156 , where the suspended water and the water burst from the sprayer 159 are subjected to centrifugation by the centrifugal separator 157 , so as to be separated into adherent film pieces and wastewater.
  • the adherent film can thus be collected.
  • wastewater from a drain 158 returns to the high-pressure water generating device 152 via a pipe 177 .
  • Patent Literature 1 discloses that according to the water jet device, it is possible to collect and reuse the attached film of the film formation jig 125 while the film formation jig 125 is ground in a small amount and waste is generated in a reduced amount.
  • FIG. 14 is a view schematically illustrating a configuration of the conventional vacuum vapor deposition device 21 .
  • a vacuum chamber 5 includes a vapor deposition source(s) 2 , vapor deposition preventing plates 3 , and a shutter 4 .
  • the number of the vapor deposition source(s) 2 provided in the vacuum chamber 5 is one (1).
  • the vapor deposition preventing plates 3 prevent other components of the vacuum chamber 5 from being contaminated with vapor deposition particles.
  • the shutter 4 prevents the vapor deposition particles from being released (spouted) into the vacuum chamber 5 when vapor deposition does not need to be carried out (e.g. during a time period before vapor deposition is carried out at a stable speed, while a substrate 101 is absent, or during a time period in which the substrate 101 and a shadow mask 110 are positioned so as to be adhered to each other).
  • the shutter 4 has a function of covering/uncovering release holes 6 of the respective vapor deposition preventing plates 3 .
  • a vapor deposition material released from the vapor deposition source 2 is adhering to the vapor deposition preventing plates 3 , the shutter 4 , and the like while a vapor deposition process is being carried out.
  • the vapor deposition material adheres to the vapor deposition preventing plates 3 , the shutter 4 , and the like in a certain amount or more, the vapor deposition material peels off due to, for example, its own weight and then contaminates an inside of the chamber 5 .
  • a vapor deposition preventing plate, a shutter, and the like provided in a vacuum vapor deposition device are specially designed or designed to be specially-shaped in accordance with a shape of the vacuum vapor deposition device.
  • the vapor deposition preventing plate, the shutter, and the like are scraped off the surfaces of the vapor deposition preventing plate, the shutter, and the like on which surfaces the adherent films adhere, or the adherent films are directly sprayed with water jet, the vapor deposition preventing plate, the shutter, and the like are damaged, so that inclusion of impurities in the vapor deposition preventing plate, the shutter, and the like is highly likely to occur.
  • the water jet device accordingly becomes large in size. This results in an increase in device cost.
  • the present invention has been made in view of the problems, and an object of the present invention is to provide (i) a vapor deposition device which is highly productive and is capable of collecting a vapor deposition material with no increase in device price and (ii) a collection device which is capable of causing inclusion of impurities to be less likely to occur and collecting the vapor deposition material with high efficiency and at low cost.
  • a vapor deposition device of the present invention includes: a vapor deposition chamber in which vapor deposition particles released from a vapor deposition source are vapor-deposited on a substrate, the vapor deposition particles being vapor-deposited on the substrate when released from the vapor deposition source in a first direction during a first period, the vapor deposition particles being vapor-deposited on a vapor deposition preventing member when released from the vapor deposition source in a second direction, which is different from the first direction, during the first period, or released from the vapor deposition source during a second period, which is different from the first period, the vapor deposition preventing member being removable from the vapor deposition device, a film being provided on at least a part of a surface of the vapor deposition preventing member on which surface the vapor deposition particles are vapor-deposited, the film being provided so as to be peeled off from the vapor deposition preventing member, and the film being made of a material differing in at least one of
  • a film is provided on at least a part of a surface of the vapor deposition preventing member on which surface the vapor deposition particles are vapor-deposited, the film being provided so as to be peeled off from the vapor deposition preventing member. This causes the vapor deposition particles to be vapor-deposited not on the vapor deposition preventing member but on the film.
  • the film on which the vapor deposition particles are vapor-deposited can be easily peeled off from the vapor deposition preventing member, it is possible to replace the film with a new one in a relatively short time.
  • the film is made of a material differing in at least one of a melting point, a sublimation point, solubility in a given solvent, microbial biodegradability, and photodegradability from a material of which a vapor-deposited film that is formed on the film is made, it is possible to separate, with relative ease and no fear of inclusion of impurities, the film and the vapor-deposited film that is formed on the film.
  • a collection device of the present invention includes: a film which is provided in a vapor deposition device mentioned above and on which a vapor-deposited film is formed; and a separating section for separating the vapor-deposited film from the film on which the vapor-deposited film is formed.
  • the film and the vapor-deposited film that is formed on the film is separated by the separating section by use of a difference between the film and the vapor-deposited film that is formed on the film in at least one of a melting point, a sublimation point, solubility in a given solvent, microbial biodegradability and photodegradability.
  • the vapor deposition device of the present invention is configured such that the vapor deposition particles are vapor-deposited on the substrate when released from the vapor deposition source in a first direction during a first period, the vapor deposition particles are vapor-deposited on a vapor deposition preventing member when released from the vapor deposition source in a second direction, which is different from the first direction, during the first period, or released from the vapor deposition source during a second period, which is different from the first period, the vapor deposition preventing member being removable from the vapor deposition device, a film is provided on at least a part of a surface of the vapor deposition preventing member on which surface the vapor deposition particles are vapor-deposited, the film being provided so as to be peeled off from the vapor deposition preventing member, and the film is made of a material differing in at least one of a melting point, a sublimation point, solubility in a given solvent, microbial biodegradability, and photodegradability from a material of
  • the collection device of the present invention thus includes: a film which is provided in a vapor deposition device mentioned above and on which a vapor-deposited film is formed; and a separating section for separating the vapor-deposited film from the film on which the vapor-deposited film is formed.
  • a vapor deposition device which is highly productive and is capable of collecting a vapor deposition material with no increase in device price and (ii) a collection device which is capable of causing inclusion of impurities to be less likely to occur and collecting the vapor deposition material with high efficiency and at low cost.
  • FIG. 1 is a view schematically illustrating a configuration of the vacuum vapor deposition device according to Embodiment 1 of the present invention.
  • FIG. 2 is a view illustrating a state in which films have been peeled off from vapor deposition preventing plates and a shutter in the vacuum vapor deposition device illustrated in FIG. 1 .
  • FIG. 3 is a view illustrating (i) a collection device according to Embodiment 1 of the present invention and (ii) a process in which a water-insoluble substance obtained from the collection device is reused as a vapor deposition material.
  • FIG. 4 is a view schematically illustrating a configuration of a vacuum vapor deposition device including control plates each provided with a film, which vacuum vapor deposition device is a modified example of Embodiment 1.
  • FIG. 5 is a view schematically illustrating a configuration of a vacuum vapor deposition device according to Embodiment 2 of the present invention.
  • FIG. 6 is a view illustrating (i) a collection device according to Embodiment 2 of the present invention and (ii) a process in which a nondegradable matter obtained from the collection device is reused as a vapor deposition material.
  • FIG. 7 is a view schematically illustrating a configuration of a vacuum vapor deposition device according to Embodiment 3 of the present invention.
  • FIG. 8 is a view illustrating (i) a collection device according to Embodiment 3 of the present invention and (ii) a process in which a nondegradable matter obtained from the collection device is reused as a vapor deposition material.
  • FIG. 9 is a view schematically illustrating a configuration of a vacuum vapor deposition device according to Embodiment 4 of the present invention.
  • FIG. 10 is a view illustrating (i) a collection device according to Embodiment 4 of the present invention and (ii) a process in which a vapor deposition material obtained from the collection device is reused.
  • FIG. 11 is a cross-sectional view of organic EL elements constituting a display section of an organic EL display device.
  • FIG. 12 is a schematic view of a method for forming a patterned vapor-deposited film on a substrate by use of a vacuum vapor deposition.
  • FIG. 13 is a view illustrating a process for producing an organic EL display device.
  • FIG. 14 is a view schematically illustrating a configuration of a conventional vacuum vapor deposition device.
  • FIG. 15 is a view schematically illustrating a configuration of a water jet device disclosed in Patent Literature 1.
  • each of the following Embodiments will deal with a deposition device and a collection device each used for a process for producing an organic EL display device as an example of a vapor deposition device and a collection device of the present invention.
  • Embodiments are, however, not limited to this.
  • the vapor deposition device and the collection device of the present invention can be used in production processes carried out in various fields.
  • FIG. 11 is a cross-sectional view of organic EL elements constituting a display section of an organic EL display device.
  • TFTs thin film transistors
  • alkali-free glass or plastic can be employed as the substrate 101 .
  • Embodiment 1 employs, as the substrate 101 , an alkali-free glass substrate having a thickness of 0.7 mm.
  • a known photosensitive resin can be employed as each of the interlayer insulating film 102 and the edge covers 104 .
  • Examples of such a known photosensitive resin encompass an acrylic resin and a polyimide resin.
  • Embodiment 1 a photosensitive acrylic resin is employed as each of the interlayer insulating film 102 and the edge covers 104 .
  • the first electrodes 103 are formed by (i) depositing an electrode material by a method such as sputtering and (ii) then patterning the electrode material in shapes for respective pixels by photolithography and etching.
  • the first electrodes 103 can be made of any of various electrically conductive materials. Note, however, that the first electrodes 103 need to be transparent or semi-transparent in a case where the organic EL display device is a bottom emission organic EL element in which light is emitted towards a substrate side. Meanwhile, a second electrode 107 needs to be transparent or semi-transparent in a case where the organic EL display device is a top emission organic EL element in which light is emitted from a surface opposite to the substrate side.
  • Embodiment 1 will discuss how to produce an active matrix organic EL display device in which the TFTs are provided for respective pixels. Note, however, that Embodiment 1 is not limited to this. Embodiment 1 is applicable also to a passive matrix organic EL display device in which no TFT is provided.
  • the edge covers 104 cover edge parts of the first electrodes 103 so as to prevent the corresponding first electrodes 103 and the second electrode 107 from short-circuiting due to a reduction in thickness of an organic EL layer and/or concentration of electric fields in the edge parts of the first electrodes 103 .
  • Each first electrode 103 is exposed in a corresponding area between adjacent edge covers 104 . Note that such a corresponding area serves as a light-emitting section of a corresponding pixel.
  • Each organic EL layer is formed on a corresponding first electrode 103 .
  • the organic EL layer is made up of, for example, a hole injection layer/hole transfer layer 105 , a luminescent layers ( 106 R, 106 G, and 106 B), and an electron transfer layer/an electron injection layer (not illustrated).
  • the organic EL layer can, as needed, further include a carrier blocking layer (not illustrated) for blocking a flow of carriers such as holes and electrons.
  • a single layer can have a plurality of functions.
  • the hole injection layer/hole transfer layer 105 can serve as both a hole injection layer and a hole transfer layer.
  • Embodiment 1 (a) the first electrodes 103 , serving as an anode, (b) the hole injection layer-/hole transfer layer 105 , (c) the luminescent layers ( 106 R, 106 G, and 106 B), (d) the electron injection layer (not illustrated), (e) the electron transfer layer (not illustrated), and (f) the second electrode 107 serving as a cathode, are stacked in this order from a first electrode 103 side.
  • the order in which the layers are stacked is reversed.
  • Embodiment 1 employs a bottom emission organic EL element, and ITO (indium tin oxide) is employed as the first electrode 103 .
  • ITO indium tin oxide
  • the organic EL layer can be made of a known material.
  • Each of the luminescent layers ( 106 R, 106 G, and 106 B) can be made of a single material or made of a host material mixed with another material as a guest material or a dopant. In Embodiment 1, each of the luminescent layers ( 106 R, 106 G, and 106 B) is made of a single material.
  • FIG. 12 is a schematic view of a method for forming a patterned vapor-deposited film on a substrate by use of a vacuum vapor deposition.
  • a vapor deposition material is heated and sublimated by a vapor deposition source 120 .
  • Vapor deposition particles obtained by sublimating the vapor deposition material pass through a shadow mask 110 having openings 110 a in respective desired positions thereof, and then reach the substrate 101 on which none of the organic EL layers illustrated in FIG. 11 have been formed.
  • the shadow mask 110 adheres to the substrate 101 . This allows a vapor-deposited film to be formed in a desired position of the substrate 101 .
  • film formation is carried out with respect to the entire display section. Therefore, film formation is carried out by using, as the shadow mask 110 , an open mask which is open in the entire display section and only in a region in which the film formation needs to be carried out.
  • the film formation is carried out by use of a fine mask which is open only in a place in which the film formation is carried out (e.g., for each sub-pixel).
  • FIG. 13 illustrates a process for producing an organic EL display device.
  • the substrate 101 obtained by forming the first electrodes 103 on a TFT substrate is formed is formed (S 1 ).
  • the hole injection layer/hole transfer layer 105 is formed on the entire substrate 101 by use of a vacuum vapor deposition method (S 2 and S 3 ).
  • the luminescent layers ( 106 R, 106 G, and 106 B) are formed in respective given places by the vacuum vapor deposition method with use of a fine mask as the shadow mask 110 (S 4 ).
  • the electron transfer layer, the electron injection layer, and the second electrode 107 are formed in this order by the vacuum vapor deposition method (S 5 , S 6 , and S 7 ).
  • the second electrode 107 can be formed by a method other than the vacuum vapor deposition method such as a sputtering method.
  • the sealing may be carried out by, for example, a method in which a film which is difficult to transmit by moisture and/or oxygen is formed by, for example, a CVD method, or a method in which glass substrates, for example are combined together with use of, for example, an adhesive.
  • the organic EL display device which is prepared by the above process, can carry out a desired display by supplying, from a drive circuit provided outside the organic EL display device, electric currents to the organic EL elements provided for the respective pixels.
  • a vacuum vapor deposition device 1 to be used for forming, during the process for producing the organic EL display device illustrated in FIG. 13 , the organic EL layers on the substrate 101 obtained by forming the first electrodes 103 on the TFT substrate.
  • FIG. 1 is a view schematically illustrating a configuration of the vacuum vapor deposition device 1 .
  • a vacuum chamber 5 (vapor deposition room) includes a vapor deposition source(s) 2 , vapor deposition preventing plates 3 (vapor deposition preventing member), and a shutter 4 (vapor deposition preventing member).
  • the number of the vapor deposition source(s) 2 provided in the vacuum chamber 5 is one (1).
  • the vapor deposition preventing plates 3 prevent other components of the vacuum chamber 5 from being contaminated with vapor deposition particles.
  • the shutter 4 prevents the vapor deposition particles from being released (spouted) into the vacuum chamber 5 when vapor deposition does not need to be carried out (e.g. during a time period before vapor deposition is carried out at a stable speed, while a substrate 101 is absent, or during a time period in which the substrate 101 and a shadow mask 110 are positioned so as to be adhered to each other).
  • the shutter 4 has a function of covering/uncovering release holes 6 of the respective vapor deposition preventing plates 3 .
  • films 7 which can be peeled off from the vapor deposition preventing plates 3 and the shutter 4 , are provided on surfaces of the vapor deposition preventing plates 3 and the shutter 4 on which surfaces the vapor deposition particles are vapor-deposited.
  • the films 7 are provided on the entire surfaces of the vapor deposition preventing plates 3 and the shutter 4 on which surfaces the vapor deposition particles are vapor-deposited.
  • the films 7 can be provided on at least a part of the surfaces of the vapor deposition preventing plates 3 and the shutter 4 on which surfaces the vapor deposition particles are vapor-deposited.
  • the films 7 can also be provided only in a region of the vapor deposition preventing plates 3 and the shutter 4 in which region the vapor deposition particles are vapor-deposited in a large amount.
  • the vacuum vapor deposition device 1 illustrated in FIG. 1 differs from the conventional vacuum vapor deposition device 21 illustrated in FIG. 14 in that the vacuum vapor deposition device 1 includes the films 7 which are provided on the entire surfaces of the vapor deposition preventing plates 3 and of the shutter 4 on which surfaces the vapor deposition particles are vapor-deposited. According to the vacuum vapor deposition device 1 , the vapor deposition particles are vapor-deposited on the films 7 .
  • Embodiment 1 the films 7 are adhered, with use of an adhesive, to the surfaces of the vapor deposition preventing plates 3 and of the shutter 4 which are those of the conventional deposition device.
  • an adhesive an adhesive
  • the films 7 to the surfaces is not limited to an adhesive, but can be a sticking agent.
  • the films 7 can be adhered to the surfaces by being pressed against the surfaces with a pin or the like. Further, the films 7 can be formed by spraying or coating the surfaces with a resin and then curing the resin.
  • FIG. 2 is a view illustrating a state in which the films 7 have been peeled off from the vapor deposition preventing plates and shutter 4 in the vacuum vapor deposition device 1 illustrated in FIG. 1 .
  • the films 7 can be easily peeled off from the vapor deposition preventing plates 3 and the shutter 4 manually or by mechanical means.
  • the films 7 are made of a water-soluble material.
  • Embodiment 1 employs, as the films 7 , films made of polyvinyl alcohol (PVA).
  • PVA polyvinyl alcohol
  • the films 7 are not limited to these.
  • an adhesive is not limited to this. Note, however, that, since the adhesive which is not water-soluble remains without being dissolved in water, it is necessary to remove an adhesive component with use of a collection device provided separately from the vacuum vapor deposition device 1 .
  • a material of which the organic EL layers e.g., the hole injection layer, the hole transfer layer, the luminescent layer, the electron transfer layer, and the electron injection layer
  • the organic EL layers e.g., the hole injection layer, the hole transfer layer, the luminescent layer, the electron transfer layer, and the electron injection layer
  • the material is water-insoluble.
  • the films 7 are dissolved in water, whereas films vapor-deposited on the films 7 are not dissolved in the water. This allows the films 7 and the films vapor-deposited on the films 7 to be easily separated.
  • the hole injection layer/hole transfer layer encompass (i) anthracene, azatriphenylene, fluorenone, hydrazone, stilbene, triphenylene, benzine, styryl amine, triphenylamine, porphyrin, triazole, imidazole, oxadiazole, oxazole, polyarylalkane, phenylenediamine, arylamine, or a derivative of any of the above, a monomer, an oligomer, or a polymer of a heterocyclic conjugated system such as a thiophene compound, a polysilane compound, a vinylcarbazole compound, or an aniline compound.
  • the luminescent layers are each made of a material, such as a low-molecular fluorescent pigment or a metal complex, that has high light emission efficiency.
  • the luminescent layers are each made of a material such as anthracene, naphthalene, indene, phenanthrene, pyrene, naphthacene, triphenylene, perylene, picene, fluoranthene, acephenanthrylene, pentaphene, pentacene, coronene, butadiene, coumarin, acridine, stilbene, a derivative of any of the above and (ii) a tris(8-hydroxyquinolinate) aluminum complex, a bis(benzoquinolinolato) beryllium complex, a tri(dibenzoylmethyl) phenanthroline europium complex, ditolyl vinyl biphenyl, hydroxyphenyl oxazole, or hydroxyphenyl thiazole.
  • the electron transfer layer and the electron injection layer are each made of a material such as a tris(8-hydroxyquinolinate) aluminum complex, an oxadiazole derivative, a triazole derivative, a phenylquinoxaline derivative, or a silole derivative.
  • the films vapor-deposited on the films 7 do not necessarily need to be water-insoluble, provided that there is a difference in water solubility between the films 7 and the films vapor-deposited on the films 7 . It is preferable that the difference in water solubility be as great as possible.
  • the films 7 on which the vapor deposition particles are vapor-deposited can thus be easily peeled off from the vapor deposition preventing plates 3 and the shutter 4 and then extracted from the vacuum chamber 5 .
  • the films 7 can also be peeled off from the vapor deposition preventing plates 3 and the shutter 4 after the vapor deposition preventing plates 3 and the shutter 4 are extracted from the vacuum chamber 5 .
  • a throughput is reduced by an amount of time spent for extraction and replacement of the vapor deposition preventing plates 3 and the shutter 4 . Therefore, it is preferable to extract only the films 7 from the vacuum chamber 5 .
  • the vacuum vapor deposition device 1 can operate. Therefore, such a method allows the throughput to be higher than a conventional method in which vapor deposition preventing plates 3 and the shutter 4 , on each of which the vapor deposition material is adherent, are all replaced with new ones.
  • FIG. 3 is a view illustrating (i) a collection device 8 for separating the films 7 and the films vapor-deposited on the films and (ii) a process in which a water-insoluble substance obtained from the collection device 8 is reused as a vapor deposition material.
  • the collection device 8 includes a water tank (separating section).
  • the films 7 on which the films are vapor-deposited are introduced into the water tank.
  • the collection device 8 which includes only the water tank in FIG. 3 , further includes a filtering section and a drying section.
  • filtering is employed as a method for collecting only a water-insoluble material from an aqueous solution.
  • the method is not limited to this.
  • the water tank which is provided in the collection device 8 , can be replaced with a tank containing an organic solvent, provided that it is possible to secure a difference in solubility in a predetermined solvent between the films 7 and the films vapor-deposited on the films 7 .
  • adherent films do not need to be scraped off surfaces of a vapor deposition preventing plate, a shutter, and the like, or the adherent films do not need to be directly sprayed with water jet. Therefore, there is no damage to the vapor deposition preventing plate and the shutter, or there is no residue of a vapor deposition material on surfaces of these vapor deposition preventing materials.
  • the films 7 on which vapor-deposited films are formed are flexible, the films 7 can be cut into fine pieces or compressed, so as to be introduced into the water tank.
  • a vapor deposition preventing plate 3 and a shutter are each made of SUS and the vapor deposition preventing plate and the shutter on each of which the vapor deposition material is adherent are immersed in an organic solvent capable of dissolving a vapor deposition material.
  • Such a method makes it possible to separate a vapor deposition material from a vapor deposition preventing plate and a shutter by dissolving only the vapor deposition material in an organic solvent, whereas the method has the following problems.
  • impurities originally contained in an organic solvent are included in a collected vapor deposition material. Since it is difficult to separate the impurities from the vapor deposition material, it is necessary to highly purify the vapor deposition material by, for example, sublimation and purification. This causes an increase in cost of collecting the vapor deposition material.
  • a collectable vapor deposition material is limited depending on solubility of a vapor deposition material in an organic solvent.
  • the films 7 can be applied not only to a vapor deposition preventing plate and a shutter but also to various structures of a vacuum chamber.
  • FIG. 4 is a view schematically illustrating a vacuum vapor deposition device 1 a including a plurality of control plates 22 .
  • vapor deposition particles having entered inter-control-plate spaces 23 are selectively captured, in accordance with their respective entry angles, by the plurality of control plates 22 (vapor deposition preventing members) which are provided between a vapor deposition source 2 a and a vapor deposition mask 110 .
  • This causes openings of the vapor deposition mask 110 to receive only vapor deposition particles each having an entry angle that is not more than a predetermined entry angle (see FIG. 4 ).
  • films 7 can also be provided to the plurality of control plates 22 .
  • control plates 22 can be integrated.
  • vacuum chambers are prepared in respective steps of the process for producing an organic EL display device (see FIG. 13 ) and (ii) films 7 are provided to vapor deposition preventing plates 3 and a shutter 4 of each of the respective vacuum chambers used for the steps in which a hole injection layer, a hole transfer layer, a luminescent layer, an electron transfer layer, and an electron injection layer are formed.
  • Embodiment 2 differs from Embodiment 1 in that Embodiment 2 uses films 9 made of a biodegradable material.
  • Embodiment 2 is similar to Embodiment 1 except for the above difference.
  • members having functions identical to those of the members illustrated in the drawings of Embodiment 1 are given respective identical reference numerals, and a description thereof is not repeated.
  • FIG. 5 is a view schematically illustrating a configuration of a vacuum vapor deposition device 1 b.
  • the films 9 made of a biodegradable material are provided on entire surfaces of vapor deposition preventing plates 3 and a shutter 4 on which entire surfaces vapor deposition particles are vapor-deposited, the vapor deposition preventing plates 3 and the shutter 4 each provided in the vacuum vapor deposition device 1 b , and the vapor deposition particles are vapor-deposited on the films 9 .
  • the films 9 on which the vapor deposition particles are vapor-deposited can be easily peeled off from the vapor deposition preventing plates 3 and the shutter 4 and then extracted from a vacuum chamber 5 .
  • the films 9 are made of a biodegradable material.
  • the biodegradable material encompass polylactic acid and polyglycol acid.
  • biodegradable material encompass ECOLOJUTM manufactured by Mitsubishi Plastics, Inc. and Hi-selon manufactured by The Nippon Synthetic Chemical Industry Co., Ltd.
  • the films 9 which are biodegradable, are degraded by microorganisms into water and carbon dioxide.
  • FIG. 6 is a view illustrating (i) a collection device 10 for separating the films 9 and films vapor-deposited on the films 9 and (ii) a process in which a nondegradable matter obtained from the collection device 10 is reused as a vapor deposition material.
  • the collection device 10 includes a microbial degradation tank (separating section).
  • the films 9 on which the films are vapor-deposited are introduced into the microbial degradation tank.
  • the films 9 which are biodegradable, are degraded by microorganisms. Meanwhile, many of materials for an organic EL layer have benzene rings, which are less biodegradable.
  • the nondegradable matter is collected by separation in accordance with a method such as filtering or washing by water and are then dried, it is possible to obtain a vapor deposition material, so that the vapor deposition material can be reused.
  • the collection device 10 which includes only the microbial degradation tank in FIG. 6 , further includes a filtering section and a drying section.
  • the films 9 are made of a biodegradable material. This prevents a harmful by-product from being generated during the step of separating the vapor deposition material from the films 9 . Therefore, it is possible to achieve the collection device 10 which is low in environmental load.
  • the collection device 10 it is also possible to use light irradiation in combination, provided that the vapor deposition material does not deteriorate.
  • the films 9 are films which can be degraded only by light irradiation
  • such films can be used instead of biodegradable films.
  • water it is possible to use water in combination so as to accelerate film degradation by light irradiation.
  • the films which can be degraded only by light irradiation i.e., photodegradable plastics (films) can be obtained by use of, for example, a technique disclosed in Japanese Patent No. 2826634 B or Japanese Patent Application Publication, Tokukai, No. 2010-059322 A.
  • Light that irradiates the films is not particularly limited in wavelength range, provided that the light can degrade the films.
  • the light can be visible light, ultraviolet light (ultraviolet rays), or light containing visible light and ultraviolet light.
  • adherent films do not need to be scraped off surfaces of a vapor deposition preventing plate, a shutter, and the like, or the adherent films do not need to be directly sprayed with water jet. Therefore, there is no damage to the vapor deposition preventing plate and the shutter, or there is no residue of a vapor deposition material on surfaces of these vapor deposition preventing materials.
  • the films 9 on which vapor-deposited films are formed are flexible, the films 9 can be cut into fine pieces or compressed, so as to be introduced into the microbial degradation tank.
  • Embodiment 3 differs from Embodiment 1 in that Embodiment 3 uses films 11 made of a low-temperature melting material.
  • Embodiment 3 is similar to Embodiment 1 except for the above difference.
  • members having functions identical to those of the members illustrated in the drawings of Embodiment 1 are given respective identical reference numerals, and a description thereof is not repeated.
  • FIG. 7 is a view schematically illustrating a configuration of a vacuum vapor deposition device 1 c.
  • the films 11 made of a low-temperature melting material are provided on entire surfaces of vapor deposition preventing plates 3 and a shutter 4 on which entire surfaces vapor deposition particles are vapor-deposited, the vapor deposition preventing plates 3 and the shutter 4 each provided in the vacuum vapor deposition device 1 c , and the vapor deposition particles are vapor-deposited on the films 11 .
  • the films 11 on which the vapor deposition particles are vapor-deposited can be easily peeled off from the vapor deposition preventing plates 3 and the shutter 4 and then extracted from a vacuum chamber 5 .
  • the films 11 are made of a low-temperature melting material, examples of which encompass polyethylene and polypropylene.
  • polyethylene has a melting point of approximately 120° C.
  • polypropylene has a melting point of approximately 160° C.
  • the films 11 are made of polypropylene according to Embodiment 3, a material of which the films 11 are made is not limited to this.
  • FIG. 8 is a view illustrating (i) a collection device 12 for separating the films 11 and films vapor-deposited on the films 11 and (ii) a process in which a nonmeltable matter obtained from the collection device 12 is reused as a vapor deposition material.
  • the collection device 12 includes a heating tank (separating section).
  • the films 11 on which the films are vapor-deposited are introduced into the heating tank.
  • the films 11 are meltable at a low temperature, the films 11 are liquefied by being heated to a temperature which is not less than its melting point.
  • a material of which organic EL layers are made by a vacuum vapor deposition method is typically a low-molecular one, and has a high melting point or sublimation point. This causes the material to be supernatant, floating, or precipitated without being liquefied.
  • the melting point or sublimation point of the material of which the organic EL layers are made is, for example, approximately 200° C. to 350° C.
  • the inside of the heating tank is in an inert gas atmosphere or a vacuum, a nonmeltable matter does not easily deteriorate by being heated.
  • the nonmeltable matter can be collected by separation by filtering or the like. Melting by use of the heating tank and the collection by separation by filtering can be carried out a plurality of times if necessary.
  • the vapor deposition material can thus be collected and reused.
  • the collection device 12 which includes only the heating tank in FIG. 8 , further includes a filtering section.
  • the method can be employed in a case where films having a sublimation point instead of a melting point are used and the films have a lower sublimation point than a melting point or a sublimation point of vapor-deposited films vapor-deposited on the films. Note, however, that it is necessary in this case to provide, instead of carrying out a filtering process, the heating tank with an outlet via which a film material sublimated in the heating tank is discharged.
  • a molten material of which the films 11 are made can be reused by being made into films again. Therefore, it is possible to reuse both the films 11 and a vapor deposition material vapor-deposited on the films 11 , and to allow a further reduction in waste to be produced during a vapor deposition step carried out by the organic EL display device.
  • the films 11 on which vapor-deposited films are formed are flexible, the films 11 can be cut into fine pieces or compressed, so as to be introduced into the heating tank.
  • Embodiment 4 differs from Embodiment 1 in that Embodiment 4 uses films 13 made of a heat-resistant material.
  • Embodiment 4 is similar to Embodiment 1 except for the above difference.
  • members having functions identical to those of the members illustrated in the drawings of Embodiment 1 are given respective identical reference numerals, and a description thereof is not repeated.
  • FIG. 9 is a view schematically illustrating a configuration of a vacuum vapor deposition device 1 d.
  • the films 13 made of a heat-resistant material are provided on entire surfaces of vapor deposition preventing plates 3 and a shutter 4 on which entire surfaces vapor deposition particles are vapor-deposited, the vapor deposition preventing plates 3 and the shutter 4 each provided in the vacuum vapor deposition device 1 d , and the vapor deposition particles are vapor-deposited on the films 13 .
  • the films 13 on which the vapor deposition particles are vapor-deposited can be easily peeled off from the vapor deposition preventing plates 3 and the shutter 4 and then extracted from a vacuum chamber 5 .
  • the films 13 are heat-resistant films. According to Embodiment 4, the films 13 are made of aluminum foil. However, a material of which the films 13 are made is not limited to this.
  • FIG. 10 is a view illustrating (i) a collection device 14 for separating the films 13 and films vapor-deposited on the films 13 and (ii) a process in which a vapor deposition material obtained from the collection device 14 is reused.
  • the collection device 14 includes a heating tank (sublimation and purification tank).
  • the films 13 on which the films are vapor-deposited are introduced into the heating tank.
  • the heating tank an inside of which is maintained in a vacuum atmosphere, is heated to sublimate the films vapor-deposited on the films 13 .
  • the films 13 which are heat-resistant, are not denatured even by being heated.
  • a sublimate is cooled in the collection chamber so as to be re-solidified. Such a process makes it possible to collect and reuse a vapor deposition material.
  • Metal materials many of which are generally not denatured at a sublimation temperature of a material of which organic EL layers are made, can be suitably employed as film materials.
  • the films 13 After the vapor deposition material vapor-deposited on the films 13 is peeled off by sublimation, the films 13 can be reused as they are.
  • the films 13 on which vapor-deposited films are formed are flexible, the films 13 can be cut into fine pieces or compressed, so as to be introduced into the heating tank.
  • the vapor deposition device of the present invention is preferably configured such that: the material of which the film is made differs in solubility in water from the material of which the vapor-deposited film that is formed on the film is made; and the material of which the film is made has greater solubility in water than the material of which the vapor-deposited film that is formed on the film is made.
  • the vapor deposition device of the present invention is preferably configured such that: the film is water-soluble; and the vapor-deposited film that is formed on the film is water-insoluble.
  • the vapor deposition device of the present invention is preferably configured such that the film is made of polyvinyl alcohol.
  • the vapor deposition device of the present invention is preferably configured such that: the material of which the film is made differs in microbial biodegradability from the material of which the vapor-deposited film that is formed on the film is made; and the material of which the film is made has greater microbial biodegradability than the material of which the vapor-deposited film that is formed on the film is made.
  • the vapor deposition device of the present invention is preferably configured such that the film is made of polylactic acid or polyglycol acid.
  • the vapor deposition device of the present invention is preferably configured such that: the material of which the film is made differs in photodegradability from the material of which the vapor-deposited film that is formed on the film is made; and the material of which the film is made has greater photodegradability than the material of which the vapor-deposited film that is formed on the film is made.
  • the vapor deposition device of the present invention is preferably configured such that: the material of which the film is made differs in melting point or sublimation point from the material of which the vapor-deposited film that is formed on the film is made; and the material of which the film is made has a lower melting point or sublimation point than the material of which the vapor-deposited film that is formed on the film is made.
  • the vapor deposition device of the present invention is preferably configured such that the film is made of polyethylene or polypropylene.
  • a molten film can be reused by being made into a film again. Therefore, it is possible to reuse both the film and the vapor-deposited film that is formed on the film, and to allow a further reduction in waste.
  • the vapor deposition device of the present invention is preferably configured such that: the material of which the film is made differs in sublimation point from the material of which the vapor-deposited film that is formed on the film is made; and the material of which the film is made has a higher sublimation point than the material of which the vapor-deposited film that is formed on the film is made.
  • the vapor deposition device of the present invention is preferably configured such that the film is made of aluminum foil.
  • the film can be reused as it is.
  • the vapor deposition device of the present invention is preferably configured such that the vapor deposition preventing member includes a vapor deposition preventing plate for preventing the vapor deposition chamber from being contaminated with the vapor deposition particles.
  • the vapor deposition device of the present invention is preferably configured such that the vapor deposition preventing member includes a shutter for preventing the vapor deposition particles released from the vapor deposition source from being vapor-deposited on the substrate during the second period.
  • the vapor deposition device of the present invention is preferably configured such that: the vapor deposition preventing member includes (i) a plurality of control plates which are provided between (a) an opening via which the vapor deposition particles are released from the vapor deposition source and (b) the substrate, and which are provided in a direction perpendicular to a normal direction of the substrate so that the opening is provided between the plurality of control plates, or (ii) the plurality of control plates which are integrated.
  • the vapor deposition preventing member which is provided with the film is a vapor deposition preventing plate, a shutter, a control plate, and/or the like on each of which the vapor deposition particles are vapor-deposited in a large amount. This makes it possible to efficiently collect a vapor deposition material.
  • the collection device of the present invention is preferably configured such that: the film is made of a material differing in solubility in water from a material of which the vapor-deposited film that is formed on the film is made; and the collection device includes a water tank as the separating section.
  • the film on which the vapor-deposited film is formed is flexible, the film can be cut into fine pieces or compressed, so as to be introduced into the water tank. This allows the film to be processed in a large amount at one time, and allows the collection device to be small in size.
  • the collection device of the present invention is preferably configured such that: the film is made of a material differing in microbial biodegradability from a material of which the vapor-deposited film that is formed on the film is made; and the collection device includes a microorganism-containing microbial degradation tank as the separating section.
  • the film on which the vapor-deposited film is formed is flexible, the film can be cut into fine pieces or compressed, so as to be introduced into the water tank containing microorganisms. This allows the film to be processed in a large amount at one time, and allows the collection device to be small in size.
  • the collection device of the present invention is preferably configured such that: the film is made of a material differing in melting point or sublimation point from a material of which the vapor-deposited film that is formed on the film is made; and the collection device includes a heating tank as the separating section.
  • a molten film can be reused by being made into a film again. Therefore, it is possible to reuse both the film and the vapor-deposited film that is formed on the film, and to allow a further reduction in waste.
  • the film can be reused as it is. Therefore, it is possible to reuse both the film and the vapor-deposited film that is formed on the film, and to allow a further reduction in waste.
  • the film on which the vapor-deposited film is formed is flexible, the film can be cut into fine pieces or compressed, so as to be introduced into the heating tank. This allows the film to be processed in a large amount at one time, and allows the collection device to be small in size.
  • the collection device of the present invention is preferably configured such that, in a case where the film has a lower sublimation point than the vapor-deposited film that is formed on the film, the heating tank is provided with an outlet.
  • the collection device of the present invention is preferably configured such that, in a case where the film has a higher sublimation point than the vapor-deposited film that is formed on the film, the heating tank is connected to a collecting section for collecting a sublimate from the vapor-deposited film that is formed on the film.
  • the film can be reused as it is.
  • the collection device of the present invention can be configured such that: the film is made of a material having greater photodegradability than a material of which the vapor-deposited film that is formed on the film is made; and the collection device includes a light irradiation process tank as the separating section.
  • the collection device of the present invention can be configured such that the microorganism-containing biodegradation tank includes a light irradiating section.
  • the present invention is applicable to a vapor deposition device and to a collection device for collecting vapor deposition materials.
US13/976,443 2010-12-27 2011-12-20 Deposition device, and collection device Abandoned US20130276701A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010291199 2010-12-27
JP201029199 2010-12-27
PCT/JP2011/079445 WO2012090774A1 (ja) 2010-12-27 2011-12-20 蒸着装置および回収装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/079445 A-371-Of-International WO2012090774A1 (ja) 2010-12-27 2011-12-20 蒸着装置および回収装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/091,187 Division US20140087450A1 (en) 2010-12-27 2013-11-26 Deposition device, and collection device
US14/298,844 Division US9365927B2 (en) 2010-12-27 2014-06-06 Deposition method and collection method

Publications (1)

Publication Number Publication Date
US20130276701A1 true US20130276701A1 (en) 2013-10-24

Family

ID=46382885

Family Applications (3)

Application Number Title Priority Date Filing Date
US13/976,443 Abandoned US20130276701A1 (en) 2010-12-27 2011-12-20 Deposition device, and collection device
US14/091,187 Abandoned US20140087450A1 (en) 2010-12-27 2013-11-26 Deposition device, and collection device
US14/298,844 Active 2032-04-17 US9365927B2 (en) 2010-12-27 2014-06-06 Deposition method and collection method

Family Applications After (2)

Application Number Title Priority Date Filing Date
US14/091,187 Abandoned US20140087450A1 (en) 2010-12-27 2013-11-26 Deposition device, and collection device
US14/298,844 Active 2032-04-17 US9365927B2 (en) 2010-12-27 2014-06-06 Deposition method and collection method

Country Status (4)

Country Link
US (3) US20130276701A1 (ja)
JP (1) JP5319022B2 (ja)
CN (1) CN103270187A (ja)
WO (1) WO2012090774A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBA20130034A1 (it) * 2013-04-30 2014-10-31 Mrs S R L Metodo per la pulizia di superfici in apparati di deposizione di film sottili da fase vapore e per il recupero del materiale rimosso
US20190040522A1 (en) * 2017-08-04 2019-02-07 Boe Technology Group Co., Ltd. Absorption shielding device and evaporation device having the same
US11251372B2 (en) 2018-01-09 2022-02-15 Hon Hai Precision Industry Co., Ltd. Vapor deposition source and method for making organic light-emitting diode display panel

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102036325B1 (ko) * 2013-02-13 2019-10-25 삼성디스플레이 주식회사 방착 유니트를 가지는 박막 증착 장치와, 이의 증착물을 제거하는 방법
JP5920533B2 (ja) * 2014-05-01 2016-05-18 横浜ゴム株式会社 空気入りタイヤ
KR102369314B1 (ko) * 2015-06-16 2022-03-04 삼성디스플레이 주식회사 증착 장치
CN105296927A (zh) * 2015-10-29 2016-02-03 云南汇恒光电技术有限公司 一种光学真空镀膜机内腔清洁方法
KR102536253B1 (ko) * 2016-03-29 2023-05-25 삼성디스플레이 주식회사 박막 증착 장치
CN106222617A (zh) * 2016-08-26 2016-12-14 武汉华星光电技术有限公司 用于镀膜设备的防着板结构及其制造方法、镀膜设备
CN106756834A (zh) * 2016-12-29 2017-05-31 深圳市华星光电技术有限公司 一种真空溅镀机防着板及其制备方法
CN106702319A (zh) * 2017-03-30 2017-05-24 京东方科技集团股份有限公司 一种蒸镀方法
CN107043919A (zh) * 2017-04-18 2017-08-15 合肥鑫晟光电科技有限公司 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备
CN107287559A (zh) * 2017-06-22 2017-10-24 深圳市华星光电技术有限公司 Oled蒸镀设备及其防粘板
CN107946164B (zh) * 2017-11-20 2019-09-27 深圳市华星光电技术有限公司 一种防着板及其制备方法和应用
CN109182968A (zh) * 2018-07-23 2019-01-11 北京铂阳顶荣光伏科技有限公司 附着物回收方法及装置、真空成膜系统
KR20220076341A (ko) * 2020-11-30 2022-06-08 캐논 톡키 가부시키가이샤 성막 장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5472509A (en) * 1993-11-30 1995-12-05 Neomecs Incorporated Gas plasma apparatus with movable film liners
US6179923B1 (en) * 1997-08-22 2001-01-30 Fuji Electric Co., Ltd. Deposition apparatus for an organic thin-film light-emitting element
US20080115729A1 (en) * 2006-11-16 2008-05-22 Yamagata Promotional Organization For Industrial Technology Evaporation source and vacuum evaporator using the same
US20090229524A1 (en) * 2006-07-03 2009-09-17 Yas Co., Ltd. Multiple Nozzle Evaporator for Vacuum Thermal Evaporation
US20100297349A1 (en) * 2009-05-22 2010-11-25 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus
US7914620B2 (en) * 2005-01-21 2011-03-29 Samsung Mobile Display Co., Ltd. Supporting device for heating crucible and deposition apparatus having the same
US20120202058A1 (en) * 2009-10-20 2012-08-09 Nitto Denko Corporation Pressure-sensitive adhesive sheet for surface protection
US20130236723A1 (en) * 2010-11-26 2013-09-12 Nitto Denko Corporation Polylactic acid-based film or sheet

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502158A (en) * 1988-08-08 1996-03-26 Ecopol, Llc Degradable polymer composition
JPH04236759A (ja) * 1991-01-19 1992-08-25 Hitachi Cable Ltd 蒸着装置
JPH05247628A (ja) * 1992-03-03 1993-09-24 Shin Etsu Chem Co Ltd 薄膜製造装置用部品の処理方法
US5366764A (en) * 1992-06-15 1994-11-22 Sunthankar Mandar B Environmentally safe methods and apparatus for depositing and/or reclaiming a metal or semi-conductor material using sublimation
JPH07289240A (ja) * 1993-06-30 1995-11-07 Kawasaki Heavy Ind Ltd 微細藻類の分離回収方法
JPH0841624A (ja) * 1994-07-28 1996-02-13 Tanaka Kikinzoku Kogyo Kk 蒸着用治具及び蒸着用治具の再生方法
HUT76967A (hu) * 1994-12-16 1998-01-28 Cytec Technology Corp. Eljárás szerves vegyületeket lebontó mikroorganizmusok előállítására
US5585272A (en) * 1994-12-16 1996-12-17 Cytec Technology Corporation Solid phase system for aerobic degradation
US5641679A (en) * 1994-12-16 1997-06-24 Cytec Technology Corporation Methods for bio-remediation
US5688685A (en) * 1994-12-16 1997-11-18 Cytec Technology Corporation System and methods for biodegradation of compounds
JP4059946B2 (ja) 1996-12-06 2008-03-12 株式会社アルバック 有機薄膜形成装置及び有機材料の再利用方法
JPH10286566A (ja) * 1997-04-15 1998-10-27 Masayuki Nakaya 汚水浄化システム
JP2002190389A (ja) 2000-12-22 2002-07-05 Nippon Steel Chem Co Ltd 有機ｅｌ素子の製造方法及び装置
JP2002292346A (ja) 2001-03-29 2002-10-08 Sharp Corp 付着膜回収装置および付着膜の回収方法
JP2005149924A (ja) * 2003-11-17 2005-06-09 Toray Ind Inc 蒸着装置および蒸着材料の回収・再利用方法並びに有機電界発光装置の製造方法。
US20070148337A1 (en) 2005-12-22 2007-06-28 Nichols Jonathan A Flame-perforated aperture masks
JP2008088465A (ja) 2006-09-29 2008-04-17 Seiko Epson Corp 蒸着装置および有機エレクトロルミネッセンス装置の製造方法
JP2008127642A (ja) 2006-11-22 2008-06-05 Toppan Printing Co Ltd 蒸着装置及び蒸着材料の再生方法
JP2008223102A (ja) 2007-03-14 2008-09-25 Seiko Epson Corp 蒸着装置、および蒸着方法
MY152678A (en) * 2008-04-30 2014-10-31 Ulvac Inc Water-reactive al composite material for thermal spray, water-reactive thermally sprayed al film, process for the production of the thermally sprayed al film, and constituent member for film-forming chamber
US8808619B2 (en) 2008-04-30 2014-08-19 Ulvac, Inc. Water-reactive Al composite material, water-reactive Al film, process for the production of the Al film, and constituent member for film-forming chamber
US8715404B2 (en) 2008-04-30 2014-05-06 Ulvac, Inc. Water-reactive Al composite material, water-reactive Al film, process for the production of the Al film, and constituent member for film-forming chamber
SG189755A1 (en) * 2008-04-30 2013-05-31 Ulvac Inc Method for the production of water-reactive al film and constituent member for film-forming chamber
KR20110138259A (ko) * 2009-03-25 2011-12-26 비코 인스트루먼츠 인코포레이티드 고증기압재료의 증착
US8696815B2 (en) * 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101174874B1 (ko) * 2010-01-06 2012-08-17 삼성디스플레이 주식회사 증착 소스, 박막 증착 장치 및 유기 발광 표시 장치 제조 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5472509A (en) * 1993-11-30 1995-12-05 Neomecs Incorporated Gas plasma apparatus with movable film liners
US6179923B1 (en) * 1997-08-22 2001-01-30 Fuji Electric Co., Ltd. Deposition apparatus for an organic thin-film light-emitting element
US7914620B2 (en) * 2005-01-21 2011-03-29 Samsung Mobile Display Co., Ltd. Supporting device for heating crucible and deposition apparatus having the same
US20090229524A1 (en) * 2006-07-03 2009-09-17 Yas Co., Ltd. Multiple Nozzle Evaporator for Vacuum Thermal Evaporation
US20080115729A1 (en) * 2006-11-16 2008-05-22 Yamagata Promotional Organization For Industrial Technology Evaporation source and vacuum evaporator using the same
US20100297349A1 (en) * 2009-05-22 2010-11-25 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus
US20120202058A1 (en) * 2009-10-20 2012-08-09 Nitto Denko Corporation Pressure-sensitive adhesive sheet for surface protection
US20130236723A1 (en) * 2010-11-26 2013-09-12 Nitto Denko Corporation Polylactic acid-based film or sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBA20130034A1 (it) * 2013-04-30 2014-10-31 Mrs S R L Metodo per la pulizia di superfici in apparati di deposizione di film sottili da fase vapore e per il recupero del materiale rimosso
US20190040522A1 (en) * 2017-08-04 2019-02-07 Boe Technology Group Co., Ltd. Absorption shielding device and evaporation device having the same
US11251372B2 (en) 2018-01-09 2022-02-15 Hon Hai Precision Industry Co., Ltd. Vapor deposition source and method for making organic light-emitting diode display panel
US11800779B2 (en) 2018-01-09 2023-10-24 Hon Hai Precision Industry Co., Ltd. Vapor deposition source and method for making organic light-emitting diode display panel

Also Published As

Publication number Publication date
WO2012090774A1 (ja) 2012-07-05
US20140299058A1 (en) 2014-10-09
CN103270187A (zh) 2013-08-28
JPWO2012090774A1 (ja) 2014-06-05
JP5319022B2 (ja) 2013-10-16
US20140087450A1 (en) 2014-03-27
US9365927B2 (en) 2016-06-14

Similar Documents

Publication Publication Date Title
US9365927B2 (en) Deposition method and collection method
KR100995109B1 (ko) 제조장치
KR100945469B1 (ko) 제조 시스템, 제조방법, 제조장치의 조작방법 및 발광장치
KR101305847B1 (ko) 증착 장치 및 증착 방법
JP5285187B2 (ja) 蒸着装置及び蒸着方法
US20130239891A1 (en) Deposition apparatus and recovery apparatus
JP6087267B2 (ja) 蒸着装置、蒸着方法、及び、有機エレクトロルミネッセンス素子の製造方法
JP5042195B2 (ja) 蒸着マスクの洗浄装置および洗浄方法
US9614155B2 (en) Vapor deposition apparatus, vapor deposition method, and method for producing organic electroluminescent element
US9290842B2 (en) Electrode cover and evaporation device
JP2004217970A (ja) 製造装置、クリーニング方法、および再利用方法
JP5336006B2 (ja) 成膜材料の回収方法
JP2003313655A (ja) 製造装置
JP2010251282A (ja) 発光装置の再生産方法および発光装置の再生産装置
KR100666534B1 (ko) 레이져 전사방법을 사용하는 대면적 유기박막 증착장치
WO2012090772A1 (ja) 蒸着装置、削具および蒸着材料の回収方法
US9831471B2 (en) Method for producing organic electroluminescent display panel
JP2009277510A (ja) 有機発光素子の製造方法及び成膜装置
KR20150068022A (ko) 유기물 증착용 마스크 및 이를 포함하는 유기물 증착 장치
WO2005117498A1 (ja) 有機ｅｌ素子の製造方法および有機ｅｌ素子製造装置の洗浄方法
JP2004095423A (ja) 有機エレクトロルミネセンス発光デバイスの製造方法、及びコンテナ
KR20040072279A (ko) 유기 이.엘. 용 마스크 세정장치

Legal Events

Date Code Title Description
AS Assignment

Owner name: SHARP KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SONODA, TOHRU;KAWATO, SHINICHI;INOUE, SATOSHI;AND OTHERS;SIGNING DATES FROM 20130531 TO 20130603;REEL/FRAME:030694/0364

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION