Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
  • C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
  • C07C381/12—Sulfonium compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
  • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
  • Y10S430/1055—Radiation sensitive composition or product or process of making
  • Y10S430/106—Binder containing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
  • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
  • Y10S430/1055—Radiation sensitive composition or product or process of making
  • Y10S430/114—Initiator containing
  • Y10S430/115—Cationic or anionic

Definitions

• This invention relates to novel onium salts and positive resist materials using the same and, more particularly, to novel onium salts suitable for positive resist materials of the type which are highly sensitive to high energy radiations, such as deep ultraviolet rays (DUV), electron beams and X-rays, developable with an aqueous alkali solution and well suited for fine processing technology, and to positive resist materials using said onium salts.
• high energy radiations such as deep ultraviolet rays (DUV), electron beams and X-rays
• DUV deep ultraviolet
• DUV lithography can achieve 0.1-0.3 ⁇ m resolutions in the imaging process, and can provide a pattern having effectively vertical walls with respect to the substrate if a resist having a low optical absorbance is used. Moreover, as this technology makes it possible to transfer a pattern in one operation, it offers a higher throughput than electron beam lithography.
• negative resist materials When used in the manufacturing process of LSI, they can serve for wiring and gate forming processes in the LSI production, but it is difficult for them to form contact holes because fine processing techniques are required therein.
• the onium salt used therein contains antimony as a metal component, so that the substrate is contaminated with the antimony.
• the resist material recited above suffers from a very great change with the lapse of time after irradiation with DUV or the like.
• the foregoing resist material tends to undergo positive to negative inversion when exposed to deep ultraviolet rays, electron beams or X-rays.
• the two-component positive resist materials as recited above which are constituted of a resin, whose OH groups are protected with certain groups, and an acid generator, it is necessary to decompose many of the protected groups in order to render the resist soluble in a developer.
• the decomposition involves a considerably high risk of film thickness variations, in-film stress or air bubbles in the process of LSI production.
• the three-component resist system consists of an alkali-soluble resin, a dissolution inhibitor and an acid generator.
• the resist material RAY/PF (produced by Hoechst AG.), which contains a novolak resin, an acetal compound as a dissolution inhibitor and an acid generator, has been developed for X-ray lithography.
• the resist sensitivity thereof closely depends on the time elapsed from the explore to X-rays till the development, because the resist material RAY/PF undergoes chemical amplification at room temperature. Accordingly, it is necessary to systematically perform strict control of that time. In actual practice, however, it is not easy to strictly regulate the time between the exposure and developing steps. That material cannot therefore ensure dimensional stability to the patterns formed therein. In addition, it has another disadvantage in that its optical absorbance at the wavelength of KrF excimer laser beam (248 nm) is so high that it is unsuitable for the lithography using that laser.
• PEB post-exposure baking
• the decomposition reaction of t-butoxycarbonyloxy group does not require any water. More specifically, two components alone, namely, t-butoxycarbonyloxy group and an acid as catalyst, take part in the progress of the reaction. Therefore, the decomposition reaction is more suitable for chemical amplification.
• Schlegel et al have reported a three-component positive resist material consisting of a novolak resin, t-butoxycarbonyl protected bisphenol A as dissolution inhibitor and pyrogallol methanesulfonic acid ester (37th Oyoo Butsuri Gakkai Kanren Rengo Koenkai, Spring 1990, 28p-ZE-4).
• Such a resist material is, however, difficult of practical use, because the novolak resin has high optical absorbance.
• the foregoing resist material contains not only the novolak resin having high optical absorbance but also the metal, it is not suitable for practical application.
• Typical examples of such an acid generator include (C 6 H 5 ) 3 S + ⁇ O 3 SCF 3 , (C 6 H 5 ) 3 S + ⁇ PF 6 , (C 6 H 5 ) 3 S + ⁇ SbF 6 , (C 6 H 5 SC 6 H 4 )(C 6 H 6 ) 2 S + ⁇ O 3 SCF 3 , CH 3 OC 6 H 6 (C 6 H 5 ) 2 S + ⁇ OSO 2 CF 3 , and so on.
• substituted or unsubstituted triphenylsulfonium compounds have a characteristic such that they are decomposed by irradiation with high energy beams, including ultraviolet rays and electron beams, to produce acids.
• high energy beams including ultraviolet rays and electron beams
• these compounds have so far been used widely, e.g., as a photopolymerization initiator in cation polymerization, a photocuring agent for epoxy resins, an acid generator for photoresists, and so on.
• triphenylsulfonium compounds When hitherto used triphenylsulfonium compounds are incorporated as a constituent of resist materials, they can lower the solubility of the resists in aqueous alkali solutions and further can inhibit the resist film frowns thinning upon development, because they themselves are soluble in oils.
• the resist materials using the triphenylsulfonium compounds suffer from disadvantages of (1) not securing sufficient sensitivity, (2) providing low resolution, (3) being apt to forming a slightly soluble layer at the resist surface, (4) having insufficient etchability, and so on.
• a first object of the present invention is to provide novel onium salts suitable for an acid generator of positive resist materials.
• a second object of the present invention is to provide positive resist materials for high energy radiation lithography which have higher performance than ever with respect to sensitivity, resolution and process suitability.
• R's may be the same or different, each being an aryl group, provided that at least one of R's is a t-alkoxy substituted phenyl group; and M is an anion capable of forming the sulfonium salts.
• the aryl group represented by R includes phenyl, 3-methylphenyl, 4-methylphenyl, 4-isopropylphenyl, 4t-butylphenyl, 4-fluorophenyl, 3-fluorophenyl, 4-chlorophenyl, 2-methoxyphenyl, 3-methoxyphenyl, 4-methoxyphenyl, 4-phenoxyphenyl, 4-phenylthiophenyl 3-trifluoromethylphenyl, 4-trifluoromethylphenyl and like groups.
• the anion represented by M in general formula (I) may be a anion so far as it is free from a nucleophilic property.
• Specific examples of such an anion include hexafluorophosphate, hexafluoroantimonate, hexafluoroarsenate, trifluoromethanesulfonate, paratoluenesulfonate, tetrafluoroborate, fluorosulfonate and like ions.
• trifluoromethanesulfonate abbreviated as “triflate” hereinafter
• paratoluenesulfonate abbreviated as “tosylate” hereinafter
• R 1 represents a tertiary lower alkyl group
• R 2 represents a lower alkyl group or an alkoxy group
• R 1 be a t-butyl group and R 2 be a methyl, ethyl, methoxy or ethoxy group.
• a tertiary butoxy-substituted triphenylsulfonium salt can be prepared by allowing tertiary butoxy-substituted phenyl Grignard reagent to react with a substituted or substituted diphenylsulfoxide, preferably in the presence of trimethylsilyl triflate. Additionally, the foregoing tertiary butoxy-substituted Grignard reagent can be easily prepared, e.g., using metallic magnesium, tetrahydrofuran and tertiary butoxy-substituted bromobenzene in accordance with a method.
• substituted diphenylsulfoxide which can be used include p-methylphenylsulfoxide, p-t-butylphenylsulfoxide, p-methoxyphenylsulfoxide, and the like.
• the substituted or unsubstituted diphenylsulfoxide and the tertiary butoxy-substituted phenyl Grignard reagent be used in a ratio of 1:0.8 to 1:1.2 by mole, and trimethylsilyl triflate be used in an amount equimolar to the Grignard reagent.
• the reaction process comprises, in succession, cooling, e.g., diphenylsulfoxide dissolved in methylene chloride to a temperature raging from ⁇ 30° C. to ⁇ 70° C., stirring the solution while keeping it at a temperature below ⁇ 30° C., thereto adding dropwise trimethylsilyl triflate, raising the temperature of the thus obtained solution up to 0 ⁇ 10° C., allowing it to stand for about 30 minutes, cooling it again down to ⁇ 30 ⁇ 70° C., thereto adding dropwise tertiary butoxy-substituted phenyl Grignard reagent while keeping the resulting solution at a temperature below ⁇ 30° C., raising the temperature of the mixture up to 0 ⁇ 10° C. after the completion of the addition, and continuing the stirring for additional 10 to 180 minutes at that temperature.
• cooling e.g., diphenylsulfoxide dissolved in methylene chloride
• stirring the solution while keeping it at a temperature below ⁇ 30
• the onium salts of the present invention although they themselves have low solubility in water, can provide photolysis products having high solubility in water. Accordingly, when used as acid generator of a photoresist, these salts can ensure a great dissolution contrast between the areas irradiated and unirradiated with light. Thus, the present onium salts bring about improvements in resist image characteristics including resolution and focus depth when applied to positive resist materials using poly(hydroxystyrene)'s.
• the triphenylsulfonium salts in which at least one phenyl group is substituted with a tertiary alkoxy group can readily produce phenol derivatives since the alkoxy substituent therein can be efficiently decomposed by the action of acids produced by photolysis of said salts, thereby achieving a great dissolution contrast. Therefore, the present onium salts can exhibit their excellent effect as acid generator for the positive resist materials of chemical amplification type, and can contribute to the formation of resist images having high resolution and a wide range of focus depth.
• the onium salt as the foregoing component (c) is any of the present onium salts represented by general formula, (R) 3 S + M, already described in detail.
• the introduction rate of t-butoxycarbonyl groups be in the range of 10 to 50%.
• the solubility of the resin in an aqueous alkali solution is lowered. Therefore, the resulting resist material has lowered sensitivity when developed with a conventional developer.
• the introduction rate is below 10%, on the other hand, the resulting resin cannot have a great dissolution-inhibiting effect.
• the replacement of the hydrogen atoms in hydroxy groups with t-butoxycarbonyl groups can be effected by a method for protecting functional groups, which is often used in peptide synthesis. Specifically, the protection can be simply performed by reacting a poly(hydroxystyrene) with di-t-butyl dicarbonate in the pyridine solution thereof.
• the poly(hydroxystyrene) resin have a weight average molecular weight of at least 10,000 from the viewpoint of the heat resistance of the resist film formed and, what is more, be a monodisperse system with respect to molecular weight distribution from the standpoint of the precision of the pattern formed.
• a resist material using a poly(hydroxystyrene) obtained by living polymerization (e.g., one which has a molecular weight of 10,000 and a molecular weight distribution of 1.1) can form a 0.2 ⁇ m line and space pattern with no sloping at the base and with high precision. Moreover, the formed pattern has satisfactory heat resistance, because no deformation is caused therein by 10 minutes baking at 150° C.
• a monodisperse polymer as used herein means a polymer which is a monodisperse system in terms of its molecular weight distribution, that is, 1.05 ⁇ Mw/Mn ⁇ 1.50.
• Mw stands for the weight average molecular weight of a polymer
• Mn the number average molecular weight.
• the polymer prepared by living polymerization its weight average molecular weight can easily be calculated from the weight of the monomer used and the mole number of the polymerization initiator used, or can be determined by a light scattering method. The number average molecular weight thereof can easily be measured with a membrane osmometer.
• the molecular weight distribution can be evaluated by Gel Permeation Chromatography (GPC), and the molecular structure can easily be ascertained with the infrared absorption (IR) or 1 H-NMR spectrum.
• GPC Gel Permeation Chromatography
• a monodisperse resin (or polymer) can be obtained (1) through the fractionation treatment of a product prepared using a radical polymerization method, which thus has a broad molecular weight distribution, or (2) by adopting a living polymerization method.
• the living polymerization method is preferred because the process for rendering the product monodisperse is simple.
• Such a protecting group include tertiary butyl, dimethylphenylcarbinyldimethylsilyl, tertiary butoxycarbonyl, tetrahydropyranyl and tertiary butyldimethylsilyl groups.
• Suitable examples of such an organometallic compound include organic alkali metal compounds such as n-butyl lithium, sec-butyl lithium, t-butyl lithium, sodium naphthalene, sodium anthracene, disodium ⁇ -methylstyrene tetramer, cumyl potassium and cumyl cesium.
• organic alkali metal compounds such as n-butyl lithium, sec-butyl lithium, t-butyl lithium, sodium naphthalene, sodium anthracene, disodium ⁇ -methylstyrene tetramer, cumyl potassium and cumyl cesium.
• This organic solvent can be an aromatic hydrocarbon, a cyclic ether or an aliphatic hydrocarbon, with specific examples including benzene, toluene, tetrahydrofuran, dioxane, tetrahydropyran, dimethoxyethane, n-hexane and cyclohexane.
• organic solvents may be used alone or as a mixture of two or more thereof.
• tetrahydrofuran it is advantageous to use tetrahydrofuran as the solvent.
• the suitable concentration of a monomer in the polymerization reaction is in the range of 1 to 50 wt %, particularly 1 to 30 wt %.
• the reaction is performed with stirring under high vacuum or in an atmosphere of inert gas such as argon or nitrogen.
• the reaction temperature can be chosen freely in a range extending from ⁇ 100° C. to the boiling point of the organic solvent used. However, it is advantageous to choose the reaction temperature from the range of ⁇ 78° C. to 0° C. when tetrahydrofuran is used as solvent, while room temperature is preferred as the reaction temperature when benzene is used as solvent.
• the polymerization reaction is terminated by adding a terminator such as methanol, water or methyl bromide to the reaction system, thereby obtaining a living polymer having the desired molecular weight.
• a terminator such as methanol, water or methyl bromide
• the living polymerization 100% of monomer molecules take part in the reaction, so that the yield rate of the polymer produced is approximately 100%.
• the molecular weight of the living pole can be adjusted to a desired one by properly controlling the amount of the monomer used and the mole number of the reaction initiator.
• the molecular weight distribution of the thus obtained living polymer is monodisperse (1.05 ⁇ Mw/Mn ⁇ 1.50).
• the removal of the protecting groups can easily be achieved by dissolving the obtained living polymer in a solvent such as dioxane, acetone, acetonitrile, benzene or a mixture of two or more thereof, and then by adding dropwise an acid such as hydrochloric acid, hydrobromic acid, paratoluenesulfonic acid, etc.
• a solvent such as dioxane, acetone, acetonitrile, benzene or a mixture of two or more thereof, and then by adding dropwise an acid such as hydrochloric acid, hydrobromic acid, paratoluenesulfonic acid, etc.
• the main chain of the polymer is not cleaved, and intermolecular cross-linking reactions do not occur. Accordingly, the poly(p-hydroxystyrene) obtained is still a monodisperse system.
• a dissolution inhibitor which can be used as the present component (b) is a material capable of having solubility in an aqueous alkali solution when the resist film is irradiated with high energy beams, such as deep ultraviolet rays, subjected to a thermal treatment, if needed, and then developed with an alkali developer.
• a dissolution inhibitor examples include t-butoxycarboxyl-protected phenols such as di-t-butoxcarbonylhydroquinone, 4,4′-di-t-butoxycarbonyloxydiphenyl, di-t-butoxycarbonylbisphenol A, di-t-butoxycarbonylbisphenol F, etc.; bile acid derivatives such as cholic acid t-butyl ester, deoxycholic acid t-butyl ester, etc.; and esters protected with tetxahydropyranyl, methoxmethyl, t-butyl, t-amyl or the like, such a 4-t-butoxycarbonylbiphenyl, di-t-butoxyacetylbisphenol A, etc.
• the invention should not be construed as being limited to those examples.
• the content of the dissolution inhibitor in the present resist material is desirably in the range of 7 to 40 wt %. When the content is less than 7 wt %, the dissolution inhibiting effect is small; while when it is greater than 40 wt %, the mechanical strength and heat resistance of the resist film decline.
• the content of an onium salt in the present resist material is preferably in the range of 0.5 to 15 wt %.
• the content is less than 0.5 wt %, the resist material cannot have improved sensitivity; while the contents greater than 15 wt % cause not only an increase in production cost of the resist material but also a decrease in mechanical strength of the resist film.
• Forming patterns on a substrate using the present resist materials can be performed with ease in the following manner:
• a solution of the present resist material is spin-coated on a substrate, and then prebaked to prepare a coated substrate.
• the coated substrate is irradiated with high energy beams.
• the onium salt (acid generator) in the coating is decomposed to produce an acid.
• a thermal treatment (PEB) is performed, and thereby is caused the decomposition of the t-butoxycarbonyloxy groups as the produced acid acts as a catalyst.
• the decomposed groups have no longer the resist dissolution inhibiting effect.
• a latent image is formed on the substrate.
• the substrate having the latent image thereon is then developed with an aqueous alkali solution, and rinsed with water to provide a positive-tone pattern.
• the onium salts of the present invention are highly compatible with solvents used in coating resist materials, poly(hydroxystyrene) resins and dissolution inhibitors because of their low solubility in water, thereby ensuring the uniform resist film formation;: and (2) since the onium salts are converted to water-soluble compounds and produce acids when irradiated with light and the produced acids decompose the t-butoxycarbonyloxy groups contained in the resins to yield phenolic hydroxy groups, the area irradiated with light comes to have a great dissolution speed in an aqueous alkali solution although the area unirradiated with light retains excellent dissolution inhibiting effect.
• the present onium salts which can fulfil their excellent functions as acid generator in chemically amplified positive resists are used in the present positive resist materials. Therefore, the present positive resist materials have high sensitivity to high energy radiation, particularly to deep ultraviolet rays with shorter wavelengths (e.g., KrF excimer laser). Moreover, they have small absorbance in the deep ultraviolet region described above. Further, their plasma etching resistance is high and the resist patterns formed therein have excellent heat-resisting property. Therefore, the present resist materials can form resist images with high resolution and a wide range of focus depth, and they are well suited for fine processing of the substrates used for LSI and the like.
• the present positive resist materials have high sensitivity to high energy radiation, particularly to deep ultraviolet rays with shorter wavelengths (e.g., KrF excimer laser). Moreover, they have small absorbance in the deep ultraviolet region described above. Further, their plasma etching resistance is high and the resist patterns formed therein have excellent heat-resisting property. Therefore, the present resist materials can form resist
• the positive resist materials of the present invention have resist characteristics slightly depending on the time lapsed after irradiation, and require no water in the chemical amplification process.
• the present resist materials are extremely suitable for the fine processing of substrates for LSI and the like by high energy-radiation lithography.
• the temperature of the reaction system was changed to 0-5° C. by replacing the dry ice-methanol bath with an ice-water bath, and the reaction was continued for 30 minutes with stirring.
• reaction temperature was changed again to 0-5° C. by replacing the bath with a ice-water bath, and the stirring was continued for additional 30 minutes to finish the reaction.
• the base resin used herein was a poly(p-hydroxystyrene) resin having a t-butoxycarbonyl group-introduction degree of 20 mole %, a molecular weight of 10,000 and a molecular weight distribution (Mw/Mn) of 1.05.
• PEB heat treatment
• the resulting coating was developed with a 2.4% aqueous solution of tetramethylammonium hydroxide (TMAH) for 1 minute, and then rinsed with water for 30 seconds, thereby forming a pattern on the silicon substrate (patterned substrate).
• TMAH tetramethylammonium hydroxide
• the thus formed pattern on the substrate showed positive-tone characteristics, and the D o sensitivity of the resist film was 40 mJ/cm 2 .
• Example 2 In accordance with the procedures adopted in Example 2, patterned substrates were produced respectively using resist solutions prepared in the same manner as in Example 2, except that the onium salts set forth in Table 1 were used respectively as acid generator in place of p-t-butoxytriphenylsulfonium triflate, and examined for D o sensitivity and resolution. The thus evaluated D o sensitivities are shown in Table 2. Additionally, each of the patterns formed herein had resolution equivalent to those achieved in Example 2.
• patterned substrates were produced respectively using resist solutions prepared in the same manner as in Example 2, except that the base resins set forth in Table 3 were used respectively in place of the base resin used in Example 2, the dissolution inhibitors set forth in Table 4 were used respectively in place of the dissolution inhibitor used in Example 2 and the acid generators used in Examples 3 to 7 (set forth in Table 1) were used respectively in place of p-t-butoxytriphenylsulfonium triflate, and examined for D o sensitivity and resolution. The thus evaluated D o sensitivities are shown in Table 5. Additionally, the resolutions achieved herein were more or less different from one another, but all the line-and-space pattern had the resolution of 0.3 ⁇ m.

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• Spectroscopy & Molecular Physics (AREA)
• Materials For Photolithography (AREA)
• Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Compositions Of Macromolecular Compounds (AREA)

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• 1993
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