US20020177000A1 - Surface treatment of polyimide film and polyimide film having a thin metal layer - Google Patents

Surface treatment of polyimide film and polyimide film having a thin metal layer Download PDF

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Publication number
US20020177000A1
US20020177000A1 US10/108,631 US10863102A US2002177000A1 US 20020177000 A1 US20020177000 A1 US 20020177000A1 US 10863102 A US10863102 A US 10863102A US 2002177000 A1 US2002177000 A1 US 2002177000A1
Authority
US
United States
Prior art keywords
polyimide film
metal layer
polyimide
layer
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/108,631
Other languages
English (en)
Inventor
Shozo Katsuki
Toshihiko Anno
Osamu Nakayama
Hiroaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Assigned to UBE INDUSTRIES, LTD. reassignment UBE INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANNO, TOSHIHIKO, KATSUKI, SHOZO, NAKAYAMA, OSAMU, YAMAGUCHI, HIROAKI
Publication of US20020177000A1 publication Critical patent/US20020177000A1/en
Priority to US10/681,179 priority Critical patent/US6824827B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
US10/108,631 2001-03-29 2002-03-29 Surface treatment of polyimide film and polyimide film having a thin metal layer Abandoned US20020177000A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/681,179 US6824827B2 (en) 2001-03-29 2003-10-09 Method of making a polyimide film having a thin metal layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001096253A JP4491986B2 (ja) 2001-03-29 2001-03-29 表面処理方法および金属薄膜を有するポリイミドフィルム
JP2001-96253 2001-03-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/681,179 Division US6824827B2 (en) 2001-03-29 2003-10-09 Method of making a polyimide film having a thin metal layer

Publications (1)

Publication Number Publication Date
US20020177000A1 true US20020177000A1 (en) 2002-11-28

Family

ID=18950185

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/108,631 Abandoned US20020177000A1 (en) 2001-03-29 2002-03-29 Surface treatment of polyimide film and polyimide film having a thin metal layer
US10/681,179 Expired - Lifetime US6824827B2 (en) 2001-03-29 2003-10-09 Method of making a polyimide film having a thin metal layer

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/681,179 Expired - Lifetime US6824827B2 (en) 2001-03-29 2003-10-09 Method of making a polyimide film having a thin metal layer

Country Status (4)

Country Link
US (2) US20020177000A1 (ko)
JP (1) JP4491986B2 (ko)
KR (1) KR100818483B1 (ko)
TW (1) TW537967B (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030212243A1 (en) * 2002-04-05 2003-11-13 Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3',4'-biphenyltetracarboxylic dianhydride and aromatic diamines
US20080299402A1 (en) * 2005-06-03 2008-12-04 Mitsui Chemicals, Inc. Polyimide film, polyimide metal laminate and process for producing the same
US20090280339A1 (en) * 2005-04-08 2009-11-12 Mitsui Chemicals ,Inc. Polyimide film, polyimide metal laminate using same, and method for manufacturing same
US8487191B2 (en) 2008-12-26 2013-07-16 Jx Nippon Mining & Metals Corporation Flexible laminate and flexible electronic circuit board formed by using the same
US9765429B2 (en) 2013-09-04 2017-09-19 President And Fellows Of Harvard College Growing films via sequential liquid/vapor phases
US10149394B2 (en) 2014-01-22 2018-12-04 Ube Industries, Ltd. Method for forming conductor layer, and method for producing multilayer wiring substrate using same
US11426976B2 (en) 2019-10-02 2022-08-30 Sumitomo Metal Mining Co., Ltd. Copper-clad laminate

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* Cited by examiner, † Cited by third party
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JPWO2004050352A1 (ja) * 2002-12-05 2006-03-30 株式会社カネカ 積層体、プリント配線板およびそれらの製造方法
TWI341859B (en) * 2003-05-09 2011-05-11 Mitsubishi Gas Chemical Co Adhesive and adhesive film
JP2005025514A (ja) * 2003-07-02 2005-01-27 Fcm Kk アンテナ内蔵非接触型ｉｃカード用の導電性シートおよびアンテナ内蔵非接触型ｉｃカード
JP2005041049A (ja) * 2003-07-25 2005-02-17 Ube Ind Ltd 広幅銅張り積層基板
WO2005051652A1 (ja) * 2003-11-26 2005-06-09 Dowa Mining Co., Ltd. 金属被覆基板及びその製造方法
KR100591068B1 (ko) * 2004-09-03 2006-06-19 주식회사 코오롱 플렉시블 동박 폴리이미드 적층판 및 그 제조방법
KR100845534B1 (ko) * 2004-12-31 2008-07-10 엘지전자 주식회사 전도성 금속 도금 폴리이미드 기판 및 그 제조 방법
JP4692096B2 (ja) * 2005-02-22 2011-06-01 日立化成工業株式会社 配線板の製造方法及び配線板
KR100721430B1 (ko) * 2005-10-12 2007-05-23 학교법인 포항공과대학교 나노다공성 멤브레인 및 이의 제조방법
KR100752780B1 (ko) * 2005-12-17 2007-08-29 (주) 플라즈닉스 폴리이미드 금속 적층체의 제조 방법 및 이로 인한 폴리이미드 금속 적층체
JP4872466B2 (ja) * 2006-06-01 2012-02-08 東洋紡績株式会社 金属化ポリイミドフィルムとその製造方法
KR100863264B1 (ko) * 2007-06-29 2008-10-15 한국기계연구원 정밀습식도금공정을 이용한 연성동박적층필름의 제조방법
US20090074615A1 (en) * 2007-09-17 2009-03-19 Ysi Incorporated Microfluidic module including an adhesiveless self-bonding rebondable polyimide
US7955485B2 (en) * 2008-07-17 2011-06-07 William Kent Gregory Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
JP5201152B2 (ja) * 2010-01-04 2013-06-05 宇部興産株式会社 表面処理方法および金属薄膜を有するポリイミドフィルム
US8784993B2 (en) * 2010-12-15 2014-07-22 General Electric Company High temperature high frequency magnet wire and method of making
JP5311070B2 (ja) * 2010-08-25 2013-10-09 住友金属鉱山株式会社 金属化ポリイミドフィルム、およびその評価方法
CN105463376B (zh) * 2015-12-08 2018-11-27 云南云天化股份有限公司 具有过渡结合层的聚酰亚胺覆金属薄膜及其制备方法
KR102347589B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 그 제조방법
CN115260562B (zh) * 2022-08-19 2023-03-28 广东工业大学 一种具有导电性的亲水聚酰亚胺的制备方法及其应用

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030212243A1 (en) * 2002-04-05 2003-11-13 Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3',4'-biphenyltetracarboxylic dianhydride and aromatic diamines
US6958192B2 (en) 2002-04-05 2005-10-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and aromatic diamines
US20090280339A1 (en) * 2005-04-08 2009-11-12 Mitsui Chemicals ,Inc. Polyimide film, polyimide metal laminate using same, and method for manufacturing same
US20080299402A1 (en) * 2005-06-03 2008-12-04 Mitsui Chemicals, Inc. Polyimide film, polyimide metal laminate and process for producing the same
US8487191B2 (en) 2008-12-26 2013-07-16 Jx Nippon Mining & Metals Corporation Flexible laminate and flexible electronic circuit board formed by using the same
US9765429B2 (en) 2013-09-04 2017-09-19 President And Fellows Of Harvard College Growing films via sequential liquid/vapor phases
US10149394B2 (en) 2014-01-22 2018-12-04 Ube Industries, Ltd. Method for forming conductor layer, and method for producing multilayer wiring substrate using same
US11426976B2 (en) 2019-10-02 2022-08-30 Sumitomo Metal Mining Co., Ltd. Copper-clad laminate

Also Published As

Publication number Publication date
TW537967B (en) 2003-06-21
KR100818483B1 (ko) 2008-04-01
US20040076765A1 (en) 2004-04-22
US6824827B2 (en) 2004-11-30
JP2002293965A (ja) 2002-10-09
KR20020077188A (ko) 2002-10-11
JP4491986B2 (ja) 2010-06-30

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AS Assignment

Owner name: UBE INDUSTRIES, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KATSUKI, SHOZO;ANNO, TOSHIHIKO;NAKAYAMA, OSAMU;AND OTHERS;REEL/FRAME:012744/0262

Effective date: 20020312

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION