UA75379C2 - Integrated circuit protected against unauthorized access and a method for producing the integral circuit - Google Patents

Integrated circuit protected against unauthorized access and a method for producing the integral circuit Download PDF

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Publication number
UA75379C2
UA75379C2 UA2003054669A UA2003054669A UA75379C2 UA 75379 C2 UA75379 C2 UA 75379C2 UA 2003054669 A UA2003054669 A UA 2003054669A UA 2003054669 A UA2003054669 A UA 2003054669A UA 75379 C2 UA75379 C2 UA 75379C2
Authority
UA
Ukraine
Prior art keywords
tracks
level
integrated
circuit
microcircuit
Prior art date
Application number
UA2003054669A
Other languages
English (en)
Ukrainian (uk)
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of UA75379C2 publication Critical patent/UA75379C2/uk

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07363—Means for preventing undesired reading or writing from or onto record carriers by preventing analysis of the circuit, e.g. dynamic or static power analysis or current analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Computer Security & Cryptography (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
UA2003054669A 2000-11-23 2001-08-11 Integrated circuit protected against unauthorized access and a method for producing the integral circuit UA75379C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10058078A DE10058078C1 (de) 2000-11-23 2000-11-23 Integrierte Schaltungsanordnung mit Analysierschutz und Verfahren zur Herstellung der Anordnung
PCT/DE2001/004198 WO2002043147A1 (de) 2000-11-23 2001-11-08 Integrierte schaltungsanordnung mit analysierschutz und verfahren zur herstellung der anordnung

Publications (1)

Publication Number Publication Date
UA75379C2 true UA75379C2 (en) 2006-04-17

Family

ID=7664330

Family Applications (1)

Application Number Title Priority Date Filing Date
UA2003054669A UA75379C2 (en) 2000-11-23 2001-08-11 Integrated circuit protected against unauthorized access and a method for producing the integral circuit

Country Status (11)

Country Link
US (1) US7288786B2 (ja)
EP (1) EP1336201B1 (ja)
JP (1) JP2004514299A (ja)
KR (1) KR100515555B1 (ja)
CN (1) CN100359684C (ja)
BR (1) BR0115535A (ja)
DE (1) DE10058078C1 (ja)
MX (1) MXPA03004572A (ja)
RU (1) RU2263372C2 (ja)
UA (1) UA75379C2 (ja)
WO (1) WO2002043147A1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10218096A1 (de) * 2002-04-23 2003-11-13 Infineon Technologies Ag Integrierte Schaltung
DE10223176B3 (de) 2002-05-24 2004-01-22 Infineon Technologies Ag Integrierte Schaltung mit sicherheitskritischen Schaltungskomponenten
US7049667B2 (en) 2002-09-27 2006-05-23 Hrl Laboratories, Llc Conductive channel pseudo block process and circuit to inhibit reverse engineering
US6924552B2 (en) * 2002-10-21 2005-08-02 Hrl Laboratories, Llc Multilayered integrated circuit with extraneous conductive traces
DE10337256A1 (de) * 2002-11-21 2004-06-09 Giesecke & Devrient Gmbh Integrierte Schaltkreisanordnung und Verfahren zur Herstellung derselben
AU2003293540A1 (en) * 2002-12-13 2004-07-09 Raytheon Company Integrated circuit modification using well implants
US7577926B2 (en) 2003-07-11 2009-08-18 Nxp B.V. Security-sensitive semiconductor product, particularly a smart-card chip
DE102004023462B4 (de) * 2004-05-12 2006-06-08 Infineon Technologies Ag Verfahren zur Ausbildung von Leiterbahnstrukturen auf Halbleiterbauelementen
WO2005117115A1 (en) * 2004-05-28 2005-12-08 Koninklijke Philips Electronics N.V. Chips with useful lines and dummy lines
US7242063B1 (en) 2004-06-29 2007-07-10 Hrl Laboratories, Llc Symmetric non-intrusive and covert technique to render a transistor permanently non-operable
JP2006228910A (ja) * 2005-02-16 2006-08-31 Matsushita Electric Ind Co Ltd 半導体装置
DE102005042790B4 (de) * 2005-09-08 2010-11-18 Infineon Technologies Ag Integrierte Schaltungsanordnung und Verfahren zum Betrieb einer solchen
US8168487B2 (en) 2006-09-28 2012-05-01 Hrl Laboratories, Llc Programmable connection and isolation of active regions in an integrated circuit using ambiguous features to confuse a reverse engineer
CN101617319B (zh) * 2007-02-20 2012-09-26 Nxp股份有限公司 具有背面破坏防护的半导体装置
US8195995B2 (en) 2008-07-02 2012-06-05 Infineon Technologies Ag Integrated circuit and method of protecting a circuit part of an integrated circuit
CN102184270A (zh) * 2010-11-24 2011-09-14 天津蓝海微科技有限公司 安全芯片的版图保护电路自动生成方法
FR2986632B1 (fr) 2012-02-06 2016-02-12 Altis Semiconductor Snc Protection d'un circuit integre contre des attaques invasives
US9627310B2 (en) * 2012-04-11 2017-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device with self-aligned interconnects
US8907497B2 (en) * 2012-04-27 2014-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device with self-aligned interconnects and blocking portions
US8779592B2 (en) * 2012-05-01 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Via-free interconnect structure with self-aligned metal line interconnections
GB201311834D0 (en) 2013-07-02 2013-08-14 Qinetiq Ltd Electronic hardware assembly
KR20150037167A (ko) * 2013-09-30 2015-04-08 에스케이하이닉스 주식회사 반도체 장치 및 이의 형성 방법
US11211342B1 (en) * 2020-07-21 2021-12-28 Taiwan Semiconductor Manufacturing Company Ltd. Multiplexer cell and semiconductor device having camouflage design, and method for forming multiplexer cell
WO2022161590A1 (en) 2021-01-26 2022-08-04 Tallinn University Of Technology Physical obfuscation of hardware through capacitive coupling

Family Cites Families (25)

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FR2471051A1 (fr) * 1979-11-30 1981-06-12 Dassault Electronique Circuit integre a transistors mos protege contre l'analyse et carte comprenant un tel circuit
SU1251138A1 (ru) 1984-12-27 1986-08-15 Рижское Ордена Ленина Производственное Объединение "Вэф" Им.В.И.Ленина Идентификационна карта
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
US5262353A (en) * 1992-02-03 1993-11-16 Motorola, Inc. Process for forming a structure which electrically shields conductors
US5883000A (en) * 1995-05-03 1999-03-16 Lsi Logic Corporation Circuit device interconnection by direct writing of patterns therein
AU6762196A (en) * 1995-07-20 1997-02-18 Dallas Semiconductor Corporation Secure module with microprocessor and co-processor
US5783846A (en) * 1995-09-22 1998-07-21 Hughes Electronics Corporation Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
US5861652A (en) * 1996-03-28 1999-01-19 Symbios, Inc. Method and apparatus for protecting functions imbedded within an integrated circuit from reverse engineering
JP3960645B2 (ja) * 1996-12-27 2007-08-15 ローム株式会社 回路チップ搭載カードおよび回路チップモジュール
JPH10270562A (ja) * 1997-03-27 1998-10-09 Nippon Telegr & Teleph Corp <Ntt> 半導体集積回路
JP3638778B2 (ja) * 1997-03-31 2005-04-13 株式会社ルネサステクノロジ 半導体集積回路装置およびその製造方法
JP3682151B2 (ja) * 1997-06-27 2005-08-10 株式会社東芝 配線評価方法および配線評価装置
JP2001517874A (ja) * 1997-09-19 2001-10-09 フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ． 製品の盗用と製品の操作を防止するための半導体素子の配線方法、この方法によって製造される半導体素子、およびチップカードでの半導体素子の使用方法
US6014052A (en) * 1997-09-29 2000-01-11 Lsi Logic Corporation Implementation of serial fusible links
US6137318A (en) * 1997-12-09 2000-10-24 Oki Electric Industry Co., Ltd. Logic circuit having dummy MOS transistor
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UA55555C2 (uk) * 1998-08-18 2003-04-15 Інфінеон Текнолоджіс Аг Напівпровідниковий чіп із захисним покриттям
JP2000076140A (ja) 1998-09-02 2000-03-14 Nippon Telegr & Teleph Corp <Ntt> 半導体集積回路
WO2000019490A2 (en) * 1998-09-29 2000-04-06 Conexant Systems, Inc. Dummy fill cell for reducing layer-to-layer interaction
WO2000028399A1 (de) * 1998-11-05 2000-05-18 Infineon Technologies Ag Schutzschaltung für eine integrierte schaltung
DE50013722D1 (de) 1999-05-03 2006-12-21 Infineon Technologies Ag Verfahren und vorrichtung zur sicherung eines mehrdimensional aufgebauten chipstapels
JP2001196372A (ja) * 2000-01-13 2001-07-19 Mitsubishi Electric Corp 半導体装置
JP2001284357A (ja) 2000-03-30 2001-10-12 Sony Corp 半導体装置
JP2002118235A (ja) * 2000-10-10 2002-04-19 Mitsubishi Electric Corp 半導体装置、半導体製造方法、および半導体製造用マスク

Also Published As

Publication number Publication date
MXPA03004572A (es) 2004-05-05
DE10058078C1 (de) 2002-04-11
BR0115535A (pt) 2004-02-03
CN1476635A (zh) 2004-02-18
CN100359684C (zh) 2008-01-02
JP2004514299A (ja) 2004-05-13
KR20040010564A (ko) 2004-01-31
US7288786B2 (en) 2007-10-30
KR100515555B1 (ko) 2005-09-16
WO2002043147A1 (de) 2002-05-30
EP1336201A1 (de) 2003-08-20
RU2263372C2 (ru) 2005-10-27
US20030205816A1 (en) 2003-11-06
EP1336201B1 (de) 2015-02-11

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