TWI886182B - 配線電路基板之製造方法 - Google Patents

配線電路基板之製造方法 Download PDF

Info

Publication number
TWI886182B
TWI886182B TW109142601A TW109142601A TWI886182B TW I886182 B TWI886182 B TW I886182B TW 109142601 A TW109142601 A TW 109142601A TW 109142601 A TW109142601 A TW 109142601A TW I886182 B TWI886182 B TW I886182B
Authority
TW
Taiwan
Prior art keywords
wiring
seed film
thickness direction
forming
resist
Prior art date
Application number
TW109142601A
Other languages
English (en)
Chinese (zh)
Other versions
TW202137836A (zh
Inventor
伊藤正樹
高倉隼人
滝本顕也
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202137836A publication Critical patent/TW202137836A/zh
Application granted granted Critical
Publication of TWI886182B publication Critical patent/TWI886182B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/058—Additional resists used for the same purpose but in different areas, i.e. not stacked
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
TW109142601A 2019-12-10 2020-12-03 配線電路基板之製造方法 TWI886182B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-222680 2019-12-10
JP2019222680A JP7019657B2 (ja) 2019-12-10 2019-12-10 配線回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW202137836A TW202137836A (zh) 2021-10-01
TWI886182B true TWI886182B (zh) 2025-06-11

Family

ID=76312732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109142601A TWI886182B (zh) 2019-12-10 2020-12-03 配線電路基板之製造方法

Country Status (6)

Country Link
US (1) US20230007783A1 (enExample)
JP (1) JP7019657B2 (enExample)
KR (1) KR102901557B1 (enExample)
CN (1) CN114788423A (enExample)
TW (1) TWI886182B (enExample)
WO (1) WO2021117501A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
JP2022185677A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185670A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185674A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185675A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185672A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185669A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185671A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185673A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185678A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185667A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185679A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185676A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2024007968A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007967A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007990A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007966A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007991A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007989A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
JP2024007969A (ja) * 2022-07-07 2024-01-19 株式会社三洋物産 遊技機
US20250151208A1 (en) * 2023-11-06 2025-05-08 Dell Products L.P. Systems and methods for optimizing metal weight of conductive layers of circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067317A (ja) * 2008-09-11 2010-03-25 Dainippon Printing Co Ltd サスペンション用基板
JP2016186986A (ja) * 2015-03-27 2016-10-27 株式会社フジクラ プリント配線板及びプリント配線板の製造方法
US20170170111A1 (en) * 2015-12-15 2017-06-15 Intel IP Corporation Semiconductor package having a variable redistribution layer thickness
TW201921507A (zh) * 2017-09-29 2019-06-01 日商日東電工股份有限公司 配線電路基板、其製造方法及攝像裝置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
JPH0832244A (ja) * 1994-07-12 1996-02-02 Toshiba Corp 多層配線基板
JP2806370B2 (ja) * 1996-07-16 1998-09-30 日本電気株式会社 パターン形成方法
JP2001007456A (ja) 1999-06-17 2001-01-12 Toshiba Corp 配線回路基板
JP2002111174A (ja) 2000-09-27 2002-04-12 Nitto Denko Corp 配線回路基板の製造方法
JP4268434B2 (ja) * 2003-04-09 2009-05-27 大日本印刷株式会社 配線基板の製造方法
JP4034772B2 (ja) * 2004-09-16 2008-01-16 Ｔｄｋ株式会社 多層基板及びその製造方法
JP2010171170A (ja) * 2009-01-22 2010-08-05 Hitachi Cable Ltd 銅回路配線基板およびその製造方法
JP5010669B2 (ja) 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
KR101319808B1 (ko) * 2012-02-24 2013-10-17 삼성전기주식회사 경연성 인쇄회로기판 제조 방법
US9653406B2 (en) * 2015-04-16 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive traces in semiconductor devices and methods of forming same
CA2992290C (en) * 2015-07-14 2024-01-02 Conocophillips Company Enhanced oil recovery response prediction
JP6778585B2 (ja) 2016-11-02 2020-11-04 日東電工株式会社 配線回路基板およびその製造方法
JP2018157051A (ja) 2017-03-17 2018-10-04 三菱マテリアル株式会社 バンプ付き配線基板の製造方法
JP6810908B2 (ja) 2017-03-31 2021-01-13 大日本印刷株式会社 導電基板およびその製造方法
TWM595375U (zh) * 2019-08-30 2020-05-11 嘉聯益科技股份有限公司 多層軟性電路板及其內嵌式線路層結構

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067317A (ja) * 2008-09-11 2010-03-25 Dainippon Printing Co Ltd サスペンション用基板
JP2016186986A (ja) * 2015-03-27 2016-10-27 株式会社フジクラ プリント配線板及びプリント配線板の製造方法
US20170170111A1 (en) * 2015-12-15 2017-06-15 Intel IP Corporation Semiconductor package having a variable redistribution layer thickness
TW201921507A (zh) * 2017-09-29 2019-06-01 日商日東電工股份有限公司 配線電路基板、其製造方法及攝像裝置

Also Published As

Publication number Publication date
CN114788423A (zh) 2022-07-22
JP2021093434A (ja) 2021-06-17
KR20220113935A (ko) 2022-08-17
WO2021117501A1 (ja) 2021-06-17
TW202137836A (zh) 2021-10-01
US20230007783A1 (en) 2023-01-05
KR102901557B1 (ko) 2025-12-17
JP7019657B2 (ja) 2022-02-15

Similar Documents

Publication Publication Date Title
TW202137836A (zh) 配線電路基板之製造方法
US12114438B2 (en) Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board
CN101022699B (zh) 布线电路基板及其制造方法
TWI236714B (en) Method for fabricating a packaging substrate
JP4394432B2 (ja) 配線回路基板保持シートの製造方法
KR20060090614A (ko) 배선 회로 기판 및 그 제조 방법
TWI430723B (zh) 可撓性印刷配線板片及其製造方法
TWI900581B (zh) 配線電路基板
TWI883082B (zh) 配線電路基板及其製造方法
TWI875838B (zh) 配線電路基板及其製造方法
KR100674458B1 (ko) 프린트 기판 제조 방법 및 프린트 기판
JP7203939B2 (ja) 配線回路基板の製造方法
US20240284600A1 (en) Method for producing wiring circuit board
US8431029B2 (en) Circuit board and method of manufacturing the same
JP3550491B2 (ja) インナーリード先端部細り防止パターン
CN117461394A (zh) 布线电路基板的制造方法
JPH02114693A (ja) 回路基板および回路基板の製造方法
TW202429966A (zh) 配線電路基板之製造方法、附有虛置圖案之配線電路基板、及集合體片材
JP2010192530A (ja) 半導体装置用テープキャリアの製造方法
JP4755454B2 (ja) プリント基板の製造方法
JP3965553B2 (ja) Ｔａｂテープの製造方法
JP2025168110A (ja) 配線回路基板、および、配線回路基板の製造方法
TW202332332A (zh) 配線電路基板及其製造方法
JPH0149037B2 (enExample)
JPS59201485A (ja) プリント回路配線板