CN114788423A - 布线电路基板的制造方法 - Google Patents

布线电路基板的制造方法 Download PDF

Info

Publication number
CN114788423A
CN114788423A CN202080085687.7A CN202080085687A CN114788423A CN 114788423 A CN114788423 A CN 114788423A CN 202080085687 A CN202080085687 A CN 202080085687A CN 114788423 A CN114788423 A CN 114788423A
Authority
CN
China
Prior art keywords
wiring
resist
seed film
thickness direction
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080085687.7A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤正树
高仓隼人
滝本显也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN114788423A publication Critical patent/CN114788423A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/058—Additional resists used for the same purpose but in different areas, i.e. not stacked
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
CN202080085687.7A 2019-12-10 2020-11-27 布线电路基板的制造方法 Pending CN114788423A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-222680 2019-12-10
JP2019222680A JP7019657B2 (ja) 2019-12-10 2019-12-10 配線回路基板の製造方法
PCT/JP2020/044169 WO2021117501A1 (ja) 2019-12-10 2020-11-27 配線回路基板の製造方法

Publications (1)

Publication Number Publication Date
CN114788423A true CN114788423A (zh) 2022-07-22

Family

ID=76312732

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080085687.7A Pending CN114788423A (zh) 2019-12-10 2020-11-27 布线电路基板的制造方法

Country Status (5)

Country Link
US (1) US20230007783A1 (enExample)
JP (1) JP7019657B2 (enExample)
CN (1) CN114788423A (enExample)
TW (1) TWI886182B (enExample)
WO (1) WO2021117501A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7387453B2 (ja) * 2020-01-10 2023-11-28 住友電気工業株式会社 フレキシブルプリント配線板及びその製造方法
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
JP2022185676A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185671A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185679A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185675A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185677A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185669A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185667A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185678A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185670A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185672A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185673A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
JP2022185674A (ja) * 2021-06-03 2022-12-15 株式会社三洋物産 遊技機
US20250151208A1 (en) * 2023-11-06 2025-05-08 Dell Products L.P. Systems and methods for optimizing metal weight of conductive layers of circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067317A (ja) * 2008-09-11 2010-03-25 Dainippon Printing Co Ltd サスペンション用基板
US20170170111A1 (en) * 2015-12-15 2017-06-15 Intel IP Corporation Semiconductor package having a variable redistribution layer thickness

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
JPH0832244A (ja) * 1994-07-12 1996-02-02 Toshiba Corp 多層配線基板
JP2806370B2 (ja) * 1996-07-16 1998-09-30 日本電気株式会社 パターン形成方法
JP2001007456A (ja) * 1999-06-17 2001-01-12 Toshiba Corp 配線回路基板
JP2002111174A (ja) * 2000-09-27 2002-04-12 Nitto Denko Corp 配線回路基板の製造方法
JP4034772B2 (ja) * 2004-09-16 2008-01-16 Ｔｄｋ株式会社 多層基板及びその製造方法
JP2010171170A (ja) * 2009-01-22 2010-08-05 Hitachi Cable Ltd 銅回路配線基板およびその製造方法
JP5010669B2 (ja) * 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
JP2016186986A (ja) * 2015-03-27 2016-10-27 株式会社フジクラ プリント配線板及びプリント配線板の製造方法
US9653406B2 (en) * 2015-04-16 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive traces in semiconductor devices and methods of forming same
US11353443B2 (en) * 2015-07-14 2022-06-07 Conocophillips Company Enhanced recovery response prediction
JP6778585B2 (ja) * 2016-11-02 2020-11-04 日東電工株式会社 配線回路基板およびその製造方法
JP2018157051A (ja) * 2017-03-17 2018-10-04 三菱マテリアル株式会社 バンプ付き配線基板の製造方法
JP6810908B2 (ja) * 2017-03-31 2021-01-13 大日本印刷株式会社 導電基板およびその製造方法
JP7085328B2 (ja) * 2017-09-29 2022-06-16 日東電工株式会社 配線回路基板、その製造方法および撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067317A (ja) * 2008-09-11 2010-03-25 Dainippon Printing Co Ltd サスペンション用基板
US20170170111A1 (en) * 2015-12-15 2017-06-15 Intel IP Corporation Semiconductor package having a variable redistribution layer thickness

Also Published As

Publication number Publication date
TWI886182B (zh) 2025-06-11
US20230007783A1 (en) 2023-01-05
JP2021093434A (ja) 2021-06-17
KR20220113935A (ko) 2022-08-17
TW202137836A (zh) 2021-10-01
JP7019657B2 (ja) 2022-02-15
WO2021117501A1 (ja) 2021-06-17

Similar Documents

Publication Publication Date Title
CN114788423A (zh) 布线电路基板的制造方法
CN101378033B (zh) 形成薄膜金属导线的方法
JP2007537562A5 (enExample)
CN110551973A (zh) 蒸镀掩模
CN101583243B (zh) 布线电路基板及其制造方法
CN100586251C (zh) 布线电路板
JP4394432B2 (ja) 配線回路基板保持シートの製造方法
CN116420431A (zh) 布线电路基板和布线电路基板的制造方法
CN105282964A (zh) 配线电路基板和其制造方法
CN113728732A (zh) 从两侧铣削具有两个导电层的柔性箔
JP7203939B2 (ja) 配線回路基板の製造方法
KR100674458B1 (ko) 프린트 기판 제조 방법 및 프린트 기판
JP6576651B2 (ja) 配線回路基板およびその製造方法
JP7448309B2 (ja) 配線回路基板およびその製造方法
CN101826469B (zh) 无核心封装基板及其制造方法
KR102901557B1 (ko) 배선 회로 기판의 제조 방법
JP5351830B2 (ja) 配線回路基板およびその製造方法
US8431029B2 (en) Circuit board and method of manufacturing the same
JP4755454B2 (ja) プリント基板の製造方法
CN117461394A (zh) 布线电路基板的制造方法
JPS60161606A (ja) プリントコイルの製造方法
US20110120969A1 (en) Process of manufacturing ceramic substrate
JP2018519615A (ja) 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
JP2024072219A (ja) 配線回路基板の製造方法、ダミーパターン付き配線回路基板、および、集合体シート
TW202418897A (zh) 配線電路基板之製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination