TWI877461B - 環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物 - Google Patents

環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物 Download PDF

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Publication number
TWI877461B
TWI877461B TW111108678A TW111108678A TWI877461B TW I877461 B TWI877461 B TW I877461B TW 111108678 A TW111108678 A TW 111108678A TW 111108678 A TW111108678 A TW 111108678A TW I877461 B TWI877461 B TW I877461B
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TW
Taiwan
Prior art keywords
epoxy resin
formula
epoxy
weight
phenol
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TW111108678A
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English (en)
Chinese (zh)
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TW202248264A (zh
Inventor
関允諭
中西政
橋本伴理
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日商日本化藥股份有限公司
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Publication of TW202248264A publication Critical patent/TW202248264A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
TW111108678A 2021-03-18 2022-03-10 環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物 TWI877461B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-044697 2021-03-18
JP2021044697 2021-03-18

Publications (2)

Publication Number Publication Date
TW202248264A TW202248264A (zh) 2022-12-16
TWI877461B true TWI877461B (zh) 2025-03-21

Family

ID=83320622

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108678A TWI877461B (zh) 2021-03-18 2022-03-10 環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物

Country Status (5)

Country Link
JP (1) JP7170162B1 (https=)
KR (1) KR102760858B1 (https=)
CN (1) CN116507659A (https=)
TW (1) TWI877461B (https=)
WO (1) WO2022196525A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007112958A (ja) * 2005-10-24 2007-05-10 Nippon Kayaku Co Ltd フェノール樹脂、その製造法、エポキシ樹脂及びその用途
TW201105695A (en) * 2009-03-23 2011-02-16 Taiyo Ink Mfg Co Ltd Light and thermal curable resin composition, dry film thereof and cured substance and printed circuit board using the same
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物
TW201934655A (zh) * 2018-02-08 2019-09-01 日商關西塗料股份有限公司 抗蝕劑組成物及抗蝕膜

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660618B2 (ja) 2001-10-24 2005-06-15 エア・ウォーター・ケミカル株式会社 エポキシ樹脂、その製法及びその用途
JP2003301031A (ja) 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP4502195B2 (ja) 2004-08-27 2010-07-14 日本化薬株式会社 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物
JP5382761B2 (ja) 2005-03-15 2014-01-08 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
JP5142180B2 (ja) * 2006-05-17 2013-02-13 日本化薬株式会社 エポキシ樹脂組成物、およびその硬化物
JP2009096982A (ja) 2007-09-28 2009-05-07 Sumitomo Bakelite Co Ltd ノボラック型フェノール樹脂、ノボラック型フェノール樹脂組成物および熱硬化性樹脂成形材料
JP2015172105A (ja) * 2014-03-11 2015-10-01 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、その硬化物、および半導体装置
WO2020022301A1 (ja) * 2018-07-24 2020-01-30 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料
JP2020035721A (ja) 2018-08-31 2020-03-05 京セラ株式会社 ペースト組成物、半導体装置及び電気・電子部品
JP7243093B2 (ja) * 2018-09-10 2023-03-22 株式会社レゾナック エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JP7277136B2 (ja) * 2018-12-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
EP3985045A4 (en) 2019-06-14 2023-06-14 DIC Corporation EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE, PREPREG AND TOW-PREPREG
JP7379899B2 (ja) 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
JP7190985B2 (ja) 2019-08-05 2022-12-16 三菱電機株式会社 半導体装置
JP7196799B2 (ja) 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007112958A (ja) * 2005-10-24 2007-05-10 Nippon Kayaku Co Ltd フェノール樹脂、その製造法、エポキシ樹脂及びその用途
TW201105695A (en) * 2009-03-23 2011-02-16 Taiyo Ink Mfg Co Ltd Light and thermal curable resin composition, dry film thereof and cured substance and printed circuit board using the same
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物
TW201934655A (zh) * 2018-02-08 2019-09-01 日商關西塗料股份有限公司 抗蝕劑組成物及抗蝕膜

Also Published As

Publication number Publication date
WO2022196525A1 (ja) 2022-09-22
CN116507659A (zh) 2023-07-28
KR20230156686A (ko) 2023-11-14
JP7170162B1 (ja) 2022-11-11
JPWO2022196525A1 (https=) 2022-09-22
KR102760858B1 (ko) 2025-02-03
TW202248264A (zh) 2022-12-16

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