CN116507659A - 环氧树脂混合物及其制造方法、环氧树脂组合物及其硬化物 - Google Patents

环氧树脂混合物及其制造方法、环氧树脂组合物及其硬化物 Download PDF

Info

Publication number
CN116507659A
CN116507659A CN202280007693.XA CN202280007693A CN116507659A CN 116507659 A CN116507659 A CN 116507659A CN 202280007693 A CN202280007693 A CN 202280007693A CN 116507659 A CN116507659 A CN 116507659A
Authority
CN
China
Prior art keywords
epoxy resin
formula
epoxy
weight
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280007693.XA
Other languages
English (en)
Chinese (zh)
Inventor
関允谕
中西政隆
桥本伴理
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of CN116507659A publication Critical patent/CN116507659A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
CN202280007693.XA 2021-03-18 2022-03-10 环氧树脂混合物及其制造方法、环氧树脂组合物及其硬化物 Pending CN116507659A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-044697 2021-03-18
JP2021044697 2021-03-18
PCT/JP2022/010637 WO2022196525A1 (ja) 2021-03-18 2022-03-10 エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
CN116507659A true CN116507659A (zh) 2023-07-28

Family

ID=83320622

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280007693.XA Pending CN116507659A (zh) 2021-03-18 2022-03-10 环氧树脂混合物及其制造方法、环氧树脂组合物及其硬化物

Country Status (5)

Country Link
JP (1) JP7170162B1 (https=)
KR (1) KR102760858B1 (https=)
CN (1) CN116507659A (https=)
TW (1) TWI877461B (https=)
WO (1) WO2022196525A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105980441A (zh) * 2014-03-11 2016-09-28 日本化药株式会社 环氧树脂混合物、可固化树脂组合物、其固化物和半导体装置
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP2020041049A (ja) * 2018-09-10 2020-03-19 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
CN111378093A (zh) * 2018-12-28 2020-07-07 日铁化学材料株式会社 环氧树脂及其制造方法、环氧树脂组合物及环氧树脂硬化物
CN112513131A (zh) * 2018-07-24 2021-03-16 日本化药株式会社 环氧树脂、环氧树脂组合物、碳纤维强化复合材料用环氧树脂组合物、预浸料、碳纤维强化复合材料

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660618B2 (ja) 2001-10-24 2005-06-15 エア・ウォーター・ケミカル株式会社 エポキシ樹脂、その製法及びその用途
JP2003301031A (ja) 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP4502195B2 (ja) 2004-08-27 2010-07-14 日本化薬株式会社 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物
JP5382761B2 (ja) 2005-03-15 2014-01-08 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
JP4716845B2 (ja) * 2005-10-24 2011-07-06 日本化薬株式会社 フェノール樹脂、その製造法、エポキシ樹脂及びその用途
JP5142180B2 (ja) * 2006-05-17 2013-02-13 日本化薬株式会社 エポキシ樹脂組成物、およびその硬化物
JP2009096982A (ja) 2007-09-28 2009-05-07 Sumitomo Bakelite Co Ltd ノボラック型フェノール樹脂、ノボラック型フェノール樹脂組成物および熱硬化性樹脂成形材料
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
CN111684011B (zh) * 2018-02-08 2023-09-01 关西涂料株式会社 抗蚀剂组合物和抗蚀膜
JP2020035721A (ja) 2018-08-31 2020-03-05 京セラ株式会社 ペースト組成物、半導体装置及び電気・電子部品
EP3985045A4 (en) 2019-06-14 2023-06-14 DIC Corporation EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE, PREPREG AND TOW-PREPREG
JP7379899B2 (ja) 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
JP7190985B2 (ja) 2019-08-05 2022-12-16 三菱電機株式会社 半導体装置
JP7196799B2 (ja) 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105980441A (zh) * 2014-03-11 2016-09-28 日本化药株式会社 环氧树脂混合物、可固化树脂组合物、其固化物和半导体装置
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物
CN112513131A (zh) * 2018-07-24 2021-03-16 日本化药株式会社 环氧树脂、环氧树脂组合物、碳纤维强化复合材料用环氧树脂组合物、预浸料、碳纤维强化复合材料
JP2020041049A (ja) * 2018-09-10 2020-03-19 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
CN111378093A (zh) * 2018-12-28 2020-07-07 日铁化学材料株式会社 环氧树脂及其制造方法、环氧树脂组合物及环氧树脂硬化物

Also Published As

Publication number Publication date
WO2022196525A1 (ja) 2022-09-22
TWI877461B (zh) 2025-03-21
KR20230156686A (ko) 2023-11-14
JP7170162B1 (ja) 2022-11-11
JPWO2022196525A1 (https=) 2022-09-22
KR102760858B1 (ko) 2025-02-03
TW202248264A (zh) 2022-12-16

Similar Documents

Publication Publication Date Title
JPWO2019078300A1 (ja) 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板
JP7128598B1 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物
JP7474373B2 (ja) エポキシ樹脂、硬化性樹脂組成物、及びこれらの硬化物並びに炭素繊維強化複合材料
JP2019019149A (ja) プロペニル基含有樹脂、樹脂組成物、樹脂ワニス、積層板の製造方法、熱硬化性成型材料および封止材
JP2024143063A (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、及び炭素繊維強化複合材料
EP4692152A1 (en) Epoxy resin, curable resin composition, and cured product
JP5170724B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
TWI877461B (zh) 環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物
JP7307668B2 (ja) エポキシ樹脂、およびエポキシ樹脂組成物
JP4748695B2 (ja) エポキシ樹脂組成物及びその硬化物
JP4748625B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP7437253B2 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP7589397B1 (ja) エポキシ樹脂、硬化性樹脂組成物、及びこれらの硬化物並びに炭素繊維強化複合材料
JP7829108B2 (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、及び炭素繊維強化複合材料
EP4692159A1 (en) Curable resin composition and cured product thereof
TW202330685A (zh) 環氧樹脂及其製造方法、硬化性樹脂組成物、硬化物及碳纖維強化複合材料
TW202330694A (zh) 環氧樹脂、硬化性樹脂組成物、硬化物、及碳纖維強化複合材料
JP2025025222A (ja) エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料
TW202502870A (zh) 環氧樹脂、硬化性樹脂組成物及此等之硬化物和碳纖維強化複合材料
JP2025131516A (ja) エポキシ樹脂、硬化性樹脂組成物、およびこれらの硬化物、ならびにフェノール樹脂

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination