KR102760858B1 - 에폭시 수지 혼합물 및 그 제조 방법, 에폭시 수지 조성물 및 그 경화물 - Google Patents

에폭시 수지 혼합물 및 그 제조 방법, 에폭시 수지 조성물 및 그 경화물 Download PDF

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KR102760858B1
KR102760858B1 KR1020237019238A KR20237019238A KR102760858B1 KR 102760858 B1 KR102760858 B1 KR 102760858B1 KR 1020237019238 A KR1020237019238 A KR 1020237019238A KR 20237019238 A KR20237019238 A KR 20237019238A KR 102760858 B1 KR102760858 B1 KR 102760858B1
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epoxy resin
epoxy
phenol
weight
compound represented
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Korean (ko)
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KR20230156686A (ko
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마사토 세키
마사타카 나카니시
반리 하시모토
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니폰 가야꾸 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
KR1020237019238A 2021-03-18 2022-03-10 에폭시 수지 혼합물 및 그 제조 방법, 에폭시 수지 조성물 및 그 경화물 Active KR102760858B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021044697 2021-03-18
JPJP-P-2021-044697 2021-03-18
PCT/JP2022/010637 WO2022196525A1 (ja) 2021-03-18 2022-03-10 エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物

Publications (2)

Publication Number Publication Date
KR20230156686A KR20230156686A (ko) 2023-11-14
KR102760858B1 true KR102760858B1 (ko) 2025-02-03

Family

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KR1020237019238A Active KR102760858B1 (ko) 2021-03-18 2022-03-10 에폭시 수지 혼합물 및 그 제조 방법, 에폭시 수지 조성물 및 그 경화물

Country Status (5)

Country Link
JP (1) JP7170162B1 (https=)
KR (1) KR102760858B1 (https=)
CN (1) CN116507659A (https=)
TW (1) TWI877461B (https=)
WO (1) WO2022196525A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128748A (ja) 2001-10-24 2003-05-08 Sumikin Air Water Chemical Inc エポキシ樹脂、その製法及びその用途
JP2003301031A (ja) 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP2006063207A (ja) 2004-08-27 2006-03-09 Nippon Kayaku Co Ltd 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物
WO2006098329A1 (ja) 2005-03-15 2006-09-21 Nippon Kayaku Kabushki Kaisha エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
JP2007308570A (ja) 2006-05-17 2007-11-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物、およびその硬化物
JP2009096982A (ja) 2007-09-28 2009-05-07 Sumitomo Bakelite Co Ltd ノボラック型フェノール樹脂、ノボラック型フェノール樹脂組成物および熱硬化性樹脂成形材料
JP2018100320A (ja) 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4716845B2 (ja) * 2005-10-24 2011-07-06 日本化薬株式会社 フェノール樹脂、その製造法、エポキシ樹脂及びその用途
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2015172105A (ja) * 2014-03-11 2015-10-01 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、その硬化物、および半導体装置
CN111684011B (zh) * 2018-02-08 2023-09-01 关西涂料株式会社 抗蚀剂组合物和抗蚀膜
WO2020022301A1 (ja) * 2018-07-24 2020-01-30 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料
JP2020035721A (ja) 2018-08-31 2020-03-05 京セラ株式会社 ペースト組成物、半導体装置及び電気・電子部品
JP7243093B2 (ja) * 2018-09-10 2023-03-22 株式会社レゾナック エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JP7277136B2 (ja) * 2018-12-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
EP3985045A4 (en) 2019-06-14 2023-06-14 DIC Corporation EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE, PREPREG AND TOW-PREPREG
JP7379899B2 (ja) 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
JP7190985B2 (ja) 2019-08-05 2022-12-16 三菱電機株式会社 半導体装置
JP7196799B2 (ja) 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128748A (ja) 2001-10-24 2003-05-08 Sumikin Air Water Chemical Inc エポキシ樹脂、その製法及びその用途
JP2003301031A (ja) 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP2006063207A (ja) 2004-08-27 2006-03-09 Nippon Kayaku Co Ltd 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物
WO2006098329A1 (ja) 2005-03-15 2006-09-21 Nippon Kayaku Kabushki Kaisha エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
JP2007308570A (ja) 2006-05-17 2007-11-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物、およびその硬化物
JP2009096982A (ja) 2007-09-28 2009-05-07 Sumitomo Bakelite Co Ltd ノボラック型フェノール樹脂、ノボラック型フェノール樹脂組成物および熱硬化性樹脂成形材料
JP2018100320A (ja) 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
WO2022196525A1 (ja) 2022-09-22
TWI877461B (zh) 2025-03-21
CN116507659A (zh) 2023-07-28
KR20230156686A (ko) 2023-11-14
JP7170162B1 (ja) 2022-11-11
JPWO2022196525A1 (https=) 2022-09-22
TW202248264A (zh) 2022-12-16

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