JP7170162B1 - エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物 - Google Patents

エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物 Download PDF

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JP7170162B1
JP7170162B1 JP2022548393A JP2022548393A JP7170162B1 JP 7170162 B1 JP7170162 B1 JP 7170162B1 JP 2022548393 A JP2022548393 A JP 2022548393A JP 2022548393 A JP2022548393 A JP 2022548393A JP 7170162 B1 JP7170162 B1 JP 7170162B1
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epoxy resin
formula
epoxy
phenol
weight
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JPWO2022196525A5 (https=
JPWO2022196525A1 (https=
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允諭 関
政隆 中西
伴理 橋本
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
JP2022548393A 2021-03-18 2022-03-10 エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物 Active JP7170162B1 (ja)

Applications Claiming Priority (3)

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JP2021044697 2021-03-18
JP2021044697 2021-03-18
PCT/JP2022/010637 WO2022196525A1 (ja) 2021-03-18 2022-03-10 エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物

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JPWO2022196525A1 JPWO2022196525A1 (https=) 2022-09-22
JP7170162B1 true JP7170162B1 (ja) 2022-11-11
JPWO2022196525A5 JPWO2022196525A5 (https=) 2023-02-13

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JP2022548393A Active JP7170162B1 (ja) 2021-03-18 2022-03-10 エポキシ樹脂混合物およびその製造方法、エポキシ樹脂組成物およびその硬化物

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JP (1) JP7170162B1 (https=)
KR (1) KR102760858B1 (https=)
CN (1) CN116507659A (https=)
TW (1) TWI877461B (https=)
WO (1) WO2022196525A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003301031A (ja) * 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP2007308570A (ja) * 2006-05-17 2007-11-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物、およびその硬化物
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660618B2 (ja) 2001-10-24 2005-06-15 エア・ウォーター・ケミカル株式会社 エポキシ樹脂、その製法及びその用途
JP4502195B2 (ja) 2004-08-27 2010-07-14 日本化薬株式会社 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物
JP5382761B2 (ja) 2005-03-15 2014-01-08 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
JP4716845B2 (ja) * 2005-10-24 2011-07-06 日本化薬株式会社 フェノール樹脂、その製造法、エポキシ樹脂及びその用途
JP2009096982A (ja) 2007-09-28 2009-05-07 Sumitomo Bakelite Co Ltd ノボラック型フェノール樹脂、ノボラック型フェノール樹脂組成物および熱硬化性樹脂成形材料
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2015172105A (ja) * 2014-03-11 2015-10-01 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、その硬化物、および半導体装置
CN111684011B (zh) * 2018-02-08 2023-09-01 关西涂料株式会社 抗蚀剂组合物和抗蚀膜
WO2020022301A1 (ja) * 2018-07-24 2020-01-30 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物、炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料
JP2020035721A (ja) 2018-08-31 2020-03-05 京セラ株式会社 ペースト組成物、半導体装置及び電気・電子部品
JP7243093B2 (ja) * 2018-09-10 2023-03-22 株式会社レゾナック エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JP7277136B2 (ja) * 2018-12-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
EP3985045A4 (en) 2019-06-14 2023-06-14 DIC Corporation EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE, PREPREG AND TOW-PREPREG
JP7379899B2 (ja) 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
JP7190985B2 (ja) 2019-08-05 2022-12-16 三菱電機株式会社 半導体装置
JP7196799B2 (ja) 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003301031A (ja) * 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物
JP2007308570A (ja) * 2006-05-17 2007-11-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物、およびその硬化物
JP2018100320A (ja) * 2016-12-19 2018-06-28 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
WO2022196525A1 (ja) 2022-09-22
TWI877461B (zh) 2025-03-21
CN116507659A (zh) 2023-07-28
KR20230156686A (ko) 2023-11-14
JPWO2022196525A1 (https=) 2022-09-22
KR102760858B1 (ko) 2025-02-03
TW202248264A (zh) 2022-12-16

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