TWI870578B - 基板處置機器人及其方法 - Google Patents

基板處置機器人及其方法 Download PDF

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Publication number
TWI870578B
TWI870578B TW110113173A TW110113173A TWI870578B TW I870578 B TWI870578 B TW I870578B TW 110113173 A TW110113173 A TW 110113173A TW 110113173 A TW110113173 A TW 110113173A TW I870578 B TWI870578 B TW I870578B
Authority
TW
Taiwan
Prior art keywords
substrate
housing
rotatable platform
end effector
arm
Prior art date
Application number
TW110113173A
Other languages
English (en)
Chinese (zh)
Other versions
TW202202242A (zh
Inventor
查齊 普雷斯伯格
伊格爾 沃爾科夫
Original Assignee
美商科磊股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202202242A publication Critical patent/TW202202242A/zh
Application granted granted Critical
Publication of TWI870578B publication Critical patent/TWI870578B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0058—Means for cleaning manipulators, e.g. dust removing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW110113173A 2020-06-10 2021-04-13 基板處置機器人及其方法 TWI870578B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202063037008P 2020-06-10 2020-06-10
US63/037,008 2020-06-10
US17/018,912 2020-09-11
US17/018,912 US11315816B2 (en) 2020-06-10 2020-09-11 Localized purge module for substrate handling

Publications (2)

Publication Number Publication Date
TW202202242A TW202202242A (zh) 2022-01-16
TWI870578B true TWI870578B (zh) 2025-01-21

Family

ID=78825911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113173A TWI870578B (zh) 2020-06-10 2021-04-13 基板處置機器人及其方法

Country Status (6)

Country Link
US (1) US11315816B2 (https=)
JP (1) JP7609897B2 (https=)
KR (1) KR102861296B1 (https=)
CN (2) CN119427428A (https=)
TW (1) TWI870578B (https=)
WO (1) WO2021252213A1 (https=)

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
US12578285B2 (en) 2022-10-25 2026-03-17 Kla Corporation Gas flow configurations for semiconductor inspections

Citations (1)

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JPH06326036A (ja) 1993-05-11 1994-11-25 Nissin Electric Co Ltd 気相成長装置
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
TW471008B (en) * 1999-07-09 2002-01-01 Tokyo Electron Ltd Substrate transport device
JP2003092335A (ja) 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
KR20040013965A (ko) 2002-08-09 2004-02-14 삼성전자주식회사 멀티 챔버형의 공정설비
JP3560962B1 (ja) * 2003-07-02 2004-09-02 エス・イー・エス株式会社 基板処理法及び基板処理装置
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JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置
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US8830486B2 (en) 2011-07-04 2014-09-09 Kla-Tencor Corporation Atmospheric molecular contamination control with local purging
JP2013161924A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd 基板収容容器のパージ装置及びパージ方法
US9244368B2 (en) 2012-09-26 2016-01-26 Kla-Tencor Corporation Particle control near reticle and optics using showerhead
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Also Published As

Publication number Publication date
TW202202242A (zh) 2022-01-16
US20210391200A1 (en) 2021-12-16
WO2021252213A1 (en) 2021-12-16
JP2023530629A (ja) 2023-07-19
KR102861296B1 (ko) 2025-09-17
CN115768604A (zh) 2023-03-07
US11315816B2 (en) 2022-04-26
JP7609897B2 (ja) 2025-01-07
CN119427428A (zh) 2025-02-14
KR20230022879A (ko) 2023-02-16

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