KR102861296B1 - 기판 핸들링을 위한 국부화된 퍼지 모듈 - Google Patents

기판 핸들링을 위한 국부화된 퍼지 모듈

Info

Publication number
KR102861296B1
KR102861296B1 KR1020227045153A KR20227045153A KR102861296B1 KR 102861296 B1 KR102861296 B1 KR 102861296B1 KR 1020227045153 A KR1020227045153 A KR 1020227045153A KR 20227045153 A KR20227045153 A KR 20227045153A KR 102861296 B1 KR102861296 B1 KR 102861296B1
Authority
KR
South Korea
Prior art keywords
substrate
enclosure
rotatable platform
end effector
purge gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227045153A
Other languages
English (en)
Korean (ko)
Other versions
KR20230022879A (ko
Inventor
차치 프레스버거
이고르 볼코브
Original Assignee
케이엘에이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이엘에이 코포레이션 filed Critical 케이엘에이 코포레이션
Publication of KR20230022879A publication Critical patent/KR20230022879A/ko
Application granted granted Critical
Publication of KR102861296B1 publication Critical patent/KR102861296B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0058—Means for cleaning manipulators, e.g. dust removing means
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020227045153A 2020-06-10 2021-05-30 기판 핸들링을 위한 국부화된 퍼지 모듈 Active KR102861296B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063037008P 2020-06-10 2020-06-10
US63/037,008 2020-06-10
US17/018,912 2020-09-11
US17/018,912 US11315816B2 (en) 2020-06-10 2020-09-11 Localized purge module for substrate handling
PCT/US2021/035055 WO2021252213A1 (en) 2020-06-10 2021-05-30 Localized purge module for substrate handling

Publications (2)

Publication Number Publication Date
KR20230022879A KR20230022879A (ko) 2023-02-16
KR102861296B1 true KR102861296B1 (ko) 2025-09-17

Family

ID=78825911

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227045153A Active KR102861296B1 (ko) 2020-06-10 2021-05-30 기판 핸들링을 위한 국부화된 퍼지 모듈

Country Status (6)

Country Link
US (1) US11315816B2 (https=)
JP (1) JP7609897B2 (https=)
KR (1) KR102861296B1 (https=)
CN (2) CN119427428A (https=)
TW (1) TWI870578B (https=)
WO (1) WO2021252213A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12578285B2 (en) 2022-10-25 2026-03-17 Kla Corporation Gas flow configurations for semiconductor inspections

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326036A (ja) 1993-05-11 1994-11-25 Nissin Electric Co Ltd 気相成長装置
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
TW471008B (en) * 1999-07-09 2002-01-01 Tokyo Electron Ltd Substrate transport device
JP2003092335A (ja) 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
KR20040013965A (ko) 2002-08-09 2004-02-14 삼성전자주식회사 멀티 챔버형의 공정설비
JP3560962B1 (ja) * 2003-07-02 2004-09-02 エス・イー・エス株式会社 基板処理法及び基板処理装置
KR100534027B1 (ko) * 2004-02-09 2005-12-07 세메스 주식회사 기판 반송 장치
US7542127B2 (en) 2005-12-21 2009-06-02 Asml Netherlands B.V. Lithographic apparatus and method for manufacturing a device
US7755764B2 (en) 2007-01-26 2010-07-13 Kla-Tencor Corporation Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry
JP4766274B2 (ja) 2007-07-18 2011-09-07 株式会社安川電機 基板搬送ロボット及びそれを備えた半導体製造装置
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP2010080469A (ja) * 2008-09-24 2010-04-08 Tokyo Electron Ltd 真空処理装置及び真空搬送装置
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8830486B2 (en) 2011-07-04 2014-09-09 Kla-Tencor Corporation Atmospheric molecular contamination control with local purging
JP2013161924A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd 基板収容容器のパージ装置及びパージ方法
US9244368B2 (en) 2012-09-26 2016-01-26 Kla-Tencor Corporation Particle control near reticle and optics using showerhead
US9257320B2 (en) 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
US9488924B2 (en) 2014-01-07 2016-11-08 Applied Materials Israel Ltd. Cleaning an object within a non-vacuumed environment
JP6226190B2 (ja) 2014-02-20 2017-11-08 Tdk株式会社 パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置
CN104907283B (zh) * 2014-03-11 2018-03-27 上海华虹宏力半导体制造有限公司 一种晶片清洁室
US10082461B2 (en) 2014-07-29 2018-09-25 Nanometrics Incorporated Optical metrology with purged reference chip
KR20210080633A (ko) 2014-11-25 2021-06-30 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들
WO2016205191A1 (en) 2015-06-17 2016-12-22 Entegris, Inc. Flow modification fixture for an equipment front end module
WO2018030255A1 (ja) * 2016-08-09 2018-02-15 近藤工業株式会社 半導体製造装置
JP6876417B2 (ja) * 2016-12-02 2021-05-26 東京エレクトロン株式会社 基板処理装置の洗浄方法および基板処理装置の洗浄システム
CN111052336B (zh) * 2017-09-01 2024-03-01 株式会社国际电气 基板处理装置、半导体装置的制造方法及记录介质
US10283393B1 (en) 2017-11-08 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrying fork, semiconductor device manufacturing system, and wafer transporting method
US10451542B2 (en) 2017-12-05 2019-10-22 Nanometrics Incorporated Local purge within metrology and inspection systems
KR20190079027A (ko) * 2017-12-27 2019-07-05 주식회사 케이씨텍 기판 이송 장치
KR102067752B1 (ko) * 2018-02-09 2020-01-17 (주)에스티아이 풉 세정 장치 및 풉 세정 방법
KR102132422B1 (ko) 2018-03-14 2020-08-05 우범제 이에프이엠
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11749537B2 (en) * 2018-10-26 2023-09-05 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating equipment front end modules
KR102212996B1 (ko) * 2019-01-02 2021-02-08 피에스케이홀딩스 (주) 기판 처리 장치 및 기판 처리 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置

Also Published As

Publication number Publication date
TW202202242A (zh) 2022-01-16
US20210391200A1 (en) 2021-12-16
WO2021252213A1 (en) 2021-12-16
JP2023530629A (ja) 2023-07-19
CN115768604A (zh) 2023-03-07
US11315816B2 (en) 2022-04-26
JP7609897B2 (ja) 2025-01-07
CN119427428A (zh) 2025-02-14
KR20230022879A (ko) 2023-02-16
TWI870578B (zh) 2025-01-21

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