WO1999062107A1 - Batch end effector for semiconductor wafer handling - Google Patents
Batch end effector for semiconductor wafer handling Download PDFInfo
- Publication number
- WO1999062107A1 WO1999062107A1 PCT/US1999/010194 US9910194W WO9962107A1 WO 1999062107 A1 WO1999062107 A1 WO 1999062107A1 US 9910194 W US9910194 W US 9910194W WO 9962107 A1 WO9962107 A1 WO 9962107A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- vacuum
- robot
- end effector
- holders
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020007013287A KR20010043834A (en) | 1998-05-27 | 1999-05-10 | Batch end effector for semiconductor wafer handling |
EP99921826A EP1084509A1 (en) | 1998-05-27 | 1999-05-10 | Batch end effector for semiconductor wafer handling |
JP2000551426A JP2002517088A (en) | 1998-05-27 | 1999-05-10 | Batch type end effector for semiconductor wafer handling |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8555398A | 1998-05-27 | 1998-05-27 | |
US09/085,553 | 1998-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999062107A1 true WO1999062107A1 (en) | 1999-12-02 |
Family
ID=22192392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/010194 WO1999062107A1 (en) | 1998-05-27 | 1999-05-10 | Batch end effector for semiconductor wafer handling |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1084509A1 (en) |
JP (1) | JP2002517088A (en) |
KR (1) | KR20010043834A (en) |
TW (1) | TW451382B (en) |
WO (1) | WO1999062107A1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000034987A2 (en) * | 1998-12-04 | 2000-06-15 | Applied Materials, Inc. | Apparatus and methods for handling a substrate |
WO2003043060A2 (en) * | 2001-11-13 | 2003-05-22 | Fsi International, Inc. | Reduced footprint tool for automated processing of substrates |
WO2004056678A2 (en) * | 2002-12-19 | 2004-07-08 | Siemens Aktiengesellschaft | Gripper and method for operating the same |
EP1460676A2 (en) * | 2001-11-13 | 2004-09-22 | FSI International, Inc. | Reduced footprint tool for automated processing of microelectronic substrates |
US6822413B2 (en) | 2002-03-20 | 2004-11-23 | Fsi International, Inc. | Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector |
DE19964235B4 (en) * | 1998-03-12 | 2006-08-24 | Tokyo Electron Ltd. | Conveying procedure of semiconductor wafer, LCD substrate during semiconductor device manufacture - involves conveying wafer to processing units for processing according to predetermined procedure and taking them out of processing units, using respective arms |
WO2008057567A2 (en) * | 2006-11-07 | 2008-05-15 | Integrated Dynamics Engineering, Inc. | Vacuum end effector for handling highly shaped substrates |
DE102008008661A1 (en) * | 2008-02-11 | 2009-09-03 | Sieghard Schiller Gmbh & Co. Kg | Device i.e. robot-controlled handling device, for handling plate-shaped substrates in manufacturing plant, has manifold effector comprising end effectors, where substrates are simultaneously received and transported by end effectors |
DE102012010310A1 (en) * | 2012-05-24 | 2013-11-28 | Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh | Wafer retainer used during inspection in processing station, has movement device that is provided to move movable receiving unit transversely to peripheral edge of wafer |
WO2016073330A1 (en) * | 2014-11-04 | 2016-05-12 | Brooks Automation, Inc. | Wafer aligner |
US10933532B2 (en) | 2015-02-13 | 2021-03-02 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and operation method therefor |
DE102021115853B3 (en) | 2021-06-18 | 2022-06-23 | Uwe Beier | Robot for handling flat substrates and alignment device |
CN110517973B (en) * | 2018-05-21 | 2023-08-15 | 株式会社迪思科 | Cutting device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100520232B1 (en) * | 2002-08-23 | 2005-10-11 | 로체 시스템즈(주) | End Effector for robot conveying glass plate |
JP2007005582A (en) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | Substrate transfer apparatus and semiconductor substrate manufacturing apparatus mounted with the same |
KR101312621B1 (en) * | 2006-11-29 | 2013-10-07 | 삼성전자주식회사 | A wafer moving apparatus |
TWI372717B (en) * | 2007-12-14 | 2012-09-21 | Prime View Int Co Ltd | Apparatus for transferring substrate |
CN103594409A (en) * | 2013-10-23 | 2014-02-19 | 中国电子科技集团公司第四十八研究所 | Device for absorbing silicon wafers in batches |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2590879A1 (en) * | 1985-11-27 | 1987-06-05 | American Telephone & Telegraph | Method and apparatus for automatically loading and unloading semiconductor wafers |
FR2664526A1 (en) * | 1990-07-16 | 1992-01-17 | Villejuif Etudes Ind | Slice handling system with protection against dust |
US5135349A (en) * | 1990-05-17 | 1992-08-04 | Cybeq Systems, Inc. | Robotic handling system |
EP0634787A1 (en) * | 1993-07-15 | 1995-01-18 | Applied Materials, Inc. | Subsrate tray and ceramic blade for semiconductor processing apparatus |
EP0669642A2 (en) * | 1994-01-31 | 1995-08-30 | Applied Materials, Inc. | Apparatus and methods for processing substrates |
US5584647A (en) * | 1988-09-16 | 1996-12-17 | Tokyo Ohka Kogyo Co., Ltd. | Object handling devices |
US5664925A (en) * | 1995-07-06 | 1997-09-09 | Brooks Automation, Inc. | Batchloader for load lock |
-
1999
- 1999-05-10 KR KR1020007013287A patent/KR20010043834A/en not_active Application Discontinuation
- 1999-05-10 JP JP2000551426A patent/JP2002517088A/en active Pending
- 1999-05-10 WO PCT/US1999/010194 patent/WO1999062107A1/en not_active Application Discontinuation
- 1999-05-10 EP EP99921826A patent/EP1084509A1/en not_active Withdrawn
- 1999-05-15 TW TW088107908A patent/TW451382B/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2590879A1 (en) * | 1985-11-27 | 1987-06-05 | American Telephone & Telegraph | Method and apparatus for automatically loading and unloading semiconductor wafers |
US5584647A (en) * | 1988-09-16 | 1996-12-17 | Tokyo Ohka Kogyo Co., Ltd. | Object handling devices |
US5135349A (en) * | 1990-05-17 | 1992-08-04 | Cybeq Systems, Inc. | Robotic handling system |
FR2664526A1 (en) * | 1990-07-16 | 1992-01-17 | Villejuif Etudes Ind | Slice handling system with protection against dust |
EP0634787A1 (en) * | 1993-07-15 | 1995-01-18 | Applied Materials, Inc. | Subsrate tray and ceramic blade for semiconductor processing apparatus |
EP0669642A2 (en) * | 1994-01-31 | 1995-08-30 | Applied Materials, Inc. | Apparatus and methods for processing substrates |
US5664925A (en) * | 1995-07-06 | 1997-09-09 | Brooks Automation, Inc. | Batchloader for load lock |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19964235B4 (en) * | 1998-03-12 | 2006-08-24 | Tokyo Electron Ltd. | Conveying procedure of semiconductor wafer, LCD substrate during semiconductor device manufacture - involves conveying wafer to processing units for processing according to predetermined procedure and taking them out of processing units, using respective arms |
WO2000034987A3 (en) * | 1998-12-04 | 2000-11-16 | Applied Materials Inc | Apparatus and methods for handling a substrate |
WO2000034987A2 (en) * | 1998-12-04 | 2000-06-15 | Applied Materials, Inc. | Apparatus and methods for handling a substrate |
US6979165B2 (en) | 2001-11-13 | 2005-12-27 | Fsi International, Inc. | Reduced footprint tool for automated processing of microelectronic substrates |
EP1460676A2 (en) * | 2001-11-13 | 2004-09-22 | FSI International, Inc. | Reduced footprint tool for automated processing of microelectronic substrates |
EP1460676A3 (en) * | 2001-11-13 | 2005-10-26 | FSI International, Inc. | Reduced footprint tool for automated processing of microelectronic substrates |
WO2003043060A3 (en) * | 2001-11-13 | 2003-11-27 | Fsi Int Inc | Reduced footprint tool for automated processing of substrates |
US7134827B2 (en) | 2001-11-13 | 2006-11-14 | Fsi International, Inc. | Reduced footprint tool for automated processing of microelectronic substrates |
WO2003043060A2 (en) * | 2001-11-13 | 2003-05-22 | Fsi International, Inc. | Reduced footprint tool for automated processing of substrates |
US6822413B2 (en) | 2002-03-20 | 2004-11-23 | Fsi International, Inc. | Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector |
WO2004056678A2 (en) * | 2002-12-19 | 2004-07-08 | Siemens Aktiengesellschaft | Gripper and method for operating the same |
WO2004056678A3 (en) * | 2002-12-19 | 2004-12-09 | Siemens Ag | Gripper and method for operating the same |
US7434856B2 (en) | 2002-12-19 | 2008-10-14 | Icos Vision Systems N.V. | Gripper and method of operating the same |
WO2008057567A2 (en) * | 2006-11-07 | 2008-05-15 | Integrated Dynamics Engineering, Inc. | Vacuum end effector for handling highly shaped substrates |
WO2008057567A3 (en) * | 2006-11-07 | 2008-06-26 | Integrated Dynamics Eng Gmbh | Vacuum end effector for handling highly shaped substrates |
DE102008008661A1 (en) * | 2008-02-11 | 2009-09-03 | Sieghard Schiller Gmbh & Co. Kg | Device i.e. robot-controlled handling device, for handling plate-shaped substrates in manufacturing plant, has manifold effector comprising end effectors, where substrates are simultaneously received and transported by end effectors |
DE102012010310B4 (en) | 2012-05-24 | 2019-12-12 | Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh | Wafer carrier |
DE102012010310A1 (en) * | 2012-05-24 | 2013-11-28 | Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh | Wafer retainer used during inspection in processing station, has movement device that is provided to move movable receiving unit transversely to peripheral edge of wafer |
US10755960B2 (en) | 2014-11-04 | 2020-08-25 | Brooks Automation, Inc. | Wafer aligner |
CN107112264A (en) * | 2014-11-04 | 2017-08-29 | 布鲁克斯自动化公司 | Wafer aligner |
WO2016073330A1 (en) * | 2014-11-04 | 2016-05-12 | Brooks Automation, Inc. | Wafer aligner |
CN107112264B (en) * | 2014-11-04 | 2021-06-04 | 布鲁克斯自动化公司 | Wafer aligner |
US10933532B2 (en) | 2015-02-13 | 2021-03-02 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and operation method therefor |
US11518038B2 (en) | 2015-02-13 | 2022-12-06 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and operation method therefor |
CN110517973B (en) * | 2018-05-21 | 2023-08-15 | 株式会社迪思科 | Cutting device |
DE102021115853B3 (en) | 2021-06-18 | 2022-06-23 | Uwe Beier | Robot for handling flat substrates and alignment device |
WO2022262907A1 (en) | 2021-06-18 | 2022-12-22 | Uwe Beier | Robot for handling flat substrates and aligning device |
Also Published As
Publication number | Publication date |
---|---|
JP2002517088A (en) | 2002-06-11 |
KR20010043834A (en) | 2001-05-25 |
EP1084509A1 (en) | 2001-03-21 |
TW451382B (en) | 2001-08-21 |
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