JP2688555B2 - Multi-chamber system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing and processing facility for semiconductors, electronic parts, etc., in which a plurality of process chambers are organically combined to convey a member to be processed such as a wafer in a vacuum or an inert atmosphere. And a multi-chamber system for processing.

[0002]

2. Description of the Related Art A single-wafer multi-chamber system for transferring and processing wafers, which are members to be processed, one by one to a plurality of process chambers connected to a transfer chamber is disclosed in, for example, Japanese Patent Laid-Open No. 19252/1993. As mentioned,
Two load lock chambers for cassettes for loading and unloading cassettes containing members to be processed are provided in the vacuum region.
Furthermore, Monthly Semiconductor World 1990.9 (Japanese version)
While there are various multi-chamber systems as described on pages 134-139, these are often equipped with multiple load-locking means to keep the processing of the member being processed continuously.

By the way, as semiconductor devices have been miniaturized and higher precision processing has been required, due to problems such as foreign matter contamination, surface contamination, and wafer oxidation, a multi-chamber system is connected to a plurality of multi-chamber systems. There is also a case where a transfer line for a member to be processed (wafer) that is sealed in a vacuum or an inert atmosphere is used as the transfer line.

On the other hand, in the process chamber cleaning after wafer processing, for example, when performing plasma cleaning such as etching, a dummy wafer different from the product processing wafer is carried in and is not damaged by electrodes or the like. Protecting the unprotected surface is done. Further, also in film formation such as plasma CVD, a thin protective film may be formed in advance so as to cover the metal portion on the side wall of the process chamber while protecting the electrode, but in this case also a dummy wafer is required.

In consideration of the processing of processed wafers supplied from the building transfer line and the use of dummy wafers in this way, in a multi-chamber system, a load lock chamber that mediates the transfer of wafers between vacuum and atmosphere in cassette units. , For example, since it is necessary to load-lock the cassette on which the dummy wafer is mounted, the load-lock unit needs a large chamber capable of accommodating two cassettes. In some cases, a plurality of process chambers are connected. It also means that a limited number of connection ports provided in the transfer chamber must be used for the load lock chamber for loading and unloading cassettes for dummy wafers.

Even if the supply of wafers from the building transfer line becomes the mainstream, in a system in which a plurality of multi-chamber systems are connected, a wafer loading and collecting function is provided for each multi-chamber system at the process start-up stage. is required. Further, basically, a wafer whose processing has been interrupted due to an unexpected power failure or the like needs to be carried out to the atmosphere as a defective (lot-out) wafer in a multi-chamber system unit and collected without flowing to a subsequent device. Therefore, each multi-chamber system requires a load lock chamber for loading and unloading wafers.

[0007]

As described above, in the conventional multi-chamber system, it is necessary to equip the transfer chamber with a load lock chamber for each multi-chamber system even when connected to the transfer line of the building. However, there is a problem that the number of the connection ports of the transfer chamber that can be used for connecting the process chambers is further reduced.

In addition, a large volume load lock chamber is required for each multi-chamber system in order to load and unload processed wafers and dummy wafers in cassette units.
There is a problem that the vacuuming device, the atmospheric purging device, and the gate valve necessary for the load lock chamber are increased in size, and the number is increased, resulting in cost increase.

An object of the present invention is to provide a multi-chamber system which can be connected to a building transfer line, in which a member to be processed is carried in and out of a transfer chamber of the building while being processed, and a dummy wafer, a wafer for starting a process, It enables the loading and unloading of lots of wafers and the like, and also minimizes the number of connection ports in the transfer chamber used for that purpose, which prevents impurities from entering the process chamber and enables continuous continuous processing. Another object of the present invention is to propose a load lock device that is compact, inexpensive, and space efficient.

[0010]

According to the present invention, there is provided a transfer chamber having a plurality of connecting ports, and inside of which a means for transferring a member to be processed is provided, a process chamber connected to the connecting port, and the connecting port. In a multi-chamber system including a buffer chamber for connecting a transfer line to a building transfer line, two sets of buffer chambers connected to the connection port are provided, and one buffer chamber is connected to one side of the transfer line and the other is connected to the other. The other side of the transfer line is connected to the buffer chamber, and one side and the other side of the transfer line are respectively communicated with the transfer chamber by the buffer chamber and partitioned airtightly, and are connected to one of the connection ports. A member to be processed that is different from the member to be processed carried in from the transfer line is installed in the atmosphere. It is characterized in that a single load lock chamber for loading and unloading a single item is connected, the connection port is connected to a first surface of the buffer chamber, and the transfer line is connected to a second surface of the buffer chamber. One side is connected, the other side of the transfer line is connected to the third surface of the buffer chamber, the one side and the other side of the transfer line are communicated by the buffer chamber, and an airtight partition is provided. A sluice valve is provided on the fourth surface of the chamber so that a member to be processed, which is different from the member to be processed that is carried in from the transfer line, can be carried in and out individually from the member to be processed holding means installed in the atmosphere. The line is hermetically partitioned so that the buffer chamber also serves as a load lock chamber.

[0011]

The load-lock chamber, which mediates the loading and unloading of the member to be processed between the transfer chamber and the means for holding the member to be processed in the atmosphere, is the only small volume for loading and unloading the member to be processed. Therefore, it is possible to reduce the number of connecting ports of the transfer chamber and to reduce the intrusion of impurities into the process chamber, and to insert a dummy wafer between the wafers to be processed in and out of the transfer line of the building. Since a lot-out wafer can be collected outside the processing line, continuous continuous processing is possible and the production capacity can be improved. Further, since the load lock chamber is a small one having a small volume for carrying in and out the processed members individually, the space efficiency is improved and the cost is reduced. Further, since the buffer chamber is also used as the load lock chamber, the load lock device can be further downsized and the space efficiency can be further improved.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a single-wafer multi-chamber system for wafer processing in a semiconductor manufacturing facility.
Reference numeral 1 denotes a first transfer chamber for handling a wafer which is a member to be processed under high vacuum, and has a plurality of connection ports 1a to 1e on its peripheral wall. Reference numeral 2 is a similar second transfer chamber, which has connection ports 2a to 2f, and is connected to the first transfer chamber 1 at the connection ports 1a and 2a through a handling chamber 3 and gate valves 4a and 4b. . Both transfer chambers 1 and 2 are equipped with transfer systems 1x and 2x each having a center robot. The handling chamber 3 may be used not only for handling a wafer but also as a process chamber for performing some processing. In this embodiment, the relay for buffering a vacuum in handling between the transfer chambers 1 and 2 is used. It is provided as a stage.

Numerals 5 to 8 are process chambers connected to the connection ports 1b to 1e of the first transfer chamber 1 through gate valves 4c to 4f. Gate valves 4g, 4 are also provided at the connection ports 2b, 2f of the second transfer chamber 2.
The process chambers 9 and 10 are connected via h. The process chamber 9 is a chamber for prebaking the wafer, and the process chamber 10 is a chamber for performing etching as a pretreatment of the wafer. 11 and 12 are transfer lines 13 and 14 of a building for connecting the multi-chamber system to the multi-chamber system or process equipment.
Is a buffer chamber for connecting the gate valve 4 to the connection ports 2c and 2e of the second transfer chamber 2.
i, 4j are connected to each other, and the building transfer lines 13, 1
4 is connected via gate valves 4k and 4m. Inside the buffer chambers 11 and 12, a non-contact orientation flat alignment mechanism (not shown) for aligning the orientation of the wafer is arranged. Reference numeral 16 is a load lock chamber having a small volume required for loading and unloading wafers one by one, and only one is provided for the entire multi-chamber system. And the load lock chamber 1
The vacuum side of 6 is connected to the connection port 2d of the second transfer chamber 2 via a gate valve 4n, and is connected to the atmosphere side via a gate valve 4p.

Reference numeral 17 denotes a loader arranged in the atmosphere, which has a wafer mounting portion which can be driven in a horizontal direction (XY direction in the drawing) and a height direction (direction perpendicular to the paper surface). Load lock chamber 16 and cassette 18-2
The wafer is handled between 1 and 1.

Incidentally, 18 is a cassette for storing dummy wafers, 19 is a cassette for taking out and storing lot-out wafers, 20 is a cassette for storing process test wafers, and 21 is used when the building transfer line is stopped. It is a cassette. In this embodiment, a cassette is prepared for each use, but it is not always necessary to limit the cassette position, number, or use.

According to such a multi-chamber system, wafers are carried in and out between the transfer line 13 of the building and the second transfer chamber 2 and processed in the process chambers 5 to 10, while the wafer is appropriately transferred as necessary. Dummy wafers and process test wafers can be loaded and unloaded by the load lock chamber 16 and the loader 17 between the second transfer chamber 2 and the cassettes 18 to 21, and the lot-out wafers are transferred to the building transfer lines 13 and 14 in the building. It can be carried out into the atmosphere without flowing into the cassette 19 and collected in the cassette 19. Further, even when the transfer lines 13 and 14 of the building are stopped, the wafer to be processed is loaded from the cassette 21 into the second transfer chamber 2 via the load lock chamber 16, and then transferred from the second transfer chamber 2 to the second transfer chamber 2. It becomes possible to carry out the operation of carrying out the processed wafer and storing it in the cassette 21.

In loading and unloading the wafer between the second transfer chamber 2 and the cassette 21 on the atmosphere side, the gate valve 4p is opened and the wafer is loaded into the load lock chamber 16 by the loader 17 and then the gate valve 4p is opened. When the load lock chamber 16 is closed and the load lock chamber 16 is evacuated, the gate valve 4n is opened in a state where the load lock chamber 16 has a predetermined vacuum degree, and the wafer is transferred to the orientation flat alignment mechanism or the pretreatment chamber by the transfer system 2x. Transfer. And the empty loadlock chamber 16
The processed wafer is transferred into it and the gate valve 4n is closed. When there is concern about cross contamination, the gate valve 4n is closed when the transfer system 2x transfers the wafer from the load lock chamber 16 into the second transfer chamber 2, and the wafer is transferred to the inlet of the process chamber to be processed. At this point, the gate valve communicating with the process chamber may be controlled to open.

Since the multi-chamber system uses only one load lock chamber 16 to load and unload dummy wafers, test wafers, lot-out wafers, and processed wafers one by one, the apparatus is small and inexpensive. As a result, the space efficiency of the multi-chamber system is also improved. For example, when a wafer is brought into the load lock chamber 16 in cassette units, the load lock chamber 16 has a size of the cassette (generally, two wafers are used).
A volume corresponding to the size of mounting in 5 stages is required, and when a cassette elevating device is used for wafer (mounting stage) selection, a cassette elevating device that moves up and down by the number of cassette stages or more is installed. Volume is also needed. In order to realize this selection function by the vertical function of the center robot in the transfer chamber 2, the transfer chamber 2 also needs a space large enough to allow the vertical movement. However, in the case of loading and unloading wafers one by one as in this embodiment, a small wafer loading part for loading one wafer is inserted to be several meters.
Since the load lock chamber 16 has a size that allows the vertical function of about m, and the transfer chamber 2 does not need to be large, the surface area and volume of the chamber can be reduced. Therefore, the impure gas (H
₂ O, N ₂ , O ₂ , CO _2, etc.) can be reduced.

The gate valve 4 on the transfer chamber 2 side is provided after the vacuum degree in the load lock chamber 16 becomes high.
n is controlled to open, but in the case of a load lock chamber with a large volume capable of carrying a cassette, it takes a long time to evacuate, so that an operator or an automated guided vehicle is restrained for loading and unloading wafers. It takes longer time and restricts the improvement of production capacity. However, since the load lock chamber 16 for loading and unloading wafers one by one as in this embodiment requires only a small volume, the time required to evacuate the load lock chamber 16 to a predetermined vacuum degree can be shortened. It is possible to reduce the restrictions on the production capacity improvement.

Next, another embodiment will be described with reference to FIG. In this embodiment, this multi-chamber system is connected to a building transfer line using a load lock chamber. The same components as those of the above-described embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

Second transfer chamber 2 in this embodiment
5 is provided with four connection ports 25a to 25e, and has a rectangular shape in plan view. The handling chamber 3 is connected to the connection port 25a of the second transfer chamber 25 via the gate valve 4b.
Process chambers 9 and 10 are connected to b and 25d via gate valves 4g and 4h, and a load lock chamber 30 is connected to connection port 25c via a gate valve 4n. The load lock chamber 30 is provided with gate valves 4q and 4r on the side walls in a direction orthogonal to the side walls on which the gate valves 4n and 4p are provided. The building transfer lines 26 and 27 are provided through the gate valves 4q and 4r.
Are linked.

As shown in FIG. 3, the load lock chamber 30 is divided into upper and lower chambers with a seat 31 as a boundary, and the upper small chamber 32a faces the loader 17 in the atmosphere through the gate valve 4p. A communication window 33 in which the lower chamber 32b is connected to the transfer chamber 25 via the gate valve 4n.
Communication windows 33b, 3 having a and being connected to the building's transfer lines 26, 27 via the gate valves 4q, 4r.
3c. The stage 34 arranged in the chamber 32b is supported so as to move up and down, and is provided with, for example, a pusher (not shown) that raises and holds the wafer carried onto the stage 34 by an arm or the like. Also, this pusher is used for the loader 17 or the building transfer line 2
6 and 27, the orientation flat of the wafer carried in is detected, the orientation of the wafer is adjusted, and then the wafer is lowered onto the stage 34 to be aligned. Keep it simple.

When the stage 34 is raised and pressed against the seat 31, the small chamber 32a becomes airtight.
The small chamber 32a can be evacuated by a vacuuming device to be in a vacuum state, or can be in an atmospheric pressure state by being supplied with nitrogen gas or the like by a gas supply device.

Second in this multi-chamber system
The loading / unloading of wafers between the transfer chamber 25 and the cassettes 18 to 21 will be described. This loading / unloading is performed by the gate valve 4
It is performed while maintaining q and 4r in the closed state.

At the time of loading, the stage 34 of the load lock chamber 30 is raised and pressed against the seat 31, and the small chamber 32
The space between a and the room 32b is made airtight. In this state, the gate valve 4p is opened and the cassette 1 is loaded by the loader 17.
Take out one wafer from 8, 20, 21 and put it in small room 3
It is loaded into 2a and mounted on the stage 34. Then, the gate valve 4p is closed and the small chamber 32a is evacuated to a vacuum state. Next, the stage 34 is lowered, the orientation flat of the wafer is detected and the orientation is adjusted, the gate valve 4n is opened, and the wafer is transferred from the communication window 33a into the transfer chamber 30.

At the time of unloading, the gate valve 4n is opened and the wafer in the transfer chamber 25 is loaded into the chamber 32b and placed on the stage 34, and the stage 34 is raised to move the seat 3
After making the small chamber 32a air-tight by pressing it against 1, the gate valve 4p is opened, the wafer on the stage 34 is taken out by the loader 17, and the desired cassette 18 to
Store in 21.

Next, the second transfer chamber 25 and the building transfer lines 26 and 27 in this multi-chamber system.
Loading and unloading of wafers during the period will be described. This loading / unloading is performed in a state in which the gate valve 4p is maintained in the closed state and the stage 34 is associated with the communication windows 33a to 33c.

At the time of loading, the gate valve 4q of the load lock chamber 30 is opened to open the transfer line 26 of the building 1.
A wafer is loaded into the room 32b and mounted on the stage 34. After that, the gate valve 4q is closed, the orientation flat of the wafer is detected to adjust the orientation, the gate valve 4n is opened, and the wafer is transferred from the communication window 33a into the transfer chamber 25.

At the time of unloading, the gate valve 4n is opened, the wafer in the transfer chamber 25 is loaded into the chamber 32b and placed on the stage 34, and the gate valve 4q is opened to transfer the wafer on the stage 34 to the transfer line 26 of the building. Transfer to.
When it is carried out to the building transfer line 27, the gate valve 4r may be opened for transfer. Building transfer line 2
Loading and unloading with 7 can be performed similarly.

In the multi-chamber system, the wafer transfer tact is limited to the module having the longest processing time. For example, the process of Al-based alloy sputtering for wiring is operated in about 2 minutes tact. In the example, since the wafer handling using the load lock chambers 16 and 30 can be performed within 1 minute and 45 seconds, it was confirmed that the operation can be performed without restricting the transfer tact.

Further, these multi-chamber systems can be operated without being connected to the building transfer line. In this case, the process chamber can also be connected to the connection port for the building transfer line.

[0033]

According to the present invention, the processed member is carried in and out between the transfer chamber and the processed member holding means in the atmosphere through the only load lock chamber having a small volume for carrying the processed member in and out individually. Since the number of connection ports used for wafer loading / unloading is reduced, dummy wafers can be inserted between the wafers to be loaded / unloaded to / from the building transfer line and processed, and lot-out wafers can be moved out of the processing line. In addition to being able to collect the impurities, invasion of impurities into the process chamber side can be suppressed to a minimum, continuous processing can be performed continuously, and the production capacity can be improved. Further, since the load lock chamber has a small volume for loading and unloading the members to be processed individually, the load lock chamber is small in size, the space efficiency is improved, and the cost is low. Further, since the buffer chamber is also used as the load lock chamber, the load lock device can be further downsized and the space efficiency can be further improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a single-wafer type multi-chamber system showing a first embodiment of the present invention.

FIG. 2 is a plan view of a single-wafer multi-chamber system showing a second embodiment of the present invention.

FIG. 3 is a vertical sectional side view of a load lock chamber according to a second embodiment.

[Explanation of symbols]

 1 1st transfer chamber 1a-1e connection port 1x transfer system 2 2nd transfer chamber 2a-2f connection port 2x transfer system 3 handling chamber 4a-4r gate valve 5-10 process chamber 11,12 buffer chamber 13,14 building Transfer line 16,30 Load lock chamber 17 Loader 26, 27 Building transfer line

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H01L 21/02 H01L 21/02 D (72) Inventor Akitaka Makino 794 Higashitoyo, Higashitoyo, Yamaguchi Prefecture Stock company Hitachi Kasado factory (56) Reference JP-A-4-78137 (JP, A) JP-A-2-85364 (JP, A) JP-A-60-115216 (JP, A) JP-A-61 -184841 (JP, A) JP 63-69249 (JP, A) JP 60-113428 (JP, A) JP 60-257135 (JP, A) JP 1-253237 (JP, A) ) JP-A-2-106923 (JP, A) European Patent Application Publication 473594 (EP, A)

Claims (9)

(57) [Claims] 1. A transfer chamber having a plurality of connection ports, and a processing member transfer means provided therein, a process chamber connected to the connection port, and the connection port connected to a building transfer line. In a multi-chamber system including a buffer chamber, two buffer chambers connected to the connection port are installed.
And one buffer chamber on one side of the transfer line.
Of the transfer line to the other buffer chamber.
One side and the other side of the transfer line connecting the other side
The transfer chamber is
The member to be processed which is communicated with the bar and is airtightly partitioned and is carried into one of the connection ports from the transfer line.
Multi-chamber system different workpiece member, characterized in that the concatenation of only the load lock chamber loading and unloading separately units from the processing member holding means installed in the atmosphere. 2. The multi according to claim 1, further comprising an orientation aligning mechanism unit for retracting the processed member so that the direction of the processed member is adjusted by the processed member conveying means. Chamber system. 3. The multi-chamber system according to claim 2, wherein the orientation alignment mechanism is installed in the pretreatment process chamber. 4. The muller according to claim 1, wherein a loader for loading and unloading a member to be processed into and out of the load lock chamber and a plurality of cassettes containing the member to be processed are arranged in the atmosphere. Chamber system. 5. The plurality of cassettes according to claim 4,
A multi-chamber system comprising one or more of a wafer cassette for storing wafers to be processed, a cassette for storing dummy wafers used between process processes, and a cassette for collecting defective wafers. 6. The load lock chamber according to claim 1, wherein the load lock chamber is connected to the transfer chamber via a gate valve, and a stage carrying a member to be processed carries the member to be processed by a loader in the atmosphere. It is installed so that it can be moved in and out by a transfer system in the transfer chamber and a transfer system in the transfer chamber, and when the loader is moved to a position where it can be transferred in and out, the stage is pressed against the seat to create an airtight small room. Forming a multi-chamber system. 7. The load lock chamber according to claim 1, wherein the load lock chamber includes a communication window communicating with the transfer chamber, a communication window communicating with the atmosphere, a communication window communicating with the building transfer line, and a gate valve provided in each communication window. A multi-chamber system characterized by being provided. 8. The multi-chamber system according to claim 1, 6 or 7, further comprising a matching mechanism for adjusting the orientation of the members to be processed in the load lock chamber. 9. a plurality of connection ports, and conveyance chamber having a workpiece member conveying means therein, and the process chamber coupled to the connecting port, connecting the connection port to the conveying line of the building In a multi-chamber system including a buffer chamber for connecting the connection port to the first surface of the buffer chamber.
The transfer line on the second surface of the buffer chamber.
The third surface of the buffer chamber
To the other side of the transfer line,
The buffer chamber connects between one side and the other side.
The partition of the buffer chamber, which is air-tight
Different from the member to be processed, which is carried into the surface from the transfer line.
Holding means for holding a member to be processed installed in the atmosphere
A sluice valve that can be carried in and out individually from the
Air-tightly partition the inlet and load the buffer chamber.
Multi-chamber system, which is also used as a back chamber.