JPS60257135A - Ion implanting device - Google Patents

Abstract

PURPOSE:To perform a wafer processing work automatically by a method wherein a dummy wafer is installed at the places where the installation of wafer is unnecessary, the background of the wafer is controlled, and after the wafer is processed, it is housed in the same cassette. CONSTITUTION:When no wafer is located in the cassette 2a to be placed at all address positions of a rotary disc 1, or when all the number of sheets of a lot is finished, the dummy wafer is conveyed to a table 3 from the cassette 2c wherein the dummy wafer is housed passing through branching points 6a and 6b, and it is installed on the rotary disc 1. When wafers are installed on all positions of the disc 1, the disc 1 is rotated, a scanning is performed, an ion beam is made to irradiate from the direction at a right angle with the rotating direction of the disc, and a wafer processing work is performed. After the above process is finished, data is given to a wafer 5b, it is conveyed to a conveying table 4, carried to a branching point 6c, and distinguished to a processed wafer or a dummy wafer. Then, the processed wafer is placed in a cassette 2b, and the dummy wafer is placed in the cassette 2c from the branching point 6b.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a system for automatically transporting wafers to an ion implantation apparatus, and more particularly to an ion implantation apparatus suitable for wafer processing using wafer cassette management and number management.

[Background of the invention]

Conventional wafer transport methods include a method in which wafers are manually loaded one by one on an Eri rotating disk, and even in automatic transport, if there is a shortage in the number of wafers to be processed when loading the wafers on the rotating disk, the cassettes to be transferred are placed in a gummy e. There is a method of replacing the wafer storage cassette. However, in the former case, the operator must memorize the history of the wafers loaded onto the rotating disk and distinguish between processed wafers and dummy wafers when unloading, and handling the wafers manually is difficult. There are problems such as damage and dust, and it also has the drawback of being contrary to labor saving. On the other hand, the latter method has drawbacks such as the need to distinguish between processed wafers and dummy m-wafers among wafers stored in a cassette for carrying out after wafer processing.

[Purpose of the invention]

An object of the present invention is to effectively transport and process wafers from a cassette that stores gummy e-wafers, and then store them in the same cassette. An ion implanter that can automatically load dummy wafers and process wafers when there is a shortage between the number of wafers stored in the cassette and the number of wafers installed on the rotating disk. is to provide.

[Summary of the invention]

The present invention provides a method for processing the wafer by mounting a wafer on a rotating disk, rotating the disk, and irradiating the ion beam with the ion beam. Since the ion beam is directly irradiated on the board and causes thermal damage, dummy wafers are mounted in areas where wafers are not needed, the history of these wafers is managed, and the wafers are stored in the cassette containing the dummy wafers. By transporting the wafers and storing them in the same cassette after processing, the wafers can be processed automatically by simply replacing the cassette containing the wafers that need to be processed.

[Embodiments of the invention]

An embodiment of the invention is shown in FIGS. 1 and 2.

Wafer 5 automatically and manually mounted on rotating disk 1
(5a, 5b) are configured to perform wafer processing by irradiating the ion beam from a direction perpendicular to the direction of rotation while rotating in the direction of the arrow, and to take out the processed wafer 5 automatically or manually. .

In FIG. 1, wafers are conveyed from a cassette 2a containing unprocessed wafers to a belt 7aK processing branch point 6a. At this time, each wafer (Al to AN
), as shown in FIG. 2, transport source cassette data is created and added to part A and storage position data in the cassette to part B.

After confirming that there is no wafer on the OF (orientation flat) detection table 3, the wafer is transported onto the table 3 by a bell 7d, and OF detection is performed. OF
After detection, it is mounted on a rotating disk l as an unprocessed wafer 5a,
Rotating disk 1. Attachment is performed sequentially while updating the address positions until all address positions (&1-&N) above are attached.

Here, when the wafers in the cassette 2a become empty before all the address positions of the rotating disk l are loaded, or when the number of wafers in the lot ends, the dummy 9 wafers are transferred from the cassette 2C in which the dummy wafers are stored. is bell) 7e, 7b
, 7d, table 3 via branch points 6b and 6a.
and mounted on the rotating disk 1. At this time, as with the wafers transferred from the cassette 2a, the data shown in FIG. 2 is added, and the history of each wafer mounted at each address position on the rotating disk l is managed by the computer.

When wafers are mounted at all address positions on the rotating disk l, the rotating disk l rotates and scans, and the ion beam is irradiated from a direction perpendicular to the rotating direction to process the wafer. Then, the wafer 5b is irradiated with a predetermined energy, and after the wafer processing is completed, the data shown in FIG. The wafer 5b reaches the edge branching point 6C at the belt 7f, where it is distinguished as a processed wafer, a shredded wafer, or a dummy wafer according to the data shown in FIG. It is stored in the cassette 2b.In addition, in the case of a dummy wafer, the belt 7
b, 7e via the Eri branch point 6b and is stored in the cassette 2C.

According to one embodiment of the present invention, there is no increase or decrease in the number of wafers in the cassette 2C in which the dummy wafers are stored. Therefore, lot management and number management of processed wafers can be easily performed, and labor saving can be realized.

〔Effect of the invention〕

According to the present invention, there is no need to consider wafer processing using an integer multiple of the address position on the wafer processing waiting rotating disk, and lot management and number management using an arbitrary number of wafers can be automatically performed. This has the effect of saving manpower.

[Brief explanation of the drawing]

FIG. 1 is a principle diagram for explaining an embodiment of the present invention, and FIG. 2 is a schematic diagram of wafer additional data. l... Rotating disk, 2a, 2b, 2c... Cassette,
3゜4---f-pull, 5a, 5b-wafer,
6a, 6b. 6C... Branching point, 7a, 7b, 7C97d, 7e. 7f...Belt. Agent Patent Attorney Akio Takahashi] 167-ku'N-Ryo(ζ

Claims (1)

[Claims] 1. A cassette containing wafers, a mechanism for automatically transporting wafers in the cassette area, and a device for performing phenol processing by mounting a plurality of wafers on the circumference of a rotating disk; In this device, which carries out processed phenos and stores them in a cassette, when there is a shortage in the number of chefs to be installed on the rotating disk, dummy phenos are transported and installed from a newly installed cassette. An ion implantation device characterized by being designed to process wafers. 2゜ A patent claim characterized in that the phenol transported from the cassette is given information on the transported cassette number and storage position number in the cassette, and the history of the wafers mounted on the rotating disk is managed. The ion implantation device according to item 1. 3. After wafer processing, the wafer is distinguished into dummy pheno 1 and processed urchin based on the information of the phenol attached to the rotating disk, and the wafer is stored in the corresponding cassette. An ion implantation device according to claim 1. 4. By using a material that is not affected by the ion beam for the dummy wafer, the wafer is transported from a specific cassette, processed after being mounted, and the processed dummy wafer is stored in the specific cassette. The ion implantation apparatus according to claim 1, wherein the ion implantation apparatus can be used as a dummy wafer without being replaced. 5. Install multiple cassettes containing dummy fist wafers for each wafer size, and place the wafers to be processed.
According to claim 1, the wafers are transported and loaded from a cassette containing wafers of the same size when necessary according to the size, and are stored in the same cassette after processing the wafers. ion implantation device.