KR100426032B1 - Semiconductor processing equipment directly connected to stock and process equipment - Google Patents
Semiconductor processing equipment directly connected to stock and process equipment Download PDFInfo
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- KR100426032B1 KR100426032B1 KR1019960046197A KR19960046197A KR100426032B1 KR 100426032 B1 KR100426032 B1 KR 100426032B1 KR 1019960046197 A KR1019960046197 A KR 1019960046197A KR 19960046197 A KR19960046197 A KR 19960046197A KR 100426032 B1 KR100426032 B1 KR 100426032B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Abstract
Description
본 발명은 반도체 공정장비에 관한 것으로, 특히 스탁과 공정장비가 직접 연결된 반도체 공정장비에 관한 것이다.The present invention relates to semiconductor processing equipment, and more particularly to semiconductor processing equipment to which stock and process equipment are directly connected.
표면처리공정, 산화공정, 박막형성공정, 리소그패피공정 등의 반도체 프로세스가 행해지는 크린룸은 최소 패턴의 1/10 크기의 입자가 제거되어야 할 정도로 초청정이 요구되는 곳인데, 그 면적이 넓을수록 크린니스, 온도, 습도 등의 제어가 어려워진다. 그리고, 반도체의 제조에 걸리는 시간이 길수록 반도체가 오염에 노출되는 시간이 길어져 반도체의 신뢰성이 떨어진다. 따라서, 크린룸 내에서의 반도체 공정장비의 배치는 크린룸의 면적활용도를 높이고 물류를 절감하는 방향으로 진행되고 있다.The clean room in which the semiconductor process such as the surface treatment process, the oxidation process, the thin film formation process, and the lithography process is performed is a place where ultra-fine particles of 1/10 of the minimum pattern are required to be removed. It becomes difficult to control the degree of cleanliness, temperature, humidity, and the like. Further, the longer the time taken to manufacture the semiconductor, the longer the semiconductor is exposed to the contamination, and the reliability of the semiconductor is deteriorated. Therefore, the arrangement of semiconductor processing equipment in the clean room is proceeding to increase the area utilization of the clean room and to reduce the logistics.
도1은 일반적인 크린룸을 나타내는 도면인데 이하, 도1을 이용하여 크린룸 내의 반도체 공정장비들의 구성과 크린룸(Clean Room) 내에서의 카세트(cassette)의 이동을 설명한다.FIG. 1 is a view showing a general clean room. Hereinafter, the configuration of semiconductor processing equipment in a clean room and the movement of a cassette in a clean room will be described with reference to FIG.
크린룸에는 표면처리공정실, 산화공정실, 박막형성공정실, 리소그패피공정실 등의 여러 공정실이 있으며 크린룸으로 유입된 카세트는 각 공정실을 거치게 된다. 한 공정실(100)에서 해당공정이 완결된 카세트는 다음 공정실에서 공정이 행해지기전에 다음 공정실의 스탁에 보관된다. 스탁에 보관중이던 카세트는 다음 공정실이 비면 스탁에서 공정실(200)로 이동된다.In the clean room, there are several process chambers such as a surface treatment process chamber, an oxidation process chamber, a thin film success chamber, and a lithographic process chamber. Cassettes introduced into the clean room pass through each process chamber. The cassette in which the process is completed in one process room 100 is stored in the stock room of the next process room before the process is performed in the next process room. The cassette that is being stored on the stock is moved from the stock store to the process room 200 when the next process room is empty.
한 공정실에는 여러 공정장비가 있는데, 공정장비에 의해 소정의 처리가 행해진 카세트는 스탁으로 이동한다. 스탁에 보관중이던 카세트는 다음 공정장비가 다른 카세트를 처리하고 있지 않고 있다면 다음 공정장비로 이동된다. 한 공정실에서의 카세트의 이동을 설명하면 제1공정장비(110)에 의해 제1공정이 행해진 카세트는 자동반송장치(20)에 의해 스탁(10)으로 이동되거나 비어있는 검사장비(30)로 이동되는데 주로 스탁(10)으로 이동된다. 스탁으로 이동된 카세트는 자동반송장치에 의해 검사장비(30)로 이동된다. 검사장비에서는 각 공정장비에서 행해진 소정의 공정이 제대로 완결되었는지가 검사된다. 검사가 완료된 카세트는 다시 자동반송장치(20)에 의해 다시 스탁(10)으로 이동된다. 스탁으로 이동된 카세트는자동반송장치(20)에 의해 제2공정장비(120)로 이동된다. 제2공정장비(120)에 의해 제2공정이 행해진 카세트는 다시 자동반송장치(20)에 의해 스탁(10)으로 이동된다.There are several process equipments in one process room, and the cassettes that have been processed by the process equipments move to the stock. A cassette that is being stored on the stock is moved to the next process equipment if the next process equipment is not processing another cassette. Describing the movement of the cassette in one process room, the cassette in which the first process is performed by the first process equipment 110 is moved to the stock 10 by the automatic transfer device 20 or is transferred to the empty inspection equipment 30 And is mainly moved to the stock 10. The cassette moved to the stack is moved to the inspection equipment (30) by the automatic conveying device. In the inspection equipment, it is checked whether the predetermined process performed in each process equipment is completed properly. The cassette whose inspection has been completed is again moved to the stock 10 by the automatic conveyance device 20 again. The cassette moved to the stack is moved to the second processing equipment 120 by the automatic conveying device 20. The cassette having undergone the second process by the second process equipment 120 is again moved to the stock 10 by the automatic conveyance device 20.
반도체 프로세서에서 카세트의 공정실간의 이동 및 한 공정실내의 장비간의 이동은 자동반송장치에 의해 이루어지며 카세트는 각 공정실간의 이동 및 한 공정실내의 장비간의 이동시 반드시 스탁에 보관된다. 카세트의 이동은 공정장비와 스탁의 호스트 및 자동반송장치와의 인터페이스 등을 요구하는 독립적인 정보자동화방식에 바탕을 두고 있다.Movement of the cassette between process chambers in a semiconductor processor and movement between equipment in one process is performed by automatic conveying device, and the cassette is always staked when moving between process chambers and moving between equipment in one process. The movement of the cassette is based on an independent information automation system which requires the interface between the process equipment and the host of STACK and the automatic transport device.
카세트가 한 공정실에서 다른 공정실로 이동할 때, 한 공정실내의 한 장비에서 다른 장비로 이동할 때는 반드시 스탁을 경유한다. 카세트가 한 공정장비에서 스탁으로, 스탁에서 또 다른 공정장비로 이동될 때 그 이동거리가 길수록 물류가 증가한다. 물류의 증가는 반도체의 제조에 걸리는 시간의 증가, 카세트의 오염가능성의 증가, 비용상승 등을 가져온다. 그런데, 일반적인 반도체 공정장비에서는 카세트가 공정장비에서 자동반송장치로, 자동반송장치에서 스탁으로, 스탁에서 자동반송장치로, 자동반송장치에서 검사장비로, 검사장비에서 자동반송장치로, 자동반송장치에서 스탁으로 이동되어 반도체의 제조에 걸리는 시간이 길며 반도체가 오염될 확률이 높아서 물류가 단축될 필요가 있었다. 그리고, 각 장비마다 장비의 가동률을 높이기 위한 복수의 로더(loader) 및 언로더(unloader)가 설치되어 있는데 단수의 로더 및 언로더만 설치될 때보다 비용이 많이 든다. 게다가 독립자동화방식을 위해 필요한 각 장비간의 인터페이스요구사양에 의해서도 비용이 많이 든다.When a cassette moves from one process room to another, it must pass through the stack when moving from one piece of equipment to another. When the cassette moves from one process equipment to the stark, from the stock to another process equipment, the longer the movement distance, the more the logistics increases. The increase of the logistics leads to an increase in the time taken to manufacture the semiconductor, an increase in the possibility of contamination of the cassette, and an increase in cost. However, in general semiconductor processing equipment, cassettes are used as process equipment, automatic conveying equipment, automatic conveying equipment to stark, stock to automatic conveying equipment, automatic conveying equipment to inspection equipment, inspection equipment to automatic conveying equipment, The time taken to manufacture the semiconductor is long and the probability of contamination of the semiconductor is high, so that the logistics need to be shortened. In addition, a plurality of loaders and unloaders are installed for each equipment to increase the operation rate of the equipment, which is more expensive than when only a single loader and unloader are installed. In addition, the cost of the interface requirements for each piece of equipment required for independent automation is also high.
본 발명의 목적은 공정장비와 스탁간의 이동거리가 짧은 반도체 공정장비를 제공하는 것이다. 본 발명의 또 다른 목적은 공정장비와 스탁간의 이동거리가 짧아 반도체의 제조시간이 짧아질 수 있는 반도체 공정장비를 제공하는 것이다. 본 발명의 또 다른 목적은 반도체 제조에 걸리는 시간이 짧아 반도체의 오염가능성을 낮출 수 반도체 공정장비를 제공하는 것이다.It is an object of the present invention to provide a semiconductor process equipment having a short travel distance between process equipment and stock. It is still another object of the present invention to provide a semiconductor processing equipment which can shorten the manufacturing time of semiconductor by shortening the moving distance between the processing equipment and the stark. It is still another object of the present invention to provide a semiconductor processing equipment capable of reducing the possibility of contamination of a semiconductor by shortening the time taken to manufacture the semiconductor.
도1은 종래의 일반적인 크린룸의 레이아웃도이다.1 is a layout view of a conventional clean room.
도2, 도3은 본 발명의 반도체 공정장비의 개략적인 모습을 나타내는 도면이다.FIGS. 2 and 3 are views showing a schematic view of the semiconductor processing equipment of the present invention.
*도면의 주요부분에 대한 설명*Description of the Related Art [0002]
10 : 스탁 30 : 검사장비10: STACK 30: Inspection equipment
20 : 자동반송장치 100, 200... : 공정실20: Automatic conveying apparatus 100, 200 ...: Process chamber
110,120... : 공정장비110,120 ...: Process equipment
이러한 목적을 달성하기 위한 반도체 프로세스가 행해지는 크린룸 내의 반도체 공정장비는 복수 개의 공정장비와, 상기 각각의 공정장비와 서로 공유되는 부분을 갖는 스탁(stock)으로 이루어져 있다.Semiconductor processing equipment in a clean room in which a semiconductor process is performed to accomplish this purpose is composed of a plurality of process equipment and stocks having parts shared with the respective process equipment.
본 발명의 반도체공정장비의 스탁은 공정장비의 일부분이 상기 스탁 내로 삽입될 수 있는 함몰부가 형성되어 상기 공정장비와 일부분을 서로 공유한다.The stack of the semiconductor process equipment of the present invention is formed with a depression in which a part of the process equipment can be inserted into the stock to share a part with the process equipment.
도2와 도3은 본 발명에 따르는 반도체공정장비의 개략적인 형태를 나타내는 도면인데 이하, 도2와 도3을 이용하여 본 발명에 따르는 반도체 공정장비가 설치된 크린룸 내에서의 카세트의 이동을 설명한다.2 and 3 are schematic views of semiconductor processing equipment according to the present invention. Referring to FIGS. 2 and 3, the movement of a cassette in a clean room equipped with semiconductor processing equipment according to the present invention will be described .
먼저, 도2를 참조하면, 스탁(20)은 한 공정실의 중앙에 위치한다. 스탁의 함몰부에는 공정장비가 삽입되어 있어 스탁의 좌우측을 비롯한 측부에 복수 개의 공정장비가 직접 연결되어 있다. 각각의 공정장비의 로더와 언로더가 스탁내로 삽입되어 있다. 제1공정이 행해진 카세트는 제1공정장비(110)의 언로더에 의해 제1공정장비에서 스탁(10)으로 이동된다. 스탁으로 이동된 카세트는 이송로봇에 의해 스탁내의 빈 곳으로 이동된다. 빈 곳에 보관되어 있던 카세트는 이송로봇에 의해 이동되어 비어 있는 제2공정장비(120)의 로더에 놓여진다. 제2공정이 행해진 카세트는 제2공정장비(120)의 언로더에 의해 스탁(10)으로 이동된다. 상기의 과정이 반복되어 한 공정실 내의 모든 공정이 행해진 카세트는 다른 공정실의 스탁으로 이동된다. 상기의 스탁에 연결된 공정장비에는 검사장비도 포함된다.First, referring to FIG. 2, the stock 20 is located at the center of one process room. The process equipment is inserted in the depression of the stock, and a plurality of process equipments are directly connected to the side including the left and right sides of the stock. Loaders and unloaders of each process equipment are inserted into the stock. The cassette in which the first process is performed is moved from the first process equipment to the stock 10 by the unloader of the first process equipment 110. The cassette moved to the stack is moved to the empty space in the stock by the transfer robot. The cassette stored in the empty space is moved by the transfer robot and placed in the loader of the second process equipment 120 which is empty. The cassette subjected to the second process is moved to the stock 10 by the unloader of the second process equipment 120. The above process is repeated, and the cassette in which all processes in one process chamber are performed is moved to the stock in another process chamber. The process equipment connected to the STOCK also includes inspection equipment.
도3을 참조하면, 자동반송장치(20)의 좌우측을 비롯한 측부에 복수 개의 공정장비가 연결되어 있다. 스탁(10)도 자동반송장치(20)와 연결되어 있다. 자동반송장치(20)와 연결된 스탁(10)의 여러 함몰부에는 복수의 검사장비(30)가 삽입되어 있다. 제1공정이 행해진 카세트는 제1공정장비(110)의 언로더에 의해 자동반송장치에 놓여지고, 자동반송장치에서 스탁으로 이동된다. 이송로봇에 의해 스탁내의 빈 곳으로 이동된 카세트는 보관된 채로 있다가 이송로봇에 의해 비어있는 검사장비(30)의 로더에 놓여진다. 검사가 행해진 카세트는 검사장비(30)의 언로더에 의해 스탁으로 이동되고 이송로봇에 의해 스탁내의 빈 곳으로 이동되어 보관된 채로 있다. 제2공정장비가 비게 되면 스탁(10)에 보관되어 있던 카세트는 이송로봇에 의해 자동반송장치(20)에 놓여지고 자동반송장치에서 제2공정장비(120)로 이동된다. 제2공정이 행해진 카세트는 상기의 같은 과정을 거쳐 제3공정장비(130), 제4공정장비(140)... 로 이동되며, 한 공정실 내의 모든 공정이 행해지면 다른 공정실의 스탁으로 이동된다. 상기의 스탁에는 검사장비 외에도 공정장비를 연결할 수도 있다. 스탁을 공정장비와 같은 방향으로 놓으면 크린룸의 면적활용도를 높일 수 있다.Referring to FIG. 3, a plurality of process equipments are connected to the side portions including the right and left sides of the automatic transfer device 20. The stock 10 is also connected to the automatic conveying device 20. A plurality of inspection equipments 30 are inserted into various depressions of the stock 10 connected to the automatic conveying apparatus 20. The cassette in which the first process is performed is placed in the automatic transfer device by the unloader of the first process equipment 110, and is moved to the stock in the automatic transfer device. The cassette moved by the transfer robot to the vacant space in the stamper is stored and placed in the loader of the inspection equipment 30 which is empty by the transfer robot. The cassette inspected is moved to the stall by the unloader of the inspection equipment 30 and is moved to the empty space in the stall by the transfer robot and remains stored. When the second process equipment is empty, the cassette stored in the stock 10 is placed on the automatic transfer device 20 by the transfer robot and transferred from the automatic transfer device to the second process equipment 120. The cassette in which the second process is performed is transferred to the third process equipment 130, the fourth process equipment 140, etc. through the same process as described above. When all processes in one process room are performed, . In addition to inspection equipment, process equipment may be connected to the above stock. Placing STACK in the same direction as the process equipment can increase the area utilization of the clean room.
본 발명의 반도체 공정장비의 스탁에는 공정장비의 일부분이 삽입될 수 있는 함몰부가 형성되어 있어 스탁과 공정장비가 직접 연결된다. 따라서, 스탁과 공정장비간의 이동거리가 종래의 반도체 공정장비의 스탁과 공정장비간의 이동거리보다 짧아서 반도체의 제조에 걸리는 시간이 종래보다 1/4정도로 줄어든다. 제조에 걸리는 시간이 짧아져 종래보다 단위시간에 많은 양의 반도체를 생산할 수 있으며 반도체의 오염가능성이 낮아진다. 그리고 공정장비와 스탁이 직접연결되어 공정장비와 스탁의 호스트와의 인터페이스만 필요하며 장비가격이 절감되며 필요한 크린룸의 면적이 줄어든다.The stack of the semiconductor process equipment of the present invention is formed with depressions into which a part of the process equipment can be inserted, thereby directly connecting the stock and the process equipment. Therefore, the moving distance between the stock and the process equipment is shorter than the moving distance between the stock and the process equipment of the conventional semiconductor process equipment, and the time required for manufacturing the semiconductor is reduced to about 1/4 of the conventional one. The manufacturing time is shortened, so that a larger amount of semiconductor can be produced per unit time than in the prior art, and the possibility of contamination of the semiconductor is lowered. In addition, the process equipment and STACK are directly connected, requiring only the interface between the process equipment and the STACK's host, reducing the equipment cost and reducing the area of the required clean room.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960046197A KR100426032B1 (en) | 1996-10-16 | 1996-10-16 | Semiconductor processing equipment directly connected to stock and process equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960046197A KR100426032B1 (en) | 1996-10-16 | 1996-10-16 | Semiconductor processing equipment directly connected to stock and process equipment |
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| Publication Number | Publication Date |
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| KR19980027416A KR19980027416A (en) | 1998-07-15 |
| KR100426032B1 true KR100426032B1 (en) | 2004-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019960046197A KR100426032B1 (en) | 1996-10-16 | 1996-10-16 | Semiconductor processing equipment directly connected to stock and process equipment |
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| EP2031638A3 (en) * | 2000-07-07 | 2012-04-04 | Tokyo Electron Limited | A method of automatically resetting a processing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186652A (en) * | 1990-11-16 | 1992-07-03 | Hitachi Kiden Kogyo Ltd | Carry system for clean room |
| JPH06120318A (en) * | 1992-10-08 | 1994-04-28 | Fuji Electric Co Ltd | Wafer washer |
| KR970067758A (en) * | 1996-03-19 | 1997-10-13 | 김광호 | Carrier for semiconductor manufacturing |
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1996
- 1996-10-16 KR KR1019960046197A patent/KR100426032B1/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186652A (en) * | 1990-11-16 | 1992-07-03 | Hitachi Kiden Kogyo Ltd | Carry system for clean room |
| JPH06120318A (en) * | 1992-10-08 | 1994-04-28 | Fuji Electric Co Ltd | Wafer washer |
| KR970067758A (en) * | 1996-03-19 | 1997-10-13 | 김광호 | Carrier for semiconductor manufacturing |
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| KR19980027416A (en) | 1998-07-15 |
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