JP7609897B2 - 基板ハンドリング用局所化パージモジュール - Google Patents

基板ハンドリング用局所化パージモジュール Download PDF

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Publication number
JP7609897B2
JP7609897B2 JP2022576080A JP2022576080A JP7609897B2 JP 7609897 B2 JP7609897 B2 JP 7609897B2 JP 2022576080 A JP2022576080 A JP 2022576080A JP 2022576080 A JP2022576080 A JP 2022576080A JP 7609897 B2 JP7609897 B2 JP 7609897B2
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Japan
Prior art keywords
substrate
enclosure
end effector
arm
purge gas
Prior art date
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Active
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JP2022576080A
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English (en)
Japanese (ja)
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JP2023530629A (ja
JPWO2021252213A5 (https=
JP2023530629A5 (https=
Inventor
ツァチ プレスバーガー
イゴール ボルコフ
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KLA Corp
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KLA Corp
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Publication of JP2023530629A publication Critical patent/JP2023530629A/ja
Publication of JPWO2021252213A5 publication Critical patent/JPWO2021252213A5/ja
Publication of JP2023530629A5 publication Critical patent/JP2023530629A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0058—Means for cleaning manipulators, e.g. dust removing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2022576080A 2020-06-10 2021-05-30 基板ハンドリング用局所化パージモジュール Active JP7609897B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063037008P 2020-06-10 2020-06-10
US63/037,008 2020-06-10
US17/018,912 2020-09-11
US17/018,912 US11315816B2 (en) 2020-06-10 2020-09-11 Localized purge module for substrate handling
PCT/US2021/035055 WO2021252213A1 (en) 2020-06-10 2021-05-30 Localized purge module for substrate handling

Publications (4)

Publication Number Publication Date
JP2023530629A JP2023530629A (ja) 2023-07-19
JPWO2021252213A5 JPWO2021252213A5 (https=) 2024-03-19
JP2023530629A5 JP2023530629A5 (https=) 2024-03-19
JP7609897B2 true JP7609897B2 (ja) 2025-01-07

Family

ID=78825911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576080A Active JP7609897B2 (ja) 2020-06-10 2021-05-30 基板ハンドリング用局所化パージモジュール

Country Status (6)

Country Link
US (1) US11315816B2 (https=)
JP (1) JP7609897B2 (https=)
KR (1) KR102861296B1 (https=)
CN (2) CN119427428A (https=)
TW (1) TWI870578B (https=)
WO (1) WO2021252213A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12578285B2 (en) 2022-10-25 2026-03-17 Kla Corporation Gas flow configurations for semiconductor inspections

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP2003092335A (ja) 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
JP2009023021A (ja) 2007-07-18 2009-02-05 Yaskawa Electric Corp 基板搬送ロボット及びそれを備えた半導体製造装置

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JPH06326036A (ja) 1993-05-11 1994-11-25 Nissin Electric Co Ltd 気相成長装置
TW471008B (en) * 1999-07-09 2002-01-01 Tokyo Electron Ltd Substrate transport device
KR20040013965A (ko) 2002-08-09 2004-02-14 삼성전자주식회사 멀티 챔버형의 공정설비
JP3560962B1 (ja) * 2003-07-02 2004-09-02 エス・イー・エス株式会社 基板処理法及び基板処理装置
KR100534027B1 (ko) * 2004-02-09 2005-12-07 세메스 주식회사 기판 반송 장치
US7542127B2 (en) 2005-12-21 2009-06-02 Asml Netherlands B.V. Lithographic apparatus and method for manufacturing a device
US7755764B2 (en) 2007-01-26 2010-07-13 Kla-Tencor Corporation Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP2010080469A (ja) * 2008-09-24 2010-04-08 Tokyo Electron Ltd 真空処理装置及び真空搬送装置
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8830486B2 (en) 2011-07-04 2014-09-09 Kla-Tencor Corporation Atmospheric molecular contamination control with local purging
JP2013161924A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd 基板収容容器のパージ装置及びパージ方法
US9244368B2 (en) 2012-09-26 2016-01-26 Kla-Tencor Corporation Particle control near reticle and optics using showerhead
US9257320B2 (en) 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
US9488924B2 (en) 2014-01-07 2016-11-08 Applied Materials Israel Ltd. Cleaning an object within a non-vacuumed environment
JP6226190B2 (ja) 2014-02-20 2017-11-08 Tdk株式会社 パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置
CN104907283B (zh) * 2014-03-11 2018-03-27 上海华虹宏力半导体制造有限公司 一种晶片清洁室
US10082461B2 (en) 2014-07-29 2018-09-25 Nanometrics Incorporated Optical metrology with purged reference chip
KR20210080633A (ko) 2014-11-25 2021-06-30 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들
WO2016205191A1 (en) 2015-06-17 2016-12-22 Entegris, Inc. Flow modification fixture for an equipment front end module
WO2018030255A1 (ja) * 2016-08-09 2018-02-15 近藤工業株式会社 半導体製造装置
JP6876417B2 (ja) * 2016-12-02 2021-05-26 東京エレクトロン株式会社 基板処理装置の洗浄方法および基板処理装置の洗浄システム
CN111052336B (zh) * 2017-09-01 2024-03-01 株式会社国际电气 基板处理装置、半导体装置的制造方法及记录介质
US10283393B1 (en) 2017-11-08 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrying fork, semiconductor device manufacturing system, and wafer transporting method
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KR20190079027A (ko) * 2017-12-27 2019-07-05 주식회사 케이씨텍 기판 이송 장치
KR102067752B1 (ko) * 2018-02-09 2020-01-17 (주)에스티아이 풉 세정 장치 및 풉 세정 방법
KR102132422B1 (ko) 2018-03-14 2020-08-05 우범제 이에프이엠
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US11749537B2 (en) * 2018-10-26 2023-09-05 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating equipment front end modules
KR102212996B1 (ko) * 2019-01-02 2021-02-08 피에스케이홀딩스 (주) 기판 처리 장치 및 기판 처리 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP2003092335A (ja) 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
JP2009023021A (ja) 2007-07-18 2009-02-05 Yaskawa Electric Corp 基板搬送ロボット及びそれを備えた半導体製造装置

Also Published As

Publication number Publication date
TW202202242A (zh) 2022-01-16
US20210391200A1 (en) 2021-12-16
WO2021252213A1 (en) 2021-12-16
JP2023530629A (ja) 2023-07-19
KR102861296B1 (ko) 2025-09-17
CN115768604A (zh) 2023-03-07
US11315816B2 (en) 2022-04-26
CN119427428A (zh) 2025-02-14
KR20230022879A (ko) 2023-02-16
TWI870578B (zh) 2025-01-21

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