CN119427428A - 用于衬底处置的局部清洗模块 - Google Patents

用于衬底处置的局部清洗模块 Download PDF

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Publication number
CN119427428A
CN119427428A CN202411596147.1A CN202411596147A CN119427428A CN 119427428 A CN119427428 A CN 119427428A CN 202411596147 A CN202411596147 A CN 202411596147A CN 119427428 A CN119427428 A CN 119427428A
Authority
CN
China
Prior art keywords
substrate
housing
rotatable platform
end effector
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202411596147.1A
Other languages
English (en)
Chinese (zh)
Inventor
T·普雷斯伯格
I·沃尔科夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN119427428A publication Critical patent/CN119427428A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0058—Means for cleaning manipulators, e.g. dust removing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN202411596147.1A 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块 Pending CN119427428A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US202063037008P 2020-06-10 2020-06-10
US63/037,008 2020-06-10
US17/018,912 2020-09-11
US17/018,912 US11315816B2 (en) 2020-06-10 2020-09-11 Localized purge module for substrate handling
PCT/US2021/035055 WO2021252213A1 (en) 2020-06-10 2021-05-30 Localized purge module for substrate handling
CN202180039711.8A CN115768604A (zh) 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202180039711.8A Division CN115768604A (zh) 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块

Publications (1)

Publication Number Publication Date
CN119427428A true CN119427428A (zh) 2025-02-14

Family

ID=78825911

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202411596147.1A Pending CN119427428A (zh) 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块
CN202180039711.8A Pending CN115768604A (zh) 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202180039711.8A Pending CN115768604A (zh) 2020-06-10 2021-05-30 用于衬底处置的局部清洗模块

Country Status (6)

Country Link
US (1) US11315816B2 (https=)
JP (1) JP7609897B2 (https=)
KR (1) KR102861296B1 (https=)
CN (2) CN119427428A (https=)
TW (1) TWI870578B (https=)
WO (1) WO2021252213A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12578285B2 (en) 2022-10-25 2026-03-17 Kla Corporation Gas flow configurations for semiconductor inspections

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JPH06326036A (ja) 1993-05-11 1994-11-25 Nissin Electric Co Ltd 気相成長装置
JP2000040730A (ja) 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
TW471008B (en) * 1999-07-09 2002-01-01 Tokyo Electron Ltd Substrate transport device
JP2003092335A (ja) 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
KR20040013965A (ko) 2002-08-09 2004-02-14 삼성전자주식회사 멀티 챔버형의 공정설비
JP3560962B1 (ja) * 2003-07-02 2004-09-02 エス・イー・エス株式会社 基板処理法及び基板処理装置
KR100534027B1 (ko) * 2004-02-09 2005-12-07 세메스 주식회사 기판 반송 장치
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US7755764B2 (en) 2007-01-26 2010-07-13 Kla-Tencor Corporation Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry
JP4766274B2 (ja) 2007-07-18 2011-09-07 株式会社安川電機 基板搬送ロボット及びそれを備えた半導体製造装置
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP2010080469A (ja) * 2008-09-24 2010-04-08 Tokyo Electron Ltd 真空処理装置及び真空搬送装置
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8830486B2 (en) 2011-07-04 2014-09-09 Kla-Tencor Corporation Atmospheric molecular contamination control with local purging
JP2013161924A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd 基板収容容器のパージ装置及びパージ方法
US9244368B2 (en) 2012-09-26 2016-01-26 Kla-Tencor Corporation Particle control near reticle and optics using showerhead
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JP6226190B2 (ja) 2014-02-20 2017-11-08 Tdk株式会社 パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置
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Also Published As

Publication number Publication date
TW202202242A (zh) 2022-01-16
US20210391200A1 (en) 2021-12-16
WO2021252213A1 (en) 2021-12-16
JP2023530629A (ja) 2023-07-19
KR102861296B1 (ko) 2025-09-17
CN115768604A (zh) 2023-03-07
US11315816B2 (en) 2022-04-26
JP7609897B2 (ja) 2025-01-07
KR20230022879A (ko) 2023-02-16
TWI870578B (zh) 2025-01-21

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