TWI869664B - 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 - Google Patents

聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 Download PDF

Info

Publication number
TWI869664B
TWI869664B TW111112434A TW111112434A TWI869664B TW I869664 B TWI869664 B TW I869664B TW 111112434 A TW111112434 A TW 111112434A TW 111112434 A TW111112434 A TW 111112434A TW I869664 B TWI869664 B TW I869664B
Authority
TW
Taiwan
Prior art keywords
general formula
polyimide
group
polyamide
organic group
Prior art date
Application number
TW111112434A
Other languages
English (en)
Chinese (zh)
Other versions
TW202246391A (zh
Inventor
加藤聡
佐藤雄太
柏田健
金田隆行
頼末友裕
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202246391A publication Critical patent/TW202246391A/zh
Application granted granted Critical
Publication of TWI869664B publication Critical patent/TWI869664B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW111112434A 2021-04-02 2022-03-31 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 TWI869664B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021063386 2021-04-02
JP2021-063386 2021-04-02
JP2021063358 2021-04-02
JP2021-063358 2021-04-02
JP2021-196485 2021-12-02
JP2021196485 2021-12-02

Publications (2)

Publication Number Publication Date
TW202246391A TW202246391A (zh) 2022-12-01
TWI869664B true TWI869664B (zh) 2025-01-11

Family

ID=83459655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111112434A TWI869664B (zh) 2021-04-02 2022-03-31 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

Country Status (4)

Country Link
JP (3) JP7174199B1 (enrdf_load_stackoverflow)
KR (1) KR20230147181A (enrdf_load_stackoverflow)
TW (1) TWI869664B (enrdf_load_stackoverflow)
WO (1) WO2022211086A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JPWO2023063202A1 (enrdf_load_stackoverflow) * 2021-10-12 2023-04-20
WO2024048740A1 (ja) * 2022-08-31 2024-03-07 旭化成株式会社 樹脂組成物
CN116693911A (zh) * 2023-01-04 2023-09-05 昆山雅森电子材料科技有限公司 复合膜及其制备方法
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201302859A (zh) * 2011-06-13 2013-01-16 Kaneka Corp 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺溶液、由此等溶液所得之聚醯亞胺膜及聚醯亞胺膜之利用
TW201531526A (zh) * 2014-02-14 2015-08-16 Asahi Kasei E Materials Corp 聚醯亞胺前驅體及含有其之樹脂組合物
TW202045592A (zh) * 2019-03-20 2020-12-16 日商鐘化股份有限公司 聚醯胺酸組合物及其製造方法、聚醯胺酸溶液、聚醯亞胺、聚醯亞胺膜、積層體及其製造方法、與可撓性裝置及其製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595381U (enrdf_load_stackoverflow) 1979-12-27 1980-07-02
JPS6073528U (ja) 1983-10-27 1985-05-23 許 弼律 居室用キヤビネツト
JPS63101424A (ja) 1986-10-17 1988-05-06 Tosoh Corp ポリイミド樹脂
JPS63110219A (ja) 1986-10-28 1988-05-14 Tosoh Corp ポリイミド樹脂の製造方法
JPS6443579U (enrdf_load_stackoverflow) 1987-09-09 1989-03-15
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
US6444783B1 (en) * 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP4870173B2 (ja) * 2003-04-07 2012-02-08 三井化学株式会社 ポリイミド金属積層板
JP4627297B2 (ja) 2004-05-21 2011-02-09 マナック株式会社 低線熱膨張係数を有するポリエステルイミドとその前駆体
JP2009167235A (ja) * 2008-01-11 2009-07-30 Ube Ind Ltd ポリイミドフィルムの製造方法
JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
US8730437B2 (en) * 2010-04-14 2014-05-20 Chi Mei Corporation Method for making a treated polymer for a liquid crystal alignment agent, the treated polymer made thereby, and liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element containing the treated polymer
JP5362752B2 (ja) * 2011-01-26 2013-12-11 Jfeケミカル株式会社 ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法
JP2012173453A (ja) * 2011-02-21 2012-09-10 Jsr Corp 液晶配向剤および液晶表示素子
JP6036361B2 (ja) * 2013-02-07 2016-11-30 宇部興産株式会社 ポリイミドフィルムおよびそれを用いたポリイミド金属積層体
JP6593021B2 (ja) * 2015-08-07 2019-10-23 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
KR102133559B1 (ko) * 2015-09-24 2020-07-13 아사히 가세이 가부시키가이샤 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
WO2019106952A1 (ja) * 2017-11-30 2019-06-06 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
WO2019211972A1 (ja) 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP7392660B2 (ja) * 2018-12-28 2023-12-06 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
TWI819102B (zh) * 2019-01-17 2023-10-21 日商Jsr股份有限公司 液晶配向劑、液晶配向膜、液晶元件及其製造方法
JP6690057B1 (ja) * 2019-02-01 2020-04-28 ウィンゴーテクノロジー株式会社 ポリイミド化合物及び該ポリイミド化合物を含む成形物
US11603440B2 (en) * 2019-09-12 2023-03-14 Dupont Electronics, Inc. Polyimide films and electronic devices
WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
KR20230007329A (ko) * 2020-04-16 2023-01-12 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JP7519812B2 (ja) * 2020-05-28 2024-07-22 太陽ホールディングス株式会社 ポリアミド酸、ポリイミド及びポリイミドフィルム
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201302859A (zh) * 2011-06-13 2013-01-16 Kaneka Corp 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺溶液、由此等溶液所得之聚醯亞胺膜及聚醯亞胺膜之利用
TW201531526A (zh) * 2014-02-14 2015-08-16 Asahi Kasei E Materials Corp 聚醯亞胺前驅體及含有其之樹脂組合物
TW202045592A (zh) * 2019-03-20 2020-12-16 日商鐘化股份有限公司 聚醯胺酸組合物及其製造方法、聚醯胺酸溶液、聚醯亞胺、聚醯亞胺膜、積層體及其製造方法、與可撓性裝置及其製造方法

Also Published As

Publication number Publication date
TW202246391A (zh) 2022-12-01
JP2024036637A (ja) 2024-03-15
JP7436606B2 (ja) 2024-02-21
JP7174199B1 (ja) 2022-11-17
WO2022211086A1 (ja) 2022-10-06
JP2022190112A (ja) 2022-12-22
KR20230147181A (ko) 2023-10-20
JPWO2022211086A1 (enrdf_load_stackoverflow) 2022-10-06

Similar Documents

Publication Publication Date Title
JP7152381B2 (ja) 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP7055832B2 (ja) ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
JP2022128480A (ja) ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
TWI869664B (zh) 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JP7412094B2 (ja) ポリイミド前駆体樹脂組成物
TWI859238B (zh) 聚醯亞胺前驅體及聚醯亞胺樹脂組合物
KR102593077B1 (ko) 폴리이미드 전구체 및 그것을 포함하는 수지 조성물, 폴리이미드 수지막, 수지 필름 및 그 제조 방법
JP7483480B2 (ja) ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
CN117120516A (zh) 聚酰亚胺、树脂组合物、聚酰亚胺薄膜和其制造方法
JP2023008992A (ja) 樹脂組成物
JP2023008996A (ja) 樹脂組成物
TW202523736A (zh) 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
TWI836943B (zh) 樹脂組合物
JP7376274B2 (ja) ポリイミド前駆体樹脂組成物
KR20250044750A (ko) 수지 조성물
JP2022082450A (ja) 樹脂組成物
JP2024035165A (ja) 樹脂組成物