KR20230147181A - 폴리이미드, 수지 조성물, 폴리이미드 필름, 및, 그 제조 방법 - Google Patents

폴리이미드, 수지 조성물, 폴리이미드 필름, 및, 그 제조 방법 Download PDF

Info

Publication number
KR20230147181A
KR20230147181A KR1020237032268A KR20237032268A KR20230147181A KR 20230147181 A KR20230147181 A KR 20230147181A KR 1020237032268 A KR1020237032268 A KR 1020237032268A KR 20237032268 A KR20237032268 A KR 20237032268A KR 20230147181 A KR20230147181 A KR 20230147181A
Authority
KR
South Korea
Prior art keywords
group
general formula
polyimide
polyamic acid
organic group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237032268A
Other languages
English (en)
Korean (ko)
Inventor
사토시 가토
유타 사토
다케시 가시와다
다카유키 가나다
도모히로 요리스에
Original Assignee
아사히 가세이 가부시키가이샤
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤, 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Publication of KR20230147181A publication Critical patent/KR20230147181A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020237032268A 2021-04-02 2022-03-31 폴리이미드, 수지 조성물, 폴리이미드 필름, 및, 그 제조 방법 Pending KR20230147181A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2021-063358 2021-04-02
JPJP-P-2021-063386 2021-04-02
JP2021063386 2021-04-02
JP2021063358 2021-04-02
JP2021196485 2021-12-02
JPJP-P-2021-196485 2021-12-02
PCT/JP2022/016837 WO2022211086A1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Publications (1)

Publication Number Publication Date
KR20230147181A true KR20230147181A (ko) 2023-10-20

Family

ID=83459655

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237032268A Pending KR20230147181A (ko) 2021-04-02 2022-03-31 폴리이미드, 수지 조성물, 폴리이미드 필름, 및, 그 제조 방법

Country Status (4)

Country Link
JP (3) JP7174199B1 (enrdf_load_stackoverflow)
KR (1) KR20230147181A (enrdf_load_stackoverflow)
TW (1) TWI869664B (enrdf_load_stackoverflow)
WO (1) WO2022211086A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JPWO2023063202A1 (enrdf_load_stackoverflow) * 2021-10-12 2023-04-20
WO2024048740A1 (ja) * 2022-08-31 2024-03-07 旭化成株式会社 樹脂組成物
CN116693911A (zh) * 2023-01-04 2023-09-05 昆山雅森电子材料科技有限公司 复合膜及其制备方法
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595381U (enrdf_load_stackoverflow) 1979-12-27 1980-07-02
JPS6073528U (ja) 1983-10-27 1985-05-23 許　弼律 居室用キヤビネツト
JPS63101424A (ja) 1986-10-17 1988-05-06 Tosoh Corp ポリイミド樹脂
JPS63110219A (ja) 1986-10-28 1988-05-14 Tosoh Corp ポリイミド樹脂の製造方法
JPS6443579U (enrdf_load_stackoverflow) 1987-09-09 1989-03-15
WO2005113647A1 (ja) 2004-05-21 2005-12-01 Manac Inc 低線熱膨張係数を有するポリエステルイミドとその前駆体
WO2019211972A1 (ja) 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
WO2020138360A1 (ja) 2018-12-28 2020-07-02 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
US6444783B1 (en) * 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP4870173B2 (ja) * 2003-04-07 2012-02-08 三井化学株式会社 ポリイミド金属積層板
JP2009167235A (ja) * 2008-01-11 2009-07-30 Ube Ind Ltd ポリイミドフィルムの製造方法
JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
US8730437B2 (en) * 2010-04-14 2014-05-20 Chi Mei Corporation Method for making a treated polymer for a liquid crystal alignment agent, the treated polymer made thereby, and liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element containing the treated polymer
JP5362752B2 (ja) * 2011-01-26 2013-12-11 Ｊｆｅケミカル株式会社 ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法
JP2012173453A (ja) * 2011-02-21 2012-09-10 Jsr Corp 液晶配向剤および液晶表示素子
WO2012173126A1 (ja) * 2011-06-13 2012-12-20 株式会社カネカ ポリアミド酸、ポリイミド、ポリアミド酸溶液、ポリイミド溶液、およびこれらの溶液から得られるポリイミド膜、ならびにポリイミド膜の利用
JP6036361B2 (ja) * 2013-02-07 2016-11-30 宇部興産株式会社 ポリイミドフィルムおよびそれを用いたポリイミド金属積層体
CN105916910B (zh) * 2014-02-14 2019-02-19 旭化成株式会社 聚酰亚胺前体和含有其的树脂组合物
JP6593021B2 (ja) * 2015-08-07 2019-10-23 Ｊｓｒ株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
KR102133559B1 (ko) * 2015-09-24 2020-07-13 아사히 가세이 가부시키가이샤 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
WO2019106952A1 (ja) * 2017-11-30 2019-06-06 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
TWI819102B (zh) * 2019-01-17 2023-10-21 日商Ｊｓｒ股份有限公司 液晶配向劑、液晶配向膜、液晶元件及其製造方法
JP6690057B1 (ja) * 2019-02-01 2020-04-28 ウィンゴーテクノロジー株式会社 ポリイミド化合物及び該ポリイミド化合物を含む成形物
KR20210138701A (ko) * 2019-03-20 2021-11-19 가부시키가이샤 가네카 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법
US11603440B2 (en) * 2019-09-12 2023-03-14 Dupont Electronics, Inc. Polyimide films and electronic devices
WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
KR20230007329A (ko) * 2020-04-16 2023-01-12 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JP7519812B2 (ja) * 2020-05-28 2024-07-22 太陽ホールディングス株式会社 ポリアミド酸、ポリイミド及びポリイミドフィルム
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595381U (enrdf_load_stackoverflow) 1979-12-27 1980-07-02
JPS6073528U (ja) 1983-10-27 1985-05-23 許　弼律 居室用キヤビネツト
JPS63101424A (ja) 1986-10-17 1988-05-06 Tosoh Corp ポリイミド樹脂
JPS63110219A (ja) 1986-10-28 1988-05-14 Tosoh Corp ポリイミド樹脂の製造方法
JPS6443579U (enrdf_load_stackoverflow) 1987-09-09 1989-03-15
WO2005113647A1 (ja) 2004-05-21 2005-12-01 Manac Inc 低線熱膨張係数を有するポリエステルイミドとその前駆体
WO2019211972A1 (ja) 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
WO2020138360A1 (ja) 2018-12-28 2020-07-02 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
「최신 폴리이미드 -기초와 응용-」, 일본 폴리이미드 연구회 편찬

Also Published As

Publication number Publication date
TW202246391A (zh) 2022-12-01
JP2024036637A (ja) 2024-03-15
TWI869664B (zh) 2025-01-11
JP7436606B2 (ja) 2024-02-21
JP7174199B1 (ja) 2022-11-17
WO2022211086A1 (ja) 2022-10-06
JP2022190112A (ja) 2022-12-22
JPWO2022211086A1 (enrdf_load_stackoverflow) 2022-10-06

Similar Documents

Publication Publication Date Title
JP7152381B2 (ja) 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP7383764B2 (ja) ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP7055832B2 (ja) ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
CN113136103B (zh) 聚酰亚胺前体树脂组合物
JP7689567B2 (ja) ポリイミド前駆体樹脂組成物
JP7436606B2 (ja) ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
TWI859238B (zh) 聚醯亞胺前驅體及聚醯亞胺樹脂組合物
KR102593077B1 (ko) 폴리이미드 전구체 및 그것을 포함하는 수지 조성물, 폴리이미드 수지막, 수지 필름 및 그 제조 방법
CN117120516A (zh) 聚酰亚胺、树脂组合物、聚酰亚胺薄膜和其制造方法
JP2023082676A (ja) 樹脂組成物とその製造方法
JP2023008996A (ja) 樹脂組成物
JP2023008992A (ja) 樹脂組成物
TW202523736A (zh) 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JP7506152B2 (ja) 樹脂組成物
JP7376274B2 (ja) ポリイミド前駆体樹脂組成物
JP2023008995A (ja) 樹脂組成物
KR20250044750A (ko) 수지 조성물
JP2022082450A (ja) 樹脂組成物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20230920

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20250314

Patent event code: PE09021S01D