JPWO2022211086A1 - - Google Patents

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Publication number
JPWO2022211086A1
JPWO2022211086A1 JP2022528651A JP2022528651A JPWO2022211086A1 JP WO2022211086 A1 JPWO2022211086 A1 JP WO2022211086A1 JP 2022528651 A JP2022528651 A JP 2022528651A JP 2022528651 A JP2022528651 A JP 2022528651A JP WO2022211086 A1 JPWO2022211086 A1 JP WO2022211086A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022528651A
Other languages
Japanese (ja)
Other versions
JPWO2022211086A5 (enrdf_load_stackoverflow
JP7174199B1 (ja
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Publication of JPWO2022211086A1 publication Critical patent/JPWO2022211086A1/ja
Priority to JP2022176853A priority Critical patent/JP7436606B2/ja
Application granted granted Critical
Publication of JP7174199B1 publication Critical patent/JP7174199B1/ja
Publication of JPWO2022211086A5 publication Critical patent/JPWO2022211086A5/ja
Priority to JP2024017752A priority patent/JP2024036637A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022528651A 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 Active JP7174199B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022176853A JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021063386 2021-04-02
JP2021063386 2021-04-02
JP2021063358 2021-04-02
JP2021063358 2021-04-02
JP2021196485 2021-12-02
JP2021196485 2021-12-02
PCT/JP2022/016837 WO2022211086A1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022176853A Division JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Publications (3)

Publication Number Publication Date
JPWO2022211086A1 true JPWO2022211086A1 (enrdf_load_stackoverflow) 2022-10-06
JP7174199B1 JP7174199B1 (ja) 2022-11-17
JPWO2022211086A5 JPWO2022211086A5 (enrdf_load_stackoverflow) 2023-02-28

Family

ID=83459655

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022528651A Active JP7174199B1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2022176853A Active JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A Pending JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022176853A Active JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A Pending JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Country Status (4)

Country Link
JP (3) JP7174199B1 (enrdf_load_stackoverflow)
KR (1) KR20230147181A (enrdf_load_stackoverflow)
TW (1) TWI869664B (enrdf_load_stackoverflow)
WO (1) WO2022211086A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JPWO2023063202A1 (enrdf_load_stackoverflow) * 2021-10-12 2023-04-20
WO2024048740A1 (ja) * 2022-08-31 2024-03-07 旭化成株式会社 樹脂組成物
CN116693911A (zh) * 2023-01-04 2023-09-05 昆山雅森电子材料科技有限公司 复合膜及其制备方法
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595381U (enrdf_load_stackoverflow) 1979-12-27 1980-07-02
JPS6073528U (ja) 1983-10-27 1985-05-23 許 弼律 居室用キヤビネツト
JPS63101424A (ja) 1986-10-17 1988-05-06 Tosoh Corp ポリイミド樹脂
JPS63110219A (ja) 1986-10-28 1988-05-14 Tosoh Corp ポリイミド樹脂の製造方法
JPS6443579U (enrdf_load_stackoverflow) 1987-09-09 1989-03-15
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
US6444783B1 (en) * 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP4870173B2 (ja) * 2003-04-07 2012-02-08 三井化学株式会社 ポリイミド金属積層板
JP4627297B2 (ja) 2004-05-21 2011-02-09 マナック株式会社 低線熱膨張係数を有するポリエステルイミドとその前駆体
JP2009167235A (ja) * 2008-01-11 2009-07-30 Ube Ind Ltd ポリイミドフィルムの製造方法
JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
US8730437B2 (en) * 2010-04-14 2014-05-20 Chi Mei Corporation Method for making a treated polymer for a liquid crystal alignment agent, the treated polymer made thereby, and liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element containing the treated polymer
JP5362752B2 (ja) * 2011-01-26 2013-12-11 Jfeケミカル株式会社 ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法
JP2012173453A (ja) * 2011-02-21 2012-09-10 Jsr Corp 液晶配向剤および液晶表示素子
WO2012173126A1 (ja) * 2011-06-13 2012-12-20 株式会社カネカ ポリアミド酸、ポリイミド、ポリアミド酸溶液、ポリイミド溶液、およびこれらの溶液から得られるポリイミド膜、ならびにポリイミド膜の利用
JP6036361B2 (ja) * 2013-02-07 2016-11-30 宇部興産株式会社 ポリイミドフィルムおよびそれを用いたポリイミド金属積層体
CN105916910B (zh) * 2014-02-14 2019-02-19 旭化成株式会社 聚酰亚胺前体和含有其的树脂组合物
JP6593021B2 (ja) * 2015-08-07 2019-10-23 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
KR102133559B1 (ko) * 2015-09-24 2020-07-13 아사히 가세이 가부시키가이샤 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
WO2019106952A1 (ja) * 2017-11-30 2019-06-06 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
WO2019211972A1 (ja) 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP7392660B2 (ja) * 2018-12-28 2023-12-06 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
TWI819102B (zh) * 2019-01-17 2023-10-21 日商Jsr股份有限公司 液晶配向劑、液晶配向膜、液晶元件及其製造方法
JP6690057B1 (ja) * 2019-02-01 2020-04-28 ウィンゴーテクノロジー株式会社 ポリイミド化合物及び該ポリイミド化合物を含む成形物
KR20210138701A (ko) * 2019-03-20 2021-11-19 가부시키가이샤 가네카 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법
US11603440B2 (en) * 2019-09-12 2023-03-14 Dupont Electronics, Inc. Polyimide films and electronic devices
WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
KR20230007329A (ko) * 2020-04-16 2023-01-12 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JP7519812B2 (ja) * 2020-05-28 2024-07-22 太陽ホールディングス株式会社 ポリアミド酸、ポリイミド及びポリイミドフィルム
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

Also Published As

Publication number Publication date
TW202246391A (zh) 2022-12-01
JP2024036637A (ja) 2024-03-15
TWI869664B (zh) 2025-01-11
JP7436606B2 (ja) 2024-02-21
JP7174199B1 (ja) 2022-11-17
WO2022211086A1 (ja) 2022-10-06
JP2022190112A (ja) 2022-12-22
KR20230147181A (ko) 2023-10-20

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