JP7174199B1 - ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 - Google Patents

ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 Download PDF

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JP7174199B1
JP7174199B1 JP2022528651A JP2022528651A JP7174199B1 JP 7174199 B1 JP7174199 B1 JP 7174199B1 JP 2022528651 A JP2022528651 A JP 2022528651A JP 2022528651 A JP2022528651 A JP 2022528651A JP 7174199 B1 JP7174199 B1 JP 7174199B1
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polyimide
general formula
polyamic acid
dianhydride
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JPWO2022211086A5 (enrdf_load_stackoverflow
JPWO2022211086A1 (enrdf_load_stackoverflow
Inventor
聡 加藤
雄太 佐藤
健 柏田
隆行 金田
友裕 頼末
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Asahi Kasei Corp
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Asahi Kasei Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022528651A 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 Active JP7174199B1 (ja)

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JP2022176853A JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

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JP2021196485 2021-12-02
JP2021196485 2021-12-02
PCT/JP2022/016837 WO2022211086A1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

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JP2022176853A Active JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
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JP2024017752A Pending JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

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KR (1) KR20230147181A (enrdf_load_stackoverflow)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022190112A (ja) * 2021-04-02 2022-12-22 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

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JPWO2023063202A1 (enrdf_load_stackoverflow) * 2021-10-12 2023-04-20
WO2024048740A1 (ja) * 2022-08-31 2024-03-07 旭化成株式会社 樹脂組成物
CN116693911A (zh) * 2023-01-04 2023-09-05 昆山雅森电子材料科技有限公司 复合膜及其制备方法
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

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JP2018031018A (ja) * 2014-02-14 2018-03-01 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
WO2019106952A1 (ja) * 2017-11-30 2019-06-06 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
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WO2020148953A1 (ja) * 2019-01-17 2020-07-23 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
JP2021042381A (ja) * 2019-09-12 2021-03-18 デュポン エレクトロニクス インコーポレイテッド ポリイミドフィルム及び電子デバイス

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WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
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JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
JP2012173453A (ja) * 2011-02-21 2012-09-10 Jsr Corp 液晶配向剤および液晶表示素子
JP2014152221A (ja) * 2013-02-07 2014-08-25 Ube Ind Ltd ポリイミドフィルムおよびそれを用いたポリイミド金属積層体
JP2018031018A (ja) * 2014-02-14 2018-03-01 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
JP2017037136A (ja) * 2015-08-07 2017-02-16 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022190112A (ja) * 2021-04-02 2022-12-22 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP7436606B2 (ja) 2021-04-02 2024-02-21 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

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TW202246391A (zh) 2022-12-01
JP2024036637A (ja) 2024-03-15
TWI869664B (zh) 2025-01-11
JP7436606B2 (ja) 2024-02-21
WO2022211086A1 (ja) 2022-10-06
JP2022190112A (ja) 2022-12-22
KR20230147181A (ko) 2023-10-20
JPWO2022211086A1 (enrdf_load_stackoverflow) 2022-10-06

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