TWI867132B - 導電性基板之製造方法、導電性基板、觸控感測器、天線、電磁波屏蔽材料 - Google Patents

導電性基板之製造方法、導電性基板、觸控感測器、天線、電磁波屏蔽材料 Download PDF

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TWI867132B
TWI867132B TW109146053A TW109146053A TWI867132B TW I867132 B TWI867132 B TW I867132B TW 109146053 A TW109146053 A TW 109146053A TW 109146053 A TW109146053 A TW 109146053A TW I867132 B TWI867132 B TW I867132B
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TW
Taiwan
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conductive
photosensitive resin
substrate
group
resin layer
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TW109146053A
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English (en)
Chinese (zh)
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TW202147027A (zh
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漢那慎一
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日商富士軟片股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Materials For Photolithography (AREA)
TW109146053A 2019-12-25 2020-12-24 導電性基板之製造方法、導電性基板、觸控感測器、天線、電磁波屏蔽材料 TWI867132B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-234519 2019-12-25
JP2019234519 2019-12-25

Publications (2)

Publication Number Publication Date
TW202147027A TW202147027A (zh) 2021-12-16
TWI867132B true TWI867132B (zh) 2024-12-21

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TW109146053A TWI867132B (zh) 2019-12-25 2020-12-24 導電性基板之製造方法、導電性基板、觸控感測器、天線、電磁波屏蔽材料

Country Status (6)

Country Link
US (1) US20220334492A1 (https=)
JP (1) JPWO2021132384A1 (https=)
KR (1) KR20220106784A (https=)
CN (1) CN114868462A (https=)
TW (1) TWI867132B (https=)
WO (1) WO2021132384A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023020485A (ja) * 2021-07-30 2023-02-09 富士フイルム株式会社 感光性組成物、感光性組成物層、転写フィルム、導体パターンを有する積層体の製造方法
CN121154169B (zh) * 2025-11-19 2026-02-13 湖南大学 一种超薄温敏水凝胶柔性电极及其制备方法

Citations (8)

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JPS5927409A (ja) * 1982-08-09 1984-02-13 カシオ計算機株式会社 電極の形成方法
TW473459B (en) * 1998-12-10 2002-01-21 Ibm Method for forming transparent conductive film using chemically amplified resist
JP2004103696A (ja) * 2002-09-06 2004-04-02 Hitachi Ltd 半導体装置
JP2005116999A (ja) * 2003-09-19 2005-04-28 Jsr Corp 造形物の製造方法
TW201106824A (en) * 2009-07-06 2011-02-16 Mitsui Mining & Smelting Co Printed wiring substrate and producing method thereof
JP2011114286A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法
CN107943357A (zh) * 2017-12-28 2018-04-20 苏州柏特瑞新材料有限公司 一种金属网格电容式触摸屏的制备方法
TW201922817A (zh) * 2017-09-29 2019-06-16 日商富士軟片股份有限公司 電路配線的製造方法及觸控面板的製造方法

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JP2004103969A (ja) * 2002-09-12 2004-04-02 Dainippon Printing Co Ltd 導電性パターン基板の製造方法
KR100690929B1 (ko) 2006-05-03 2007-03-09 한국기계연구원 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
JP4745358B2 (ja) * 2008-03-04 2011-08-10 株式会社東芝 回転塗布方法、および回転塗布装置
JP4832615B1 (ja) * 2010-11-01 2011-12-07 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
IN2014DN03390A (https=) * 2011-10-03 2015-06-05 Hitachi Chemical Co Ltd
JP5971642B2 (ja) * 2011-11-28 2016-08-17 学校法人日本大学 微細金属構造体の製造方法
JPWO2016031404A1 (ja) * 2014-08-28 2017-04-27 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
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JP2018103460A (ja) * 2016-12-26 2018-07-05 富士フイルム株式会社 導電性パターン形成方法、導電性パターン形成用印刷版及びその製造方法
WO2018155193A1 (ja) * 2017-02-22 2018-08-30 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
JP6275903B1 (ja) * 2017-05-29 2018-02-07 株式会社アルファ・ジャパン 金属皮膜形成品及び金属皮膜形成品の製造方法
JP7140964B2 (ja) * 2017-06-05 2022-09-22 セントラル硝子株式会社 含フッ素単量体、含フッ素重合体およびそれを用いたパターン形成用組成物、並びにそのパターン形成方法
TW201922815A (zh) * 2017-10-13 2019-06-16 日商富士軟片股份有限公司 電路配線的製造方法、觸控面板的製造方法及附圖案基材的製造方法
JP6825580B2 (ja) * 2018-01-12 2021-02-03 味の素株式会社 プリント配線板の製造方法
JP2019160844A (ja) * 2018-03-07 2019-09-19 愛三工業株式会社 導電体の製造方法及び導電体
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927409A (ja) * 1982-08-09 1984-02-13 カシオ計算機株式会社 電極の形成方法
TW473459B (en) * 1998-12-10 2002-01-21 Ibm Method for forming transparent conductive film using chemically amplified resist
JP2004103696A (ja) * 2002-09-06 2004-04-02 Hitachi Ltd 半導体装置
JP2005116999A (ja) * 2003-09-19 2005-04-28 Jsr Corp 造形物の製造方法
TW201106824A (en) * 2009-07-06 2011-02-16 Mitsui Mining & Smelting Co Printed wiring substrate and producing method thereof
JP2011114286A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法
TW201922817A (zh) * 2017-09-29 2019-06-16 日商富士軟片股份有限公司 電路配線的製造方法及觸控面板的製造方法
CN107943357A (zh) * 2017-12-28 2018-04-20 苏州柏特瑞新材料有限公司 一种金属网格电容式触摸屏的制备方法

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TW202147027A (zh) 2021-12-16
WO2021132384A1 (ja) 2021-07-01
JPWO2021132384A1 (https=) 2021-07-01
CN114868462A (zh) 2022-08-05
US20220334492A1 (en) 2022-10-20
KR20220106784A (ko) 2022-07-29

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