TWI852975B - 熱傳導性聚矽氧組成物 - Google Patents

熱傳導性聚矽氧組成物 Download PDF

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Publication number
TWI852975B
TWI852975B TW108148516A TW108148516A TWI852975B TW I852975 B TWI852975 B TW I852975B TW 108148516 A TW108148516 A TW 108148516A TW 108148516 A TW108148516 A TW 108148516A TW I852975 B TWI852975 B TW I852975B
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TW
Taiwan
Prior art keywords
thermally conductive
viscosity
organopolysiloxane
composition
component
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TW108148516A
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English (en)
Chinese (zh)
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TW202037702A (zh
Inventor
山田邦弘
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日商信越化學工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
TW108148516A 2019-01-10 2019-12-31 熱傳導性聚矽氧組成物 TWI852975B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019002591A JP7001071B2 (ja) 2019-01-10 2019-01-10 熱伝導性シリコーン組成物
JP2019-002591 2019-01-10

Publications (2)

Publication Number Publication Date
TW202037702A TW202037702A (zh) 2020-10-16
TWI852975B true TWI852975B (zh) 2024-08-21

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TW108148516A TWI852975B (zh) 2019-01-10 2019-12-31 熱傳導性聚矽氧組成物

Country Status (7)

Country Link
US (1) US12305112B2 (enExample)
EP (1) EP3910026A4 (enExample)
JP (1) JP7001071B2 (enExample)
KR (1) KR102851489B1 (enExample)
CN (1) CN113272386B (enExample)
TW (1) TWI852975B (enExample)
WO (1) WO2020145102A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462875B (zh) 2017-02-08 2023-04-18 埃肯有机硅美国公司 具有改进的热管理的二次电池组
JP7606439B2 (ja) 2021-10-19 2024-12-25 信越化学工業株式会社 熱伝導性シリコーン組成物
US20260098198A1 (en) * 2022-12-26 2026-04-09 Denka Company Limited Thermally conductive grease and electronic device
US20240262978A1 (en) * 2023-02-03 2024-08-08 Eaton Intelligent Power Limited Thermally conductive silicone rubber with high mechanical properties
JP2025092146A (ja) * 2023-12-08 2025-06-19 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169343A (ja) * 2004-12-15 2006-06-29 Shin Etsu Chem Co Ltd 放熱性シリコーングリース組成物の製造方法
JP2008274036A (ja) * 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
TW200927807A (en) * 2007-09-20 2009-07-01 Momentive Performance Mat Inc Boron nitride-containing silicone gel composition
JP2010013563A (ja) * 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP2011246536A (ja) * 2010-05-25 2011-12-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2017002179A (ja) * 2015-06-10 2017-01-05 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
WO2017051738A1 (ja) * 2015-09-25 2017-03-30 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
WO2017064976A1 (ja) * 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP5388329B2 (ja) 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5283553B2 (ja) 2009-04-09 2013-09-04 株式会社デンソー 熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置
CN102504543B (zh) * 2011-12-12 2013-11-20 广州市白云化工实业有限公司 一种高散热硅膏组合物及其制备方法
JP5940325B2 (ja) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
US9321950B2 (en) * 2012-05-11 2016-04-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
JP5729882B2 (ja) * 2012-10-23 2015-06-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US9428680B2 (en) * 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169343A (ja) * 2004-12-15 2006-06-29 Shin Etsu Chem Co Ltd 放熱性シリコーングリース組成物の製造方法
JP2008274036A (ja) * 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
TW200927807A (en) * 2007-09-20 2009-07-01 Momentive Performance Mat Inc Boron nitride-containing silicone gel composition
JP2010013563A (ja) * 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP2011246536A (ja) * 2010-05-25 2011-12-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2017002179A (ja) * 2015-06-10 2017-01-05 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
TW201708397A (zh) * 2015-06-10 2017-03-01 信越化學工業股份有限公司 熱傳導性聚矽氧油灰組成物
WO2017051738A1 (ja) * 2015-09-25 2017-03-30 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
WO2017064976A1 (ja) * 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物

Also Published As

Publication number Publication date
JP2020111655A (ja) 2020-07-27
US12305112B2 (en) 2025-05-20
CN113272386A (zh) 2021-08-17
JP7001071B2 (ja) 2022-01-19
US20220145156A1 (en) 2022-05-12
EP3910026A1 (en) 2021-11-17
TW202037702A (zh) 2020-10-16
WO2020145102A1 (ja) 2020-07-16
EP3910026A4 (en) 2022-10-12
KR20210113301A (ko) 2021-09-15
KR102851489B1 (ko) 2025-08-29
CN113272386B (zh) 2023-04-25

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