JP7001071B2 - 熱伝導性シリコーン組成物 - Google Patents

熱伝導性シリコーン組成物 Download PDF

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Publication number
JP7001071B2
JP7001071B2 JP2019002591A JP2019002591A JP7001071B2 JP 7001071 B2 JP7001071 B2 JP 7001071B2 JP 2019002591 A JP2019002591 A JP 2019002591A JP 2019002591 A JP2019002591 A JP 2019002591A JP 7001071 B2 JP7001071 B2 JP 7001071B2
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Japan
Prior art keywords
organopolysiloxane
group
thermally conductive
silicone composition
conductive silicone
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JP2019002591A
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English (en)
Japanese (ja)
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JP2020111655A (ja
JP2020111655A5 (enExample
Inventor
邦弘 山田
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2019002591A priority Critical patent/JP7001071B2/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to US17/420,199 priority patent/US12305112B2/en
Priority to PCT/JP2019/050241 priority patent/WO2020145102A1/ja
Priority to KR1020217024997A priority patent/KR102851489B1/ko
Priority to CN201980088025.2A priority patent/CN113272386B/zh
Priority to EP19908643.0A priority patent/EP3910026A4/en
Priority to TW108148516A priority patent/TWI852975B/zh
Publication of JP2020111655A publication Critical patent/JP2020111655A/ja
Publication of JP2020111655A5 publication Critical patent/JP2020111655A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
JP2019002591A 2019-01-10 2019-01-10 熱伝導性シリコーン組成物 Active JP7001071B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019002591A JP7001071B2 (ja) 2019-01-10 2019-01-10 熱伝導性シリコーン組成物
PCT/JP2019/050241 WO2020145102A1 (ja) 2019-01-10 2019-12-23 熱伝導性シリコーン組成物
KR1020217024997A KR102851489B1 (ko) 2019-01-10 2019-12-23 열전도성 실리콘 조성물
CN201980088025.2A CN113272386B (zh) 2019-01-10 2019-12-23 导热性有机硅组合物
US17/420,199 US12305112B2 (en) 2019-01-10 2019-12-23 Thermally-conductive silicone composition
EP19908643.0A EP3910026A4 (en) 2019-01-10 2019-12-23 THERMALLY CONDUCTIVE SILICONE COMPOSITION
TW108148516A TWI852975B (zh) 2019-01-10 2019-12-31 熱傳導性聚矽氧組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019002591A JP7001071B2 (ja) 2019-01-10 2019-01-10 熱伝導性シリコーン組成物

Publications (3)

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JP2020111655A JP2020111655A (ja) 2020-07-27
JP2020111655A5 JP2020111655A5 (enExample) 2021-07-29
JP7001071B2 true JP7001071B2 (ja) 2022-01-19

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Country Status (7)

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US (1) US12305112B2 (enExample)
EP (1) EP3910026A4 (enExample)
JP (1) JP7001071B2 (enExample)
KR (1) KR102851489B1 (enExample)
CN (1) CN113272386B (enExample)
TW (1) TWI852975B (enExample)
WO (1) WO2020145102A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018148282A1 (en) 2017-02-08 2018-08-16 Elkem Silicones USA Corp. Secondary battery pack with improved thermal management
JP7606439B2 (ja) 2021-10-19 2024-12-25 信越化学工業株式会社 熱伝導性シリコーン組成物
CN120380087A (zh) * 2022-12-26 2025-07-25 电化株式会社 导热性润滑脂及电子设备
US20240262978A1 (en) * 2023-02-03 2024-08-08 Eaton Intelligent Power Limited Thermally conductive silicone rubber with high mechanical properties
JP2025092146A (ja) * 2023-12-08 2025-06-19 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017002179A (ja) 2015-06-10 2017-01-05 信越化学工業株式会社 熱伝導性シリコーンパテ組成物

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JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP4460433B2 (ja) * 2004-12-15 2010-05-12 信越化学工業株式会社 放熱性シリコーングリース組成物の製造方法
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP2008274036A (ja) 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
US20090081316A1 (en) * 2007-09-20 2009-03-26 Momentive Performance Materials Inc. Boron nitride-containing silicone gel composition
JP2010013563A (ja) 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP5388329B2 (ja) 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5283553B2 (ja) 2009-04-09 2013-09-04 株式会社デンソー 熱伝導性シリコーングリース組成物
JP5434795B2 (ja) * 2010-05-25 2014-03-05 信越化学工業株式会社 熱伝導性シリコーングリース組成物
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CN102504543B (zh) * 2011-12-12 2013-11-20 广州市白云化工实业有限公司 一种高散热硅膏组合物及其制备方法
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Also Published As

Publication number Publication date
EP3910026A4 (en) 2022-10-12
US12305112B2 (en) 2025-05-20
KR20210113301A (ko) 2021-09-15
CN113272386A (zh) 2021-08-17
TW202037702A (zh) 2020-10-16
EP3910026A1 (en) 2021-11-17
US20220145156A1 (en) 2022-05-12
CN113272386B (zh) 2023-04-25
WO2020145102A1 (ja) 2020-07-16
JP2020111655A (ja) 2020-07-27
KR102851489B1 (ko) 2025-08-29
TWI852975B (zh) 2024-08-21

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