KR102851489B1 - 열전도성 실리콘 조성물 - Google Patents

열전도성 실리콘 조성물

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Publication number
KR102851489B1
KR102851489B1 KR1020217024997A KR20217024997A KR102851489B1 KR 102851489 B1 KR102851489 B1 KR 102851489B1 KR 1020217024997 A KR1020217024997 A KR 1020217024997A KR 20217024997 A KR20217024997 A KR 20217024997A KR 102851489 B1 KR102851489 B1 KR 102851489B1
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KR
South Korea
Prior art keywords
thermally conductive
organopolysiloxane
group
viscosity
silicone composition
Prior art date
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KR1020217024997A
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English (en)
Korean (ko)
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KR20210113301A (ko
Inventor
쿠니히로 야마다
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
KR1020217024997A 2019-01-10 2019-12-23 열전도성 실리콘 조성물 Active KR102851489B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-002591 2019-01-10
JP2019002591A JP7001071B2 (ja) 2019-01-10 2019-01-10 熱伝導性シリコーン組成物
PCT/JP2019/050241 WO2020145102A1 (ja) 2019-01-10 2019-12-23 熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
KR20210113301A KR20210113301A (ko) 2021-09-15
KR102851489B1 true KR102851489B1 (ko) 2025-08-29

Family

ID=71521340

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217024997A Active KR102851489B1 (ko) 2019-01-10 2019-12-23 열전도성 실리콘 조성물

Country Status (7)

Country Link
US (1) US12305112B2 (enExample)
EP (1) EP3910026A4 (enExample)
JP (1) JP7001071B2 (enExample)
KR (1) KR102851489B1 (enExample)
CN (1) CN113272386B (enExample)
TW (1) TWI852975B (enExample)
WO (1) WO2020145102A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018148282A1 (en) 2017-02-08 2018-08-16 Elkem Silicones USA Corp. Secondary battery pack with improved thermal management
JP7606439B2 (ja) 2021-10-19 2024-12-25 信越化学工業株式会社 熱伝導性シリコーン組成物
CN120380087A (zh) * 2022-12-26 2025-07-25 电化株式会社 导热性润滑脂及电子设备
US20240262978A1 (en) * 2023-02-03 2024-08-08 Eaton Intelligent Power Limited Thermally conductive silicone rubber with high mechanical properties
JP2025092146A (ja) * 2023-12-08 2025-06-19 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169343A (ja) 2004-12-15 2006-06-29 Shin Etsu Chem Co Ltd 放熱性シリコーングリース組成物の製造方法
JP2010013563A (ja) 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP2011246536A (ja) 2010-05-25 2011-12-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2017002179A (ja) * 2015-06-10 2017-01-05 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
WO2017064976A1 (ja) 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物

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JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP2008274036A (ja) 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
US20090081316A1 (en) * 2007-09-20 2009-03-26 Momentive Performance Materials Inc. Boron nitride-containing silicone gel composition
JP5388329B2 (ja) 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5283553B2 (ja) 2009-04-09 2013-09-04 株式会社デンソー 熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置
CN102504543B (zh) * 2011-12-12 2013-11-20 广州市白云化工实业有限公司 一种高散热硅膏组合物及其制备方法
JP5940325B2 (ja) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
CN103827277B (zh) * 2012-05-11 2016-07-06 信越化学工业株式会社 导热性硅脂组合物
JP5729882B2 (ja) * 2012-10-23 2015-06-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169343A (ja) 2004-12-15 2006-06-29 Shin Etsu Chem Co Ltd 放熱性シリコーングリース組成物の製造方法
JP2010013563A (ja) 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP2011246536A (ja) 2010-05-25 2011-12-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2017002179A (ja) * 2015-06-10 2017-01-05 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
WO2017064976A1 (ja) 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物

Also Published As

Publication number Publication date
EP3910026A4 (en) 2022-10-12
US12305112B2 (en) 2025-05-20
KR20210113301A (ko) 2021-09-15
CN113272386A (zh) 2021-08-17
TW202037702A (zh) 2020-10-16
EP3910026A1 (en) 2021-11-17
US20220145156A1 (en) 2022-05-12
CN113272386B (zh) 2023-04-25
WO2020145102A1 (ja) 2020-07-16
JP2020111655A (ja) 2020-07-27
JP7001071B2 (ja) 2022-01-19
TWI852975B (zh) 2024-08-21

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