CN113272386B - 导热性有机硅组合物 - Google Patents

导热性有机硅组合物 Download PDF

Info

Publication number
CN113272386B
CN113272386B CN201980088025.2A CN201980088025A CN113272386B CN 113272386 B CN113272386 B CN 113272386B CN 201980088025 A CN201980088025 A CN 201980088025A CN 113272386 B CN113272386 B CN 113272386B
Authority
CN
China
Prior art keywords
thermally conductive
organopolysiloxane
silicone composition
conductive silicone
viscosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980088025.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN113272386A (zh
Inventor
山田邦弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Publication of CN113272386A publication Critical patent/CN113272386A/zh
Application granted granted Critical
Publication of CN113272386B publication Critical patent/CN113272386B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
CN201980088025.2A 2019-01-10 2019-12-23 导热性有机硅组合物 Active CN113272386B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019002591A JP7001071B2 (ja) 2019-01-10 2019-01-10 熱伝導性シリコーン組成物
JP2019-002591 2019-01-10
PCT/JP2019/050241 WO2020145102A1 (ja) 2019-01-10 2019-12-23 熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
CN113272386A CN113272386A (zh) 2021-08-17
CN113272386B true CN113272386B (zh) 2023-04-25

Family

ID=71521340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980088025.2A Active CN113272386B (zh) 2019-01-10 2019-12-23 导热性有机硅组合物

Country Status (7)

Country Link
US (1) US12305112B2 (enExample)
EP (1) EP3910026A4 (enExample)
JP (1) JP7001071B2 (enExample)
KR (1) KR102851489B1 (enExample)
CN (1) CN113272386B (enExample)
TW (1) TWI852975B (enExample)
WO (1) WO2020145102A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462875B (zh) 2017-02-08 2023-04-18 埃肯有机硅美国公司 具有改进的热管理的二次电池组
JP7606439B2 (ja) 2021-10-19 2024-12-25 信越化学工業株式会社 熱伝導性シリコーン組成物
US20260098198A1 (en) * 2022-12-26 2026-04-09 Denka Company Limited Thermally conductive grease and electronic device
US20240262978A1 (en) * 2023-02-03 2024-08-08 Eaton Intelligent Power Limited Thermally conductive silicone rubber with high mechanical properties
JP2025092146A (ja) * 2023-12-08 2025-06-19 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP4460433B2 (ja) * 2004-12-15 2010-05-12 信越化学工業株式会社 放熱性シリコーングリース組成物の製造方法
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP2008274036A (ja) 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
US20090081316A1 (en) * 2007-09-20 2009-03-26 Momentive Performance Materials Inc. Boron nitride-containing silicone gel composition
JP2010013563A (ja) 2008-07-03 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース
JP5388329B2 (ja) 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5283553B2 (ja) 2009-04-09 2013-09-04 株式会社デンソー 熱伝導性シリコーングリース組成物
JP5434795B2 (ja) * 2010-05-25 2014-03-05 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置
CN102504543B (zh) * 2011-12-12 2013-11-20 广州市白云化工实业有限公司 一种高散热硅膏组合物及其制备方法
JP5940325B2 (ja) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
US9321950B2 (en) * 2012-05-11 2016-04-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
JP5729882B2 (ja) * 2012-10-23 2015-06-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US9428680B2 (en) * 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses
JP6323398B2 (ja) * 2015-06-10 2018-05-16 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
JP6394559B2 (ja) 2015-10-16 2018-09-26 信越化学工業株式会社 熱伝導性シリコーングリース組成物

Also Published As

Publication number Publication date
JP2020111655A (ja) 2020-07-27
US12305112B2 (en) 2025-05-20
CN113272386A (zh) 2021-08-17
JP7001071B2 (ja) 2022-01-19
US20220145156A1 (en) 2022-05-12
EP3910026A1 (en) 2021-11-17
TW202037702A (zh) 2020-10-16
WO2020145102A1 (ja) 2020-07-16
EP3910026A4 (en) 2022-10-12
KR20210113301A (ko) 2021-09-15
TWI852975B (zh) 2024-08-21
KR102851489B1 (ko) 2025-08-29

Similar Documents

Publication Publication Date Title
US12305112B2 (en) Thermally-conductive silicone composition
CN115427509B (zh) 导热性有机硅组合物
CN115386231A (zh) 热传导性硅酮组合物及其固化物
JP4917380B2 (ja) 放熱用シリコーングリース組成物及びその製造方法
CN115667407B (zh) 高导热性有机硅组合物
CN107531999B (zh) 导热性硅脂组合物
EP2257616A1 (en) Thermally conductive silicone grease composition
JP7632143B2 (ja) シリコーン樹脂組成物
EP4606862A1 (en) Curable organopolysiloxane composition and semiconductor device
CN114846084A (zh) 导热性有机硅组合物
TW202128948A (zh) 熱傳導性聚矽氧組成物及其製造方法
TW201522513A (zh) 聚矽氧組成物及熱傳導性聚矽氧組成物之製造方法
EP3805317A1 (en) Thermally conductive silicone composition and method for producing same
JP6372293B2 (ja) 熱伝導性シリコーングリース組成物
JP6669028B2 (ja) 熱伝導性シリコーングリース組成物
JP2010013563A (ja) 熱伝導性シリコーングリース
TW201728753A (zh) 熱傳導性聚矽氧潤滑脂（ｓｉｌｉｃｏｎｅ ｇｒｅａｓｅ）組成物
TW202502964A (zh) 熱傳導性矽酮組合物
CN118742609A (zh) 导热性有机硅组合物及其制造方法
CN116710514A (zh) 导热性有机硅组合物
TW202334374A (zh) 導熱性矽氧組成物
TW202607091A (zh) 熱傳導性聚矽氧組成物
TW202307187A (zh) 矽酮樹脂組成物
WO2024257555A1 (ja) 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート
WO2024143103A1 (ja) 熱伝導性グリース及び電子機器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant