TWI839533B - 半導體密封成形用暫時保護膜、捲盤體、帶有暫時保護膜的引線框架、帶有暫時保護膜的密封成形體以及製造半導體裝置的方法 - Google Patents

半導體密封成形用暫時保護膜、捲盤體、帶有暫時保護膜的引線框架、帶有暫時保護膜的密封成形體以及製造半導體裝置的方法 Download PDF

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TWI839533B
TWI839533B TW109120397A TW109120397A TWI839533B TW I839533 B TWI839533 B TW I839533B TW 109120397 A TW109120397 A TW 109120397A TW 109120397 A TW109120397 A TW 109120397A TW I839533 B TWI839533 B TW I839533B
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protective film
temporary protective
lead frame
bonding layer
semiconductor
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TW109120397A
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Chinese (zh)
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TW202111049A (zh
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名児耶友宏
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日商力森諾科股份有限公司
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
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    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
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    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
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  • Chemical & Material Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW109120397A 2019-06-19 2020-06-17 半導體密封成形用暫時保護膜、捲盤體、帶有暫時保護膜的引線框架、帶有暫時保護膜的密封成形體以及製造半導體裝置的方法 TWI839533B (zh)

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JP2019-113464 2019-06-19
JP2019113464 2019-06-19

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TW202111049A TW202111049A (zh) 2021-03-16
TWI839533B true TWI839533B (zh) 2024-04-21

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US (1) US12451367B2 (https=)
JP (1) JP7803713B2 (https=)
KR (1) KR102833268B1 (https=)
CN (1) CN113874989A (https=)
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