JP7803713B2 - 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法 - Google Patents

半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法

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Publication number
JP7803713B2
JP7803713B2 JP2021528275A JP2021528275A JP7803713B2 JP 7803713 B2 JP7803713 B2 JP 7803713B2 JP 2021528275 A JP2021528275 A JP 2021528275A JP 2021528275 A JP2021528275 A JP 2021528275A JP 7803713 B2 JP7803713 B2 JP 7803713B2
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Prior art keywords
protective film
temporary protective
adhesive layer
lead frame
semiconductor
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Active
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JP2021528275A
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Japanese (ja)
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JPWO2020255975A1 (https=
Inventor
友宏 名児耶
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Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
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    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
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    • H10P72/7436—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support a device or a wafer when forming electrical connections thereto
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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
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  • Chemical & Material Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2021528275A 2019-06-19 2020-06-16 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法 Active JP7803713B2 (ja)

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JP2019113464 2019-06-19
JP2019113464 2019-06-19
PCT/JP2020/023647 WO2020255975A1 (ja) 2019-06-19 2020-06-16 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法

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JPWO2020255975A1 JPWO2020255975A1 (https=) 2020-12-24
JP7803713B2 true JP7803713B2 (ja) 2026-01-21

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