TWI829715B - 顯示面板以及使用其的大型顯示裝置 - Google Patents
顯示面板以及使用其的大型顯示裝置 Download PDFInfo
- Publication number
- TWI829715B TWI829715B TW108123469A TW108123469A TWI829715B TW I829715 B TWI829715 B TW I829715B TW 108123469 A TW108123469 A TW 108123469A TW 108123469 A TW108123469 A TW 108123469A TW I829715 B TWI829715 B TW I829715B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- film transistor
- glass substrate
- display panel
- transistor substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 245
- 239000010409 thin film Substances 0.000 claims abstract description 236
- 239000011521 glass Substances 0.000 claims abstract description 66
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 39
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- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- 238000007650 screen-printing Methods 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20180077668 | 2018-07-04 | ||
KR10-2018-0077668 | 2018-07-04 | ||
KR1020190075904A KR102151099B1 (ko) | 2018-07-04 | 2019-06-25 | 디스플레이 패널 및 이를 이용한 대형 디스플레이 장치 |
KR10-2019-0075904 | 2019-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202006448A TW202006448A (zh) | 2020-02-01 |
TWI829715B true TWI829715B (zh) | 2024-01-21 |
Family
ID=69153034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108123469A TWI829715B (zh) | 2018-07-04 | 2019-07-03 | 顯示面板以及使用其的大型顯示裝置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3782191A4 (fr) |
KR (1) | KR102151099B1 (fr) |
CN (1) | CN112335045A (fr) |
TW (1) | TWI829715B (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210111529A (ko) * | 2020-03-03 | 2021-09-13 | 삼성전자주식회사 | 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 디스플레이 모듈 제조 방법 |
TWI804720B (zh) * | 2020-03-27 | 2023-06-11 | 南韓商太特思股份有限公司 | Led顯示模組及其顯示器 |
KR20220164039A (ko) * | 2020-04-13 | 2022-12-12 | 엘지전자 주식회사 | 디스플레이 장치와 그의 제조 방법, 및 그를 이용한 멀티 스크린 디스플레이 장치 |
KR102542344B1 (ko) * | 2020-05-08 | 2023-06-13 | 삼성전자주식회사 | 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 그 제조 방법 |
WO2021225341A1 (fr) * | 2020-05-08 | 2021-11-11 | 삼성전자주식회사 | Module d'affichage comprenant un substrat en verre renfermant des câblages latéraux, et procédé de fabrication afférent |
TWI742681B (zh) * | 2020-05-21 | 2021-10-11 | 友達光電股份有限公司 | 顯示裝置 |
CN111951697B (zh) | 2020-08-10 | 2022-02-01 | Tcl华星光电技术有限公司 | 拼接显示屏 |
CN113644085B (zh) * | 2020-08-14 | 2023-06-02 | 友达光电股份有限公司 | 电子装置及电子装置的制造方法 |
TWI737520B (zh) * | 2020-08-14 | 2021-08-21 | 友達光電股份有限公司 | 顯示面板 |
KR20220039448A (ko) * | 2020-09-22 | 2022-03-29 | 삼성전자주식회사 | 측면 배선을 구비한 디스플레이 모듈 및 그 제조 방법 |
KR20220054034A (ko) * | 2020-10-23 | 2022-05-02 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
KR102328078B1 (ko) | 2021-04-13 | 2021-11-18 | 주식회사 에이맵플러스 | 디스플레이 패널, 디스플레이 장치 및 그 제조방법 |
TWI832687B (zh) * | 2023-01-30 | 2024-02-11 | 友達光電股份有限公司 | 側面電路結構及其製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015175969A (ja) * | 2014-03-14 | 2015-10-05 | 日本放送協会 | タイル型ディスプレイ及びその作製方法 |
US20170040306A1 (en) * | 2015-06-30 | 2017-02-09 | Apple Inc. | Electronic Devices With Soft Input-Output Components |
TWI603466B (zh) * | 2012-12-10 | 2017-10-21 | 蘋果公司 | 帶有基結線之主動矩陣顯示面板 |
US20180173036A1 (en) * | 2016-12-20 | 2018-06-21 | Lg Display Co., Ltd. | Display device and multiscreen display device including the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6456354B2 (en) * | 1999-08-06 | 2002-09-24 | Rainbow Displays, Inc. | Design features optimized for tiled flat-panel displays |
JP2007080853A (ja) * | 2005-09-09 | 2007-03-29 | Toshiba Corp | 素子形成基板、アクティブマトリクス基板及びその製造方法 |
JP5476701B2 (ja) * | 2008-10-31 | 2014-04-23 | 株式会社大林組 | 階段 |
WO2010106637A1 (fr) * | 2009-03-17 | 2010-09-23 | パイオニア株式会社 | Module el organique et son procédé de fabrication |
JP5577965B2 (ja) * | 2010-09-02 | 2014-08-27 | ソニー株式会社 | 半導体装置、および、その製造方法、電子機器 |
KR102087951B1 (ko) * | 2013-07-25 | 2020-04-16 | 삼성디스플레이 주식회사 | 평판 디스플레이 장치 및 그 제조방법 |
US20150282293A1 (en) * | 2014-02-07 | 2015-10-01 | Google Technology Holdings LLC | Display, display assembly and device |
KR20150110910A (ko) * | 2014-03-21 | 2015-10-05 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
US9841548B2 (en) * | 2015-06-30 | 2017-12-12 | Apple Inc. | Electronic devices with soft input-output components |
KR20170059523A (ko) * | 2015-11-20 | 2017-05-31 | 삼성디스플레이 주식회사 | 표시 장치, 타일형 표시 장치 및 이의 제조 방법 |
KR102633079B1 (ko) * | 2016-10-28 | 2024-02-01 | 엘지디스플레이 주식회사 | 발광 다이오드 디스플레이 장치 |
KR102515399B1 (ko) * | 2017-12-12 | 2023-03-28 | 엘지디스플레이 주식회사 | 배선 필름 및 그를 포함한 표시 장치 |
-
2019
- 2019-06-25 KR KR1020190075904A patent/KR102151099B1/ko active IP Right Grant
- 2019-07-03 TW TW108123469A patent/TWI829715B/zh active
- 2019-07-04 EP EP19829907.5A patent/EP3782191A4/fr active Pending
- 2019-07-04 CN CN201980043639.9A patent/CN112335045A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI603466B (zh) * | 2012-12-10 | 2017-10-21 | 蘋果公司 | 帶有基結線之主動矩陣顯示面板 |
JP2015175969A (ja) * | 2014-03-14 | 2015-10-05 | 日本放送協会 | タイル型ディスプレイ及びその作製方法 |
US20170040306A1 (en) * | 2015-06-30 | 2017-02-09 | Apple Inc. | Electronic Devices With Soft Input-Output Components |
US20180173036A1 (en) * | 2016-12-20 | 2018-06-21 | Lg Display Co., Ltd. | Display device and multiscreen display device including the same |
Also Published As
Publication number | Publication date |
---|---|
EP3782191A1 (fr) | 2021-02-24 |
KR20200004751A (ko) | 2020-01-14 |
TW202006448A (zh) | 2020-02-01 |
EP3782191A4 (fr) | 2021-06-16 |
KR102151099B1 (ko) | 2020-09-02 |
CN112335045A (zh) | 2021-02-05 |
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