EP3782191A4 - Panneau d'affichage et appareil d'affichage grand format le comprenant - Google Patents
Panneau d'affichage et appareil d'affichage grand format le comprenant Download PDFInfo
- Publication number
- EP3782191A4 EP3782191A4 EP19829907.5A EP19829907A EP3782191A4 EP 3782191 A4 EP3782191 A4 EP 3782191A4 EP 19829907 A EP19829907 A EP 19829907A EP 3782191 A4 EP3782191 A4 EP 3782191A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- same
- large format
- display panel
- display apparatus
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20180077668 | 2018-07-04 | ||
KR1020190075904A KR102151099B1 (ko) | 2018-07-04 | 2019-06-25 | 디스플레이 패널 및 이를 이용한 대형 디스플레이 장치 |
PCT/KR2019/008230 WO2020009501A1 (fr) | 2018-07-04 | 2019-07-04 | Panneau d'affichage et appareil d'affichage grand format le comprenant |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3782191A1 EP3782191A1 (fr) | 2021-02-24 |
EP3782191A4 true EP3782191A4 (fr) | 2021-06-16 |
Family
ID=69153034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19829907.5A Pending EP3782191A4 (fr) | 2018-07-04 | 2019-07-04 | Panneau d'affichage et appareil d'affichage grand format le comprenant |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3782191A4 (fr) |
KR (1) | KR102151099B1 (fr) |
CN (1) | CN112335045A (fr) |
TW (1) | TWI829715B (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210111529A (ko) * | 2020-03-03 | 2021-09-13 | 삼성전자주식회사 | 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 디스플레이 모듈 제조 방법 |
TWI804720B (zh) * | 2020-03-27 | 2023-06-11 | 南韓商太特思股份有限公司 | Led顯示模組及其顯示器 |
US20230207739A1 (en) * | 2020-04-13 | 2023-06-29 | Lg Electronics Inc. | Display device and method for manufacturing same, and multi-screen display device using same |
KR102542344B1 (ko) * | 2020-05-08 | 2023-06-13 | 삼성전자주식회사 | 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 그 제조 방법 |
EP4068373A4 (fr) * | 2020-05-08 | 2023-06-07 | Samsung Electronics Co., Ltd. | Module d'affichage comprenant un substrat en verre renfermant des câblages latéraux, et procédé de fabrication afférent |
TWI742681B (zh) * | 2020-05-21 | 2021-10-11 | 友達光電股份有限公司 | 顯示裝置 |
CN111951697B (zh) | 2020-08-10 | 2022-02-01 | Tcl华星光电技术有限公司 | 拼接显示屏 |
TWI737520B (zh) * | 2020-08-14 | 2021-08-21 | 友達光電股份有限公司 | 顯示面板 |
CN113644085B (zh) * | 2020-08-14 | 2023-06-02 | 友达光电股份有限公司 | 电子装置及电子装置的制造方法 |
KR20220039448A (ko) * | 2020-09-22 | 2022-03-29 | 삼성전자주식회사 | 측면 배선을 구비한 디스플레이 모듈 및 그 제조 방법 |
KR20220054034A (ko) * | 2020-10-23 | 2022-05-02 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
KR102328078B1 (ko) | 2021-04-13 | 2021-11-18 | 주식회사 에이맵플러스 | 디스플레이 패널, 디스플레이 장치 및 그 제조방법 |
TWI832687B (zh) * | 2023-01-30 | 2024-02-11 | 友達光電股份有限公司 | 側面電路結構及其製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2426718A1 (fr) * | 2010-09-02 | 2012-03-07 | Sony Corporation | Dispositif semi-conducteur, son procédé de fabrication et appareil électronique |
US20150029684A1 (en) * | 2013-07-25 | 2015-01-29 | Samsung Display Co., Ltd. | Flat panel display apparatus and method for manufacturing the same |
JP2015175969A (ja) * | 2014-03-14 | 2015-10-05 | 日本放送協会 | タイル型ディスプレイ及びその作製方法 |
KR20150110910A (ko) * | 2014-03-21 | 2015-10-05 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
EP3316302A1 (fr) * | 2016-10-28 | 2018-05-02 | LG Display Co., Ltd. | Afficheur à diodes électroluminescentes |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6456354B2 (en) * | 1999-08-06 | 2002-09-24 | Rainbow Displays, Inc. | Design features optimized for tiled flat-panel displays |
JP5476701B2 (ja) * | 2008-10-31 | 2014-04-23 | 株式会社大林組 | 階段 |
WO2010106637A1 (fr) * | 2009-03-17 | 2010-09-23 | パイオニア株式会社 | Module el organique et son procédé de fabrication |
US9029880B2 (en) * | 2012-12-10 | 2015-05-12 | LuxVue Technology Corporation | Active matrix display panel with ground tie lines |
US20150282293A1 (en) * | 2014-02-07 | 2015-10-01 | Google Technology Holdings LLC | Display, display assembly and device |
US9841548B2 (en) * | 2015-06-30 | 2017-12-12 | Apple Inc. | Electronic devices with soft input-output components |
US10026721B2 (en) * | 2015-06-30 | 2018-07-17 | Apple Inc. | Electronic devices with soft input-output components |
KR20170059523A (ko) * | 2015-11-20 | 2017-05-31 | 삼성디스플레이 주식회사 | 표시 장치, 타일형 표시 장치 및 이의 제조 방법 |
KR20180071657A (ko) * | 2016-12-20 | 2018-06-28 | 엘지디스플레이 주식회사 | 표시 장치와 이를 포함하는 멀티 스크린 표시 장치 |
KR102515399B1 (ko) * | 2017-12-12 | 2023-03-28 | 엘지디스플레이 주식회사 | 배선 필름 및 그를 포함한 표시 장치 |
-
2019
- 2019-06-25 KR KR1020190075904A patent/KR102151099B1/ko active IP Right Grant
- 2019-07-03 TW TW108123469A patent/TWI829715B/zh active
- 2019-07-04 EP EP19829907.5A patent/EP3782191A4/fr active Pending
- 2019-07-04 CN CN201980043639.9A patent/CN112335045A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2426718A1 (fr) * | 2010-09-02 | 2012-03-07 | Sony Corporation | Dispositif semi-conducteur, son procédé de fabrication et appareil électronique |
US20150029684A1 (en) * | 2013-07-25 | 2015-01-29 | Samsung Display Co., Ltd. | Flat panel display apparatus and method for manufacturing the same |
JP2015175969A (ja) * | 2014-03-14 | 2015-10-05 | 日本放送協会 | タイル型ディスプレイ及びその作製方法 |
KR20150110910A (ko) * | 2014-03-21 | 2015-10-05 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
EP3316302A1 (fr) * | 2016-10-28 | 2018-05-02 | LG Display Co., Ltd. | Afficheur à diodes électroluminescentes |
Also Published As
Publication number | Publication date |
---|---|
EP3782191A1 (fr) | 2021-02-24 |
TW202006448A (zh) | 2020-02-01 |
TWI829715B (zh) | 2024-01-21 |
KR102151099B1 (ko) | 2020-09-02 |
CN112335045A (zh) | 2021-02-05 |
KR20200004751A (ko) | 2020-01-14 |
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Effective date: 20201119 |
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Extension state: BA ME |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20210518 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 25/075 20060101AFI20210511BHEP Ipc: H01L 27/12 20060101ALI20210511BHEP Ipc: H01L 23/538 20060101ALI20210511BHEP Ipc: H01L 25/16 20060101ALI20210511BHEP Ipc: H01L 33/62 20100101ALI20210511BHEP Ipc: H01L 51/00 20060101ALI20210511BHEP |
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