TWI822961B - 組合物 - Google Patents

組合物 Download PDF

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Publication number
TWI822961B
TWI822961B TW109105654A TW109105654A TWI822961B TW I822961 B TWI822961 B TW I822961B TW 109105654 A TW109105654 A TW 109105654A TW 109105654 A TW109105654 A TW 109105654A TW I822961 B TWI822961 B TW I822961B
Authority
TW
Taiwan
Prior art keywords
compound
group
formula
organic electroluminescent
phosphite
Prior art date
Application number
TW109105654A
Other languages
English (en)
Chinese (zh)
Other versions
TW202045613A (zh
Inventor
石田泰則
栗村啓之
山下幸彦
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202045613A publication Critical patent/TW202045613A/zh
Application granted granted Critical
Publication of TWI822961B publication Critical patent/TWI822961B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Confectionery (AREA)
TW109105654A 2019-02-21 2020-02-21 組合物 TWI822961B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019028989 2019-02-21
JP2019-028989 2019-02-21

Publications (2)

Publication Number Publication Date
TW202045613A TW202045613A (zh) 2020-12-16
TWI822961B true TWI822961B (zh) 2023-11-21

Family

ID=72143534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109105654A TWI822961B (zh) 2019-02-21 2020-02-21 組合物

Country Status (5)

Country Link
JP (2) JP7220277B2 (https=)
KR (1) KR102814018B1 (https=)
CN (1) CN113272383B (https=)
TW (1) TWI822961B (https=)
WO (1) WO2020171186A1 (https=)

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CN112470551B (zh) * 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物
JP7755938B2 (ja) * 2021-03-31 2025-10-17 株式会社Adeka 重合性組成物
KR102938554B1 (ko) 2021-10-05 2026-03-13 주식회사 엘지에너지솔루션 이차전지 트레이
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
JPWO2024095948A1 (https=) * 2022-11-04 2024-05-10
WO2024172143A1 (ja) 2023-02-15 2024-08-22 味の素株式会社 改質された蛋白質含有食品の製造方法
KR20250158807A (ko) 2023-03-17 2025-11-06 덴카 주식회사 조성물, 경화체, 표시 장치 및 표시 장치의 제조 방법

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CN108546536A (zh) * 2018-05-17 2018-09-18 深圳飞世尔新材料股份有限公司 一种oled边框封装用环氧胶粘合剂及其制备方法
TW201900715A (zh) * 2017-03-30 2019-01-01 日商味之素股份有限公司 糊狀樹脂組成物

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JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4497704B2 (ja) * 2000-10-31 2010-07-07 株式会社Adeka 難燃剤及び該難燃剤を含有する難燃性エポキシ樹脂組成物、並びに該組成物からなるビルドアップ用硬化性組成物
JP4860831B2 (ja) * 2001-03-01 2012-01-25 株式会社リコー 光硬化型エポキシ樹脂組成物および光硬化型表示素子用シール剤
JP4800247B2 (ja) 2002-06-17 2011-10-26 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子
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JP5919574B2 (ja) 2011-10-24 2016-05-18 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材
KR101999614B1 (ko) * 2012-11-28 2019-07-12 닛뽄 가야쿠 가부시키가이샤 수지 조성물 및 그 경화물(1)
CN105026456B (zh) * 2013-08-26 2017-10-17 积水化学工业株式会社 光后固化性树脂组合物
WO2015111635A1 (ja) * 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
JP2015196783A (ja) * 2014-04-02 2015-11-09 株式会社ダイセル シート状組成物
JP6378985B2 (ja) 2014-09-10 2018-08-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
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CN108546536A (zh) * 2018-05-17 2018-09-18 深圳飞世尔新材料股份有限公司 一种oled边框封装用环氧胶粘合剂及其制备方法

Also Published As

Publication number Publication date
CN113272383A (zh) 2021-08-17
KR102814018B1 (ko) 2025-05-29
JP7220277B2 (ja) 2023-02-09
KR20210132001A (ko) 2021-11-03
CN113272383B (zh) 2023-11-17
WO2020171186A1 (ja) 2020-08-27
JP7397151B2 (ja) 2023-12-12
TW202045613A (zh) 2020-12-16
JPWO2020171186A1 (ja) 2021-12-23
JP2023022040A (ja) 2023-02-14

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