CN113272383B - 组合物 - Google Patents

组合物 Download PDF

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Publication number
CN113272383B
CN113272383B CN202080007212.6A CN202080007212A CN113272383B CN 113272383 B CN113272383 B CN 113272383B CN 202080007212 A CN202080007212 A CN 202080007212A CN 113272383 B CN113272383 B CN 113272383B
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China
Prior art keywords
compound
group
formula
composition
organic electroluminescent
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CN202080007212.6A
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English (en)
Chinese (zh)
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CN113272383A (zh
Inventor
石田泰则
栗村启之
山下幸彦
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Denka Co Ltd
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Denka Co Ltd
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Publication of CN113272383A publication Critical patent/CN113272383A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Confectionery (AREA)
CN202080007212.6A 2019-02-21 2020-02-20 组合物 Active CN113272383B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019028989 2019-02-21
JP2019-028989 2019-02-21
PCT/JP2020/006922 WO2020171186A1 (ja) 2019-02-21 2020-02-20 組成物

Publications (2)

Publication Number Publication Date
CN113272383A CN113272383A (zh) 2021-08-17
CN113272383B true CN113272383B (zh) 2023-11-17

Family

ID=72143534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080007212.6A Active CN113272383B (zh) 2019-02-21 2020-02-20 组合物

Country Status (5)

Country Link
JP (2) JP7220277B2 (https=)
KR (1) KR102814018B1 (https=)
CN (1) CN113272383B (https=)
TW (1) TWI822961B (https=)
WO (1) WO2020171186A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112470551B (zh) * 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物
JP7755938B2 (ja) * 2021-03-31 2025-10-17 株式会社Adeka 重合性組成物
KR102938554B1 (ko) 2021-10-05 2026-03-13 주식회사 엘지에너지솔루션 이차전지 트레이
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
JPWO2024095948A1 (https=) * 2022-11-04 2024-05-10
WO2024172143A1 (ja) 2023-02-15 2024-08-22 味の素株式会社 改質された蛋白質含有食品の製造方法
KR20250158807A (ko) 2023-03-17 2025-11-06 덴카 주식회사 조성물, 경화체, 표시 장치 및 표시 장치의 제조 방법

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JP2013023574A (ja) * 2011-07-21 2013-02-04 Jsr Corp 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
CN104813741A (zh) * 2012-11-28 2015-07-29 日本化药株式会社 树脂组合物及其固化物(1)
CN105026456A (zh) * 2013-08-26 2015-11-04 积水化学工业株式会社 光后固化性树脂组合物
CN105916937A (zh) * 2014-01-23 2016-08-31 电化株式会社 树脂组合物
WO2018181737A1 (ja) * 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物

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JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4860831B2 (ja) * 2001-03-01 2012-01-25 株式会社リコー 光硬化型エポキシ樹脂組成物および光硬化型表示素子用シール剤
JP4800247B2 (ja) 2002-06-17 2011-10-26 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
WO2005028536A1 (ja) 2003-09-22 2005-03-31 Mitsubishi Chemical Corporation 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体および脂環式エポキシ樹脂組成物の用途
JP2007513234A (ja) 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性の放射線硬化性組成物
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JP4850231B2 (ja) 2005-01-26 2012-01-11 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤
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JP6378985B2 (ja) 2014-09-10 2018-08-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP6694180B2 (ja) * 2016-01-29 2020-05-13 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
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Publication number Priority date Publication date Assignee Title
JP2000264955A (ja) * 1999-01-12 2000-09-26 Namics Corp カチオン重合性樹脂組成物
JP2002003582A (ja) * 2000-04-17 2002-01-09 Mitsubishi Electric Corp 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法
JP2002138283A (ja) * 2000-10-31 2002-05-14 Asahi Denka Kogyo Kk 難燃剤及び該難燃剤を含有する難燃性エポキシ樹脂組成物、並びに該組成物からなるビルドアップ用硬化性組成物
JP2012136614A (ja) * 2010-12-27 2012-07-19 Three Bond Co Ltd ガスバリア性光硬化型樹脂組成物
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CN104813741A (zh) * 2012-11-28 2015-07-29 日本化药株式会社 树脂组合物及其固化物(1)
CN105026456A (zh) * 2013-08-26 2015-11-04 积水化学工业株式会社 光后固化性树脂组合物
CN105916937A (zh) * 2014-01-23 2016-08-31 电化株式会社 树脂组合物
WO2018181737A1 (ja) * 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物

Also Published As

Publication number Publication date
CN113272383A (zh) 2021-08-17
KR102814018B1 (ko) 2025-05-29
JP7220277B2 (ja) 2023-02-09
KR20210132001A (ko) 2021-11-03
WO2020171186A1 (ja) 2020-08-27
JP7397151B2 (ja) 2023-12-12
TW202045613A (zh) 2020-12-16
JPWO2020171186A1 (ja) 2021-12-23
TWI822961B (zh) 2023-11-21
JP2023022040A (ja) 2023-02-14

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