KR102814018B1 - 조성물 - Google Patents

조성물 Download PDF

Info

Publication number
KR102814018B1
KR102814018B1 KR1020217022856A KR20217022856A KR102814018B1 KR 102814018 B1 KR102814018 B1 KR 102814018B1 KR 1020217022856 A KR1020217022856 A KR 1020217022856A KR 20217022856 A KR20217022856 A KR 20217022856A KR 102814018 B1 KR102814018 B1 KR 102814018B1
Authority
KR
South Korea
Prior art keywords
compound
composition
group
bisphenol
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217022856A
Other languages
English (en)
Korean (ko)
Other versions
KR20210132001A (ko
Inventor
야스노리 이시다
히로유키 쿠리무라
유키히코 야마시타
Original Assignee
덴카 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 덴카 주식회사 filed Critical 덴카 주식회사
Publication of KR20210132001A publication Critical patent/KR20210132001A/ko
Application granted granted Critical
Publication of KR102814018B1 publication Critical patent/KR102814018B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Confectionery (AREA)
KR1020217022856A 2019-02-21 2020-02-20 조성물 Active KR102814018B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019028989 2019-02-21
JPJP-P-2019-028989 2019-02-21
PCT/JP2020/006922 WO2020171186A1 (ja) 2019-02-21 2020-02-20 組成物

Publications (2)

Publication Number Publication Date
KR20210132001A KR20210132001A (ko) 2021-11-03
KR102814018B1 true KR102814018B1 (ko) 2025-05-29

Family

ID=72143534

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217022856A Active KR102814018B1 (ko) 2019-02-21 2020-02-20 조성물

Country Status (5)

Country Link
JP (2) JP7220277B2 (https=)
KR (1) KR102814018B1 (https=)
CN (1) CN113272383B (https=)
TW (1) TWI822961B (https=)
WO (1) WO2020171186A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112470551B (zh) * 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物
JP7755938B2 (ja) * 2021-03-31 2025-10-17 株式会社Adeka 重合性組成物
KR102938554B1 (ko) 2021-10-05 2026-03-13 주식회사 엘지에너지솔루션 이차전지 트레이
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
JPWO2024095948A1 (https=) * 2022-11-04 2024-05-10
WO2024172143A1 (ja) 2023-02-15 2024-08-22 味の素株式会社 改質された蛋白質含有食品の製造方法
KR20250158807A (ko) 2023-03-17 2025-11-06 덴카 주식회사 조성물, 경화체, 표시 장치 및 표시 장치의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012116935A (ja) * 2010-11-30 2012-06-21 Daicel Corp 硬化性エポキシ樹脂組成物

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4392096B2 (ja) * 1999-01-12 2009-12-24 ナミックス株式会社 カチオン重合性樹脂組成物
JP4560982B2 (ja) 2000-04-17 2010-10-13 三菱電機株式会社 高圧回転機用絶縁コイルの製造方法
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4497704B2 (ja) * 2000-10-31 2010-07-07 株式会社Adeka 難燃剤及び該難燃剤を含有する難燃性エポキシ樹脂組成物、並びに該組成物からなるビルドアップ用硬化性組成物
JP4860831B2 (ja) * 2001-03-01 2012-01-25 株式会社リコー 光硬化型エポキシ樹脂組成物および光硬化型表示素子用シール剤
JP4800247B2 (ja) 2002-06-17 2011-10-26 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
WO2005028536A1 (ja) 2003-09-22 2005-03-31 Mitsubishi Chemical Corporation 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体および脂環式エポキシ樹脂組成物の用途
JP2007513234A (ja) 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性の放射線硬化性組成物
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP4850231B2 (ja) 2005-01-26 2012-01-11 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤
JP2007247342A (ja) 2006-03-17 2007-09-27 Kubota Corp フロントローダ支持装置
JP5685879B2 (ja) 2010-10-08 2015-03-18 住友ベークライト株式会社 樹脂硬化物、透明複合基板、表示素子基板および樹脂硬化物の製造方法
JP2012136614A (ja) * 2010-12-27 2012-07-19 Three Bond Co Ltd ガスバリア性光硬化型樹脂組成物
EP2660927B1 (en) * 2010-12-27 2018-08-22 ThreeBond Fine Chemical Co., Ltd. Sealant composition for photoelectric conversion element
JP5843508B2 (ja) * 2011-07-21 2016-01-13 Jsr株式会社 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
JP5919574B2 (ja) 2011-10-24 2016-05-18 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材
KR101999614B1 (ko) * 2012-11-28 2019-07-12 닛뽄 가야쿠 가부시키가이샤 수지 조성물 및 그 경화물(1)
CN105026456B (zh) * 2013-08-26 2017-10-17 积水化学工业株式会社 光后固化性树脂组合物
US9711378B2 (en) * 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
WO2015111635A1 (ja) * 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
JP2015196783A (ja) * 2014-04-02 2015-11-09 株式会社ダイセル シート状組成物
JP6378985B2 (ja) 2014-09-10 2018-08-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP6694180B2 (ja) * 2016-01-29 2020-05-13 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
KR102561855B1 (ko) * 2017-03-30 2023-08-02 아지노모토 가부시키가이샤 페이스트상 수지 조성물
JP2018172493A (ja) 2017-03-31 2018-11-08 株式会社Adeka 硬化性組成物、硬化物の製造方法、その硬化物、およびそれを用いた接着剤
CN108546536A (zh) * 2018-05-17 2018-09-18 深圳飞世尔新材料股份有限公司 一种oled边框封装用环氧胶粘合剂及其制备方法
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012116935A (ja) * 2010-11-30 2012-06-21 Daicel Corp 硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
CN113272383A (zh) 2021-08-17
JP7220277B2 (ja) 2023-02-09
KR20210132001A (ko) 2021-11-03
CN113272383B (zh) 2023-11-17
WO2020171186A1 (ja) 2020-08-27
JP7397151B2 (ja) 2023-12-12
TW202045613A (zh) 2020-12-16
JPWO2020171186A1 (ja) 2021-12-23
TWI822961B (zh) 2023-11-21
JP2023022040A (ja) 2023-02-14

Similar Documents

Publication Publication Date Title
KR102814018B1 (ko) 조성물
JP6578339B2 (ja) 樹脂組成物
KR102536932B1 (ko) 유기 일렉트로 루미네센스 소자용 봉지제
KR102385321B1 (ko) 수지 조성물
KR102784453B1 (ko) 유기 일렉트로루미네센스 표시 소자용 봉지제
KR102772994B1 (ko) 봉지제, 경화체, 유기 일렉트로 루미네센스 표시 장치 및 장치의 제조 방법
CN113227159A (zh) 组合物
JP7440498B2 (ja) 組成物
JP2025164342A (ja) 光電変換素子用封止材、フィル材、およびフィル材を用いた装置の製造方法
WO2025220565A1 (ja) 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法
JP2025164333A (ja) 光電変換素子用封止材、ダム材、およびダム材を用いた装置の製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000