JP7220277B2 - 組成物 - Google Patents

組成物 Download PDF

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Publication number
JP7220277B2
JP7220277B2 JP2021502156A JP2021502156A JP7220277B2 JP 7220277 B2 JP7220277 B2 JP 7220277B2 JP 2021502156 A JP2021502156 A JP 2021502156A JP 2021502156 A JP2021502156 A JP 2021502156A JP 7220277 B2 JP7220277 B2 JP 7220277B2
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JP
Japan
Prior art keywords
group
formula
compound
organic electroluminescence
composition
Prior art date
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JP2021502156A
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English (en)
Japanese (ja)
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JPWO2020171186A5 (https=
JPWO2020171186A1 (ja
Inventor
泰則 石田
啓之 栗村
幸彦 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2020171186A1 publication Critical patent/JPWO2020171186A1/ja
Priority to JP2022177100A priority Critical patent/JP7397151B2/ja
Publication of JPWO2020171186A5 publication Critical patent/JPWO2020171186A5/ja
Application granted granted Critical
Publication of JP7220277B2 publication Critical patent/JP7220277B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Confectionery (AREA)
JP2021502156A 2019-02-21 2020-02-20 組成物 Active JP7220277B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022177100A JP7397151B2 (ja) 2019-02-21 2022-11-04 組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019028989 2019-02-21
JP2019028989 2019-02-21
PCT/JP2020/006922 WO2020171186A1 (ja) 2019-02-21 2020-02-20 組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022177100A Division JP7397151B2 (ja) 2019-02-21 2022-11-04 組成物

Publications (3)

Publication Number Publication Date
JPWO2020171186A1 JPWO2020171186A1 (ja) 2021-12-23
JPWO2020171186A5 JPWO2020171186A5 (https=) 2022-11-14
JP7220277B2 true JP7220277B2 (ja) 2023-02-09

Family

ID=72143534

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021502156A Active JP7220277B2 (ja) 2019-02-21 2020-02-20 組成物
JP2022177100A Active JP7397151B2 (ja) 2019-02-21 2022-11-04 組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022177100A Active JP7397151B2 (ja) 2019-02-21 2022-11-04 組成物

Country Status (5)

Country Link
JP (2) JP7220277B2 (https=)
KR (1) KR102814018B1 (https=)
CN (1) CN113272383B (https=)
TW (1) TWI822961B (https=)
WO (1) WO2020171186A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112470551B (zh) * 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物
JP7755938B2 (ja) * 2021-03-31 2025-10-17 株式会社Adeka 重合性組成物
KR102938554B1 (ko) 2021-10-05 2026-03-13 주식회사 엘지에너지솔루션 이차전지 트레이
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
JPWO2024095948A1 (https=) * 2022-11-04 2024-05-10
WO2024172143A1 (ja) 2023-02-15 2024-08-22 味の素株式会社 改質された蛋白質含有食品の製造方法
KR20250158807A (ko) 2023-03-17 2025-11-06 덴카 주식회사 조성물, 경화체, 표시 장치 및 표시 장치의 제조 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000264955A (ja) 1999-01-12 2000-09-26 Namics Corp カチオン重合性樹脂組成物
JP2002003582A (ja) 2000-04-17 2002-01-09 Mitsubishi Electric Corp 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法
JP2002138283A (ja) 2000-10-31 2002-05-14 Asahi Denka Kogyo Kk 難燃剤及び該難燃剤を含有する難燃性エポキシ樹脂組成物、並びに該組成物からなるビルドアップ用硬化性組成物
JP2010215924A (ja) 2003-09-22 2010-09-30 Mitsubishi Chemicals Corp 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体、およびその用途
JP2012082297A (ja) 2010-10-08 2012-04-26 Sumitomo Bakelite Co Ltd 樹脂硬化物、透明複合基板および表示素子基板
JP2012136614A (ja) 2010-12-27 2012-07-19 Three Bond Co Ltd ガスバリア性光硬化型樹脂組成物
JP2013023574A (ja) 2011-07-21 2013-02-04 Jsr Corp 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
WO2015111635A1 (ja) 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
WO2018181737A1 (ja) 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物
JP2018172493A (ja) 2017-03-31 2018-11-08 株式会社Adeka 硬化性組成物、硬化物の製造方法、その硬化物、およびそれを用いた接着剤

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4860831B2 (ja) * 2001-03-01 2012-01-25 株式会社リコー 光硬化型エポキシ樹脂組成物および光硬化型表示素子用シール剤
JP4800247B2 (ja) 2002-06-17 2011-10-26 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2007513234A (ja) 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性の放射線硬化性組成物
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP4850231B2 (ja) 2005-01-26 2012-01-11 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤
JP2007247342A (ja) 2006-03-17 2007-09-27 Kubota Corp フロントローダ支持装置
JP5832740B2 (ja) 2010-11-30 2015-12-16 株式会社ダイセル 硬化性エポキシ樹脂組成物
EP2660927B1 (en) * 2010-12-27 2018-08-22 ThreeBond Fine Chemical Co., Ltd. Sealant composition for photoelectric conversion element
JP5919574B2 (ja) 2011-10-24 2016-05-18 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材
KR101999614B1 (ko) * 2012-11-28 2019-07-12 닛뽄 가야쿠 가부시키가이샤 수지 조성물 및 그 경화물(1)
CN105026456B (zh) * 2013-08-26 2017-10-17 积水化学工业株式会社 光后固化性树脂组合物
US9711378B2 (en) * 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JP2015196783A (ja) * 2014-04-02 2015-11-09 株式会社ダイセル シート状組成物
JP6378985B2 (ja) 2014-09-10 2018-08-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP6694180B2 (ja) * 2016-01-29 2020-05-13 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
CN108546536A (zh) * 2018-05-17 2018-09-18 深圳飞世尔新材料股份有限公司 一种oled边框封装用环氧胶粘合剂及其制备方法
CN113272383B (zh) * 2019-02-21 2023-11-17 电化株式会社 组合物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000264955A (ja) 1999-01-12 2000-09-26 Namics Corp カチオン重合性樹脂組成物
JP2002003582A (ja) 2000-04-17 2002-01-09 Mitsubishi Electric Corp 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法
JP2002138283A (ja) 2000-10-31 2002-05-14 Asahi Denka Kogyo Kk 難燃剤及び該難燃剤を含有する難燃性エポキシ樹脂組成物、並びに該組成物からなるビルドアップ用硬化性組成物
JP2010215924A (ja) 2003-09-22 2010-09-30 Mitsubishi Chemicals Corp 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体、およびその用途
JP2012082297A (ja) 2010-10-08 2012-04-26 Sumitomo Bakelite Co Ltd 樹脂硬化物、透明複合基板および表示素子基板
JP2012136614A (ja) 2010-12-27 2012-07-19 Three Bond Co Ltd ガスバリア性光硬化型樹脂組成物
JP2013023574A (ja) 2011-07-21 2013-02-04 Jsr Corp 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
WO2015111635A1 (ja) 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
WO2018181737A1 (ja) 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物
JP2018172493A (ja) 2017-03-31 2018-11-08 株式会社Adeka 硬化性組成物、硬化物の製造方法、その硬化物、およびそれを用いた接着剤

Also Published As

Publication number Publication date
CN113272383A (zh) 2021-08-17
KR102814018B1 (ko) 2025-05-29
KR20210132001A (ko) 2021-11-03
CN113272383B (zh) 2023-11-17
WO2020171186A1 (ja) 2020-08-27
JP7397151B2 (ja) 2023-12-12
TW202045613A (zh) 2020-12-16
JPWO2020171186A1 (ja) 2021-12-23
TWI822961B (zh) 2023-11-21
JP2023022040A (ja) 2023-02-14

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