TWI821223B - 負型感光性樹脂組成物 - Google Patents
負型感光性樹脂組成物 Download PDFInfo
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- TWI821223B TWI821223B TW107144333A TW107144333A TWI821223B TW I821223 B TWI821223 B TW I821223B TW 107144333 A TW107144333 A TW 107144333A TW 107144333 A TW107144333 A TW 107144333A TW I821223 B TWI821223 B TW I821223B
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- resin composition
- photosensitive resin
- negative photosensitive
- compound
- ink repellent
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- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
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- 125000000816 ethylene group Chemical class [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
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- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
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- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
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- 230000001235 sensitizing effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-236753 | 2017-12-11 | ||
| JP2017236753 | 2017-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201928523A TW201928523A (zh) | 2019-07-16 |
| TWI821223B true TWI821223B (zh) | 2023-11-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107144333A TWI821223B (zh) | 2017-12-11 | 2018-12-10 | 負型感光性樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7375546B2 (ko) |
| CN (1) | CN111480114B (ko) |
| TW (1) | TWI821223B (ko) |
| WO (1) | WO2019117018A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113448164A (zh) * | 2020-03-26 | 2021-09-28 | 台湾永光化学工业股份有限公司 | 负型感旋光性树脂组成物及其用途 |
| JPWO2021235541A1 (ko) * | 2020-05-22 | 2021-11-25 | ||
| WO2024005195A1 (ja) * | 2022-07-01 | 2024-01-04 | 大阪有機化学工業株式会社 | 硬化性樹脂組成物、当該組成物を硬化させた絶縁性硬化膜及びタッチパネル用絶縁性硬化膜、並びに、タッチパネル |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200610791A (en) * | 2004-09-28 | 2006-04-01 | San Ei Kagaku Co | Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same |
| TW201133134A (en) * | 2009-12-28 | 2011-10-01 | Asahi Glass Co Ltd | Photosensitive composition, partition wall, color filter and organic el element |
| JP2013076793A (ja) * | 2011-09-30 | 2013-04-25 | Sanyo Chem Ind Ltd | 感光性樹脂組成物およびタッチパネル用保護膜 |
| TW201428425A (zh) * | 2012-11-28 | 2014-07-16 | Asahi Glass Co Ltd | 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 |
| TW201543163A (zh) * | 2014-02-18 | 2015-11-16 | Asahi Glass Co Ltd | 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 |
| WO2017159543A1 (ja) * | 2016-03-15 | 2017-09-21 | 東レ株式会社 | 感光性樹脂組成物、硬化膜、積層体、タッチパネル用部材及び硬化膜の製造方法 |
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| JPH1095892A (ja) * | 1996-09-20 | 1998-04-14 | Nippon Kayaku Co Ltd | 封止用樹脂組成物及びその硬化物 |
| JP2008292677A (ja) * | 2007-05-23 | 2008-12-04 | Mitsubishi Chemicals Corp | 反応性樹脂組成物、カラーフィルター及び画像表示装置 |
| JP2009157235A (ja) * | 2007-12-27 | 2009-07-16 | Sanyo Chem Ind Ltd | 感光性樹脂組成物 |
| TW201329635A (zh) * | 2011-11-11 | 2013-07-16 | Asahi Glass Co Ltd | 負型感光性樹脂組成物、隔壁、黑色矩陣及光學元件 |
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| TW200610791A (en) * | 2004-09-28 | 2006-04-01 | San Ei Kagaku Co | Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same |
| TW201133134A (en) * | 2009-12-28 | 2011-10-01 | Asahi Glass Co Ltd | Photosensitive composition, partition wall, color filter and organic el element |
| JP2013076793A (ja) * | 2011-09-30 | 2013-04-25 | Sanyo Chem Ind Ltd | 感光性樹脂組成物およびタッチパネル用保護膜 |
| TW201428425A (zh) * | 2012-11-28 | 2014-07-16 | Asahi Glass Co Ltd | 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 |
| TW201543163A (zh) * | 2014-02-18 | 2015-11-16 | Asahi Glass Co Ltd | 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 |
| WO2017159543A1 (ja) * | 2016-03-15 | 2017-09-21 | 東レ株式会社 | 感光性樹脂組成物、硬化膜、積層体、タッチパネル用部材及び硬化膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111480114B (zh) | 2023-12-05 |
| JPWO2019117018A1 (ja) | 2020-12-24 |
| WO2019117018A1 (ja) | 2019-06-20 |
| JP7375546B2 (ja) | 2023-11-08 |
| KR20200088797A (ko) | 2020-07-23 |
| CN111480114A (zh) | 2020-07-31 |
| TW201928523A (zh) | 2019-07-16 |
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