TW200610791A - Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same - Google Patents

Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same

Info

Publication number
TW200610791A
TW200610791A TW094127358A TW94127358A TW200610791A TW 200610791 A TW200610791 A TW 200610791A TW 094127358 A TW094127358 A TW 094127358A TW 94127358 A TW94127358 A TW 94127358A TW 200610791 A TW200610791 A TW 200610791A
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
resistance
photosensitive thermosetting
circuit board
Prior art date
Application number
TW094127358A
Other languages
Chinese (zh)
Other versions
TWI319411B (en
Inventor
Kiyoshi Satou
Toshimitsu Kunou
Yukihiro Koga
Yasuhiro Kuroyanagi
Yukihiro Usui
Original Assignee
San Ei Kagaku Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Co filed Critical San Ei Kagaku Co
Publication of TW200610791A publication Critical patent/TW200610791A/en
Application granted granted Critical
Publication of TWI319411B publication Critical patent/TWI319411B/zh

Links

Abstract

The present invention provides a photosensitive thermosetting resin composition which has excellent storage stability and can give photoresists excellent developability, dryness to contact, flexural resistance, adhesiveness, coating film transparency, HAST (highly accelerated temperature and humidity stress test) resistance (especially HAST resistance in electric insulating property), heat shock resistance, and the like. Furthermore, the present invention also provides a smoothed printed circuit board having the excellent photoresist and a method for producing the same. This photosensitive thermosetting resin composition is characterized by comprising an unsaturated group-containing polycarboxylic acid resin [I], a diluent [III], a photopolymerization initiator [IV], a crystalline epoxy resin [V] represented by below formula (V), and a hardening adhesiveness-imparting agent [VI].
TW094127358A 2004-09-28 2005-08-11 Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same TW200610791A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004311541A JP4683182B2 (en) 2004-09-28 2004-09-28 Photosensitive thermosetting resin composition, resist-coated printed wiring board and method for producing the same

Publications (2)

Publication Number Publication Date
TW200610791A true TW200610791A (en) 2006-04-01
TWI319411B TWI319411B (en) 2010-01-11

Family

ID=36237083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127358A TW200610791A (en) 2004-09-28 2005-08-11 Photosensitive thermosetting resin composition, and photoresist-coated printed circuit board and method for producing the same

Country Status (3)

Country Link
JP (1) JP4683182B2 (en)
CN (1) CN1755524B (en)
TW (1) TW200610791A (en)

Cited By (3)

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TWI620012B (en) * 2015-11-02 2018-04-01 互應化學工業股份有限公司 Photo-sensitive resin composition, dry film, and printed wiring board
TWI671553B (en) * 2017-10-20 2019-09-11 大陸商友達光電（昆山）有限公司 Method for fabricating display panel and display panel
TWI821223B (en) * 2017-12-11 2023-11-11 日商Ａｇｃ股份有限公司 Negative photosensitive resin composition

Families Citing this family (45)

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JP4793815B2 (en) * 2005-12-28 2011-10-12 日本化薬株式会社 Photosensitive resin composition and cured product thereof
JP5256645B2 (en) * 2006-05-31 2013-08-07 三菱化学株式会社 Thermosetting composition for protective film, cured product, and liquid crystal display device
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US8361605B2 (en) 2007-04-24 2013-01-29 Mitsui Chemicals, Inc. Photosensitive resin composition, dry film, and processed product made using the same
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KR20090068158A (en) * 2007-12-21 2009-06-25 다이요 잉키 세이조 가부시키가이샤 Photocurable/thermosetting resin composition, dry film and printed wiring board using the same
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WO2009145153A1 (en) * 2008-05-29 2009-12-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
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WO2016121395A1 (en) * 2015-01-28 2016-08-04 互応化学工業株式会社 Light-sensitive resin composition, dry film, and printed circuit board
JP6055028B2 (en) * 2015-05-29 2016-12-27 互応化学工業株式会社 Photosensitive resin composition, solder resist composition and printed wiring board
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JP6912494B2 (en) * 2016-11-18 2021-08-04 株式会社有沢製作所 Photosensitive resin composition, solder resist film using the photosensitive resin composition, flexible printed wiring board and image display device
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Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3254572B2 (en) * 1996-06-28 2002-02-12 バンティコ株式会社 Photopolymerizable thermosetting resin composition
WO2001053375A1 (en) * 2000-01-18 2001-07-26 Taiyo Ink Manufacturing Co., Ltd. Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same
JP5027357B2 (en) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition and printed wiring board
WO2002096969A1 (en) * 2001-05-25 2002-12-05 Taiyo Ink Manufacturing Co., Ltd. Light- and heat-curing resin composition
JP3911690B2 (en) * 2001-07-19 2007-05-09 山栄化学株式会社 Thermosetting resin composition, smooth plate manufacturing method and smooth plate
CN1334293A (en) * 2001-08-15 2002-02-06 南亚塑胶工业股份有限公司 Photosensitive thermosetting resin composition
JP2003192763A (en) * 2001-12-27 2003-07-09 Taiyo Ink Mfg Ltd Photocurable thermosetting resin composition, and printed-wiring board using the same
JP4087650B2 (en) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and cured product thereof
JP3799551B2 (en) * 2002-08-14 2006-07-19 山栄化学株式会社 Photo / thermosetting resin composition, smooth plate manufacturing method and smooth plate
WO2006008995A1 (en) * 2004-07-15 2006-01-26 Taiyo Ink Manufacturing Co., Ltd. Photocurable/thermosetting resin composition and cured product thereof
JP4400926B2 (en) * 2004-08-26 2010-01-20 日本化薬株式会社 Photosensitive resin composition and cured product thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620012B (en) * 2015-11-02 2018-04-01 互應化學工業股份有限公司 Photo-sensitive resin composition, dry film, and printed wiring board
TWI671553B (en) * 2017-10-20 2019-09-11 大陸商友達光電（昆山）有限公司 Method for fabricating display panel and display panel
TWI821223B (en) * 2017-12-11 2023-11-11 日商Ａｇｃ股份有限公司 Negative photosensitive resin composition

Also Published As

Publication number Publication date
CN1755524B (en) 2010-05-05
TWI319411B (en) 2010-01-11
CN1755524A (en) 2006-04-05
JP4683182B2 (en) 2011-05-11
JP2006096962A (en) 2006-04-13

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