TWI806510B - 具有記憶元件的半導體裝置 - Google Patents

具有記憶元件的半導體裝置 Download PDF

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Publication number
TWI806510B
TWI806510B TW111110594A TW111110594A TWI806510B TW I806510 B TWI806510 B TW I806510B TW 111110594 A TW111110594 A TW 111110594A TW 111110594 A TW111110594 A TW 111110594A TW I806510 B TWI806510 B TW I806510B
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TW
Taiwan
Prior art keywords
conductor layer
aforementioned
gate conductor
layer
gate
Prior art date
Application number
TW111110594A
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English (en)
Chinese (zh)
Other versions
TW202247351A (zh
Inventor
原田望
作井康司
Original Assignee
新加坡商新加坡優尼山帝斯電子私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 新加坡商新加坡優尼山帝斯電子私人有限公司 filed Critical 新加坡商新加坡優尼山帝斯電子私人有限公司
Publication of TW202247351A publication Critical patent/TW202247351A/zh
Application granted granted Critical
Publication of TWI806510B publication Critical patent/TWI806510B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches 
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C14/00—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down
    • G11C14/0009—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down in which the volatile element is a DRAM cell
    • G11C14/0036—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down in which the volatile element is a DRAM cell and the nonvolatile element is a magnetic RAM [MRAM] element or ferromagnetic cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/036—Making the capacitor or connections thereto the capacitor extending under the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/33—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Databases & Information Systems (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
TW111110594A 2021-04-06 2022-03-22 具有記憶元件的半導體裝置 TWI806510B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2021/014601 WO2022215157A1 (ja) 2021-04-06 2021-04-06 メモリ素子を有する半導体装置
WOPCT/JP2021/014601 2021-04-06

Publications (2)

Publication Number Publication Date
TW202247351A TW202247351A (zh) 2022-12-01
TWI806510B true TWI806510B (zh) 2023-06-21

Family

ID=83450170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110594A TWI806510B (zh) 2021-04-06 2022-03-22 具有記憶元件的半導體裝置

Country Status (4)

Country Link
US (1) US12016172B2 (https=)
JP (1) JP7381145B2 (https=)
TW (1) TWI806510B (https=)
WO (1) WO2022215157A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022219696A1 (ja) * 2021-04-13 2022-10-20 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
WO2024042609A1 (ja) * 2022-08-23 2024-02-29 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
WO2024079816A1 (ja) * 2022-10-12 2024-04-18 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
WO2024134770A1 (ja) * 2022-12-20 2024-06-27 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
CN118265288A (zh) * 2022-12-26 2024-06-28 长江存储科技有限责任公司 存储器器件和用于形成存储器器件的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150325444A1 (en) * 2013-05-16 2015-11-12 Unisantis Electronics Singapore Pte. Ltd. Method for producing an sgt-including semiconductor device
US20170330623A1 (en) * 2016-05-12 2017-11-16 Korea University Research And Business Foundation Dual gate semiconductor memory device with vertical semiconductor column

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Publication number Priority date Publication date Assignee Title
JP2703970B2 (ja) 1989-01-17 1998-01-26 株式会社東芝 Ｍｏｓ型半導体装置
JPH03171768A (ja) 1989-11-30 1991-07-25 Toshiba Corp 半導体記憶装置
JP3957774B2 (ja) 1995-06-23 2007-08-15 株式会社東芝 半導体装置
US6137128A (en) * 1998-06-09 2000-10-24 International Business Machines Corporation Self-isolated and self-aligned 4F-square vertical fet-trench dram cells
JP3808763B2 (ja) 2001-12-14 2006-08-16 株式会社東芝 半導体メモリ装置およびその製造方法
JP4919767B2 (ja) 2006-11-10 2012-04-18 株式会社東芝 半導体記憶装置
JP5078338B2 (ja) 2006-12-12 2012-11-21 ルネサスエレクトロニクス株式会社 半導体記憶装置
US7919800B2 (en) 2007-02-26 2011-04-05 Micron Technology, Inc. Capacitor-less memory cells and cell arrays
WO2009090892A1 (ja) * 2008-01-18 2009-07-23 Sharp Kabushiki Kaisha 不揮発性ランダムアクセスメモリ
JP2011165815A (ja) 2010-02-08 2011-08-25 Toshiba Corp 不揮発性半導体記憶装置
US20160013312A1 (en) 2013-03-05 2016-01-14 PS4 Luxco S.A.R.L Semiconductor device and manufacturing method therefor
JP5938529B1 (ja) * 2015-01-08 2016-06-22 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． 柱状半導体装置と、その製造方法
JP6104477B2 (ja) * 2015-04-06 2017-03-29 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． 柱状半導体メモリ装置と、その製造方法
KR102529073B1 (ko) 2015-04-29 2023-05-08 제노 세미컨덕터, 인크. 백바이어스를 이용한 드레인 전류가 향상된 트랜지스터 및 메모리 셀
US12048140B2 (en) * 2020-12-25 2024-07-23 Unisantis Electronics Singapore Pte. Ltd. Memory device using semiconductor element
WO2022239099A1 (ja) * 2021-05-11 2022-11-17 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド メモリ素子を有する半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150325444A1 (en) * 2013-05-16 2015-11-12 Unisantis Electronics Singapore Pte. Ltd. Method for producing an sgt-including semiconductor device
US20170330623A1 (en) * 2016-05-12 2017-11-16 Korea University Research And Business Foundation Dual gate semiconductor memory device with vertical semiconductor column

Also Published As

Publication number Publication date
US12016172B2 (en) 2024-06-18
WO2022215157A1 (ja) 2022-10-13
TW202247351A (zh) 2022-12-01
JP7381145B2 (ja) 2023-11-15
US20220320098A1 (en) 2022-10-06
JPWO2022215157A1 (https=) 2022-10-13

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