TWI804597B - 樹脂材料及多層印刷佈線板 - Google Patents

樹脂材料及多層印刷佈線板 Download PDF

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Publication number
TWI804597B
TWI804597B TW108110952A TW108110952A TWI804597B TW I804597 B TWI804597 B TW I804597B TW 108110952 A TW108110952 A TW 108110952A TW 108110952 A TW108110952 A TW 108110952A TW I804597 B TWI804597 B TW I804597B
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TW
Taiwan
Prior art keywords
compound
mentioned
resin material
dimer diamine
skeleton derived
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TW108110952A
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English (en)
Chinese (zh)
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TW201945469A (zh
Inventor
川原悠子
林達史
馬場奨
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日商積水化學工業股份有限公司
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Publication of TW201945469A publication Critical patent/TW201945469A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4238—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)
TW108110952A 2018-03-28 2019-03-28 樹脂材料及多層印刷佈線板 TWI804597B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018062912 2018-03-28
JP2018-062912 2018-03-28

Publications (2)

Publication Number Publication Date
TW201945469A TW201945469A (zh) 2019-12-01
TWI804597B true TWI804597B (zh) 2023-06-11

Family

ID=68062124

Family Applications (1)

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TW108110952A TWI804597B (zh) 2018-03-28 2019-03-28 樹脂材料及多層印刷佈線板

Country Status (5)

Country Link
JP (1) JP6660513B1 (ja)
KR (1) KR20200138227A (ja)
CN (1) CN111836843A (ja)
TW (1) TWI804597B (ja)
WO (1) WO2019189466A1 (ja)

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JP6978371B2 (ja) * 2018-04-03 2021-12-08 積水化学工業株式会社 硬化性樹脂組成物及び積層体
JP6984579B2 (ja) * 2018-11-29 2021-12-22 信越化学工業株式会社 エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置
JP2020094212A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN113614191A (zh) * 2019-03-22 2021-11-05 琳得科株式会社 树脂片
JP7434727B2 (ja) * 2019-05-31 2024-02-21 株式会社レゾナック 接着剤組成物、積層体及び接着シート
JP2021084968A (ja) * 2019-11-28 2021-06-03 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
JP7112439B2 (ja) * 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP7112438B2 (ja) * 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP7112440B2 (ja) * 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
KR102287525B1 (ko) * 2020-03-19 2021-08-09 (주)호전에이블 내열성 및 신축성이 우수한 연성 인쇄회로기판용 절연 수지 조성물
TWI748898B (zh) * 2021-03-15 2021-12-01 晉一化工股份有限公司 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途

Citations (3)

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TW201230912A (en) * 2010-08-11 2012-07-16 Ajinomoto Kk Process for the production of laminates
TW201718691A (zh) * 2015-08-24 2017-06-01 信越化學工業股份有限公司 熱硬化性樹脂組成物
TW201808622A (zh) * 2016-03-31 2018-03-16 住友電木股份有限公司 熱硬化性樹脂組成物、附載體樹脂膜、預浸體、覆金屬積層板、樹脂基板、印刷配線基板及半導體裝置

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WO2012105558A1 (ja) * 2011-02-01 2012-08-09 Dic株式会社 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
CN104093764B (zh) * 2012-01-31 2018-06-08 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用了其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
JP2014001289A (ja) * 2012-06-18 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd 半導体封止用樹脂組成物
SG11201509490PA (en) * 2013-06-03 2015-12-30 Mitsubishi Gas Chemical Co Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
WO2016114286A1 (ja) * 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
JP6756107B2 (ja) * 2015-01-13 2020-09-16 日立化成株式会社 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板
US20180051126A1 (en) * 2015-03-31 2018-02-22 Namics Corporation Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
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JP2016196557A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
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CN107849336B (zh) * 2015-09-30 2023-11-10 积水化学工业株式会社 树脂组合物及多层基板
US11873398B2 (en) * 2016-09-29 2024-01-16 Sekisui Chemical Co., Ltd. Interlayer insulating material and multilayer printed wiring board
JP6859897B2 (ja) * 2017-08-21 2021-04-14 味の素株式会社 樹脂組成物
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201230912A (en) * 2010-08-11 2012-07-16 Ajinomoto Kk Process for the production of laminates
TW201718691A (zh) * 2015-08-24 2017-06-01 信越化學工業股份有限公司 熱硬化性樹脂組成物
TW201808622A (zh) * 2016-03-31 2018-03-16 住友電木股份有限公司 熱硬化性樹脂組成物、附載體樹脂膜、預浸體、覆金屬積層板、樹脂基板、印刷配線基板及半導體裝置

Also Published As

Publication number Publication date
CN111836843A (zh) 2020-10-27
JPWO2019189466A1 (ja) 2020-04-30
JP6660513B1 (ja) 2020-03-11
KR20200138227A (ko) 2020-12-09
TW201945469A (zh) 2019-12-01
WO2019189466A1 (ja) 2019-10-03

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