TWI793123B - 剝離裝置 - Google Patents

剝離裝置 Download PDF

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Publication number
TWI793123B
TWI793123B TW107115379A TW107115379A TWI793123B TW I793123 B TWI793123 B TW I793123B TW 107115379 A TW107115379 A TW 107115379A TW 107115379 A TW107115379 A TW 107115379A TW I793123 B TWI793123 B TW I793123B
Authority
TW
Taiwan
Prior art keywords
wafer
peeling
holding
protective member
outer peripheral
Prior art date
Application number
TW107115379A
Other languages
English (en)
Chinese (zh)
Other versions
TW201906060A (zh
Inventor
清原恒成
廣內大資
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201906060A publication Critical patent/TW201906060A/zh
Application granted granted Critical
Publication of TWI793123B publication Critical patent/TWI793123B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107115379A 2017-06-22 2018-05-07 剝離裝置 TWI793123B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017121797A JP6924625B2 (ja) 2017-06-22 2017-06-22 剥離装置
JP2017-121797 2017-06-22

Publications (2)

Publication Number Publication Date
TW201906060A TW201906060A (zh) 2019-02-01
TWI793123B true TWI793123B (zh) 2023-02-21

Family

ID=64821857

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115379A TWI793123B (zh) 2017-06-22 2018-05-07 剝離裝置

Country Status (4)

Country Link
JP (1) JP6924625B2 (ko)
KR (1) KR102475683B1 (ko)
CN (1) CN109119371B (ko)
TW (1) TWI793123B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6769689B1 (ja) * 2019-06-28 2020-10-14 東芝三菱電機産業システム株式会社 剥離把持装置、剥離検査装置及び超音波振動接合システム
JP7488148B2 (ja) 2020-08-03 2024-05-21 株式会社ディスコ 剥離装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149655A (ja) * 2012-01-17 2013-08-01 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法および剥離プログラム
JP2014063882A (ja) * 2012-09-21 2014-04-10 Disco Abrasive Syst Ltd 樹脂剥がし方法及び樹脂剥がし装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5773660B2 (ja) * 2011-01-19 2015-09-02 株式会社ディスコ 樹脂剥がし装置および研削加工装置
JP2014067873A (ja) * 2012-09-26 2014-04-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
JP6730879B2 (ja) * 2016-08-18 2020-07-29 株式会社ディスコ 剥離方法及び剥離装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149655A (ja) * 2012-01-17 2013-08-01 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法および剥離プログラム
JP2014063882A (ja) * 2012-09-21 2014-04-10 Disco Abrasive Syst Ltd 樹脂剥がし方法及び樹脂剥がし装置

Also Published As

Publication number Publication date
CN109119371A (zh) 2019-01-01
KR20190000296A (ko) 2019-01-02
JP2019009200A (ja) 2019-01-17
KR102475683B1 (ko) 2022-12-07
JP6924625B2 (ja) 2021-08-25
CN109119371B (zh) 2024-02-02
TW201906060A (zh) 2019-02-01

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