JP6924625B2 - 剥離装置 - Google Patents

剥離装置 Download PDF

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Publication number
JP6924625B2
JP6924625B2 JP2017121797A JP2017121797A JP6924625B2 JP 6924625 B2 JP6924625 B2 JP 6924625B2 JP 2017121797 A JP2017121797 A JP 2017121797A JP 2017121797 A JP2017121797 A JP 2017121797A JP 6924625 B2 JP6924625 B2 JP 6924625B2
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JP
Japan
Prior art keywords
wafer
peeling
outer peripheral
protective member
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017121797A
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English (en)
Japanese (ja)
Other versions
JP2019009200A (ja
Inventor
恒成 清原
恒成 清原
大資 廣内
大資 廣内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017121797A priority Critical patent/JP6924625B2/ja
Priority to TW107115379A priority patent/TWI793123B/zh
Priority to CN201810587323.3A priority patent/CN109119371B/zh
Priority to KR1020180068042A priority patent/KR102475683B1/ko
Publication of JP2019009200A publication Critical patent/JP2019009200A/ja
Application granted granted Critical
Publication of JP6924625B2 publication Critical patent/JP6924625B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017121797A 2017-06-22 2017-06-22 剥離装置 Active JP6924625B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017121797A JP6924625B2 (ja) 2017-06-22 2017-06-22 剥離装置
TW107115379A TWI793123B (zh) 2017-06-22 2018-05-07 剝離裝置
CN201810587323.3A CN109119371B (zh) 2017-06-22 2018-06-08 剥离装置
KR1020180068042A KR102475683B1 (ko) 2017-06-22 2018-06-14 박리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017121797A JP6924625B2 (ja) 2017-06-22 2017-06-22 剥離装置

Publications (2)

Publication Number Publication Date
JP2019009200A JP2019009200A (ja) 2019-01-17
JP6924625B2 true JP6924625B2 (ja) 2021-08-25

Family

ID=64821857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017121797A Active JP6924625B2 (ja) 2017-06-22 2017-06-22 剥離装置

Country Status (4)

Country Link
JP (1) JP6924625B2 (ko)
KR (1) KR102475683B1 (ko)
CN (1) CN109119371B (ko)
TW (1) TWI793123B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112449681B (zh) * 2019-06-28 2023-04-04 东芝三菱电机产业系统株式会社 剥离把持装置、剥离检查装置以及超声波振动接合系统
JP7488148B2 (ja) 2020-08-03 2024-05-21 株式会社ディスコ 剥離装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5773660B2 (ja) * 2011-01-19 2015-09-02 株式会社ディスコ 樹脂剥がし装置および研削加工装置
JP5722807B2 (ja) * 2012-01-17 2015-05-27 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法および剥離プログラム
JP6099343B2 (ja) * 2012-09-21 2017-03-22 株式会社ディスコ 樹脂剥がし方法及び樹脂剥がし装置
JP2014067873A (ja) * 2012-09-26 2014-04-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
JP6730879B2 (ja) * 2016-08-18 2020-07-29 株式会社ディスコ 剥離方法及び剥離装置

Also Published As

Publication number Publication date
JP2019009200A (ja) 2019-01-17
CN109119371A (zh) 2019-01-01
TWI793123B (zh) 2023-02-21
KR20190000296A (ko) 2019-01-02
KR102475683B1 (ko) 2022-12-07
TW201906060A (zh) 2019-02-01
CN109119371B (zh) 2024-02-02

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