TWI790981B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

Info

Publication number
TWI790981B
TWI790981B TW111126817A TW111126817A TWI790981B TW I790981 B TWI790981 B TW I790981B TW 111126817 A TW111126817 A TW 111126817A TW 111126817 A TW111126817 A TW 111126817A TW I790981 B TWI790981 B TW I790981B
Authority
TW
Taiwan
Prior art keywords
wafer
module
inspection
loading
transfer
Prior art date
Application number
TW111126817A
Other languages
English (en)
Chinese (zh)
Other versions
TW202242553A (zh
Inventor
中野征二
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202242553A publication Critical patent/TW202242553A/zh
Application granted granted Critical
Publication of TWI790981B publication Critical patent/TWI790981B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automation & Control Theory (AREA)
  • Paper (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW111126817A 2017-06-16 2018-06-01 基板處理裝置 TWI790981B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-118807 2017-06-16
JP2017118807A JP6863114B2 (ja) 2017-06-16 2017-06-16 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW202242553A TW202242553A (zh) 2022-11-01
TWI790981B true TWI790981B (zh) 2023-01-21

Family

ID=64658413

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107118879A TWI773764B (zh) 2017-06-16 2018-06-01 基板處理裝置、基板處理方法及記憶媒體
TW111126817A TWI790981B (zh) 2017-06-16 2018-06-01 基板處理裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW107118879A TWI773764B (zh) 2017-06-16 2018-06-01 基板處理裝置、基板處理方法及記憶媒體

Country Status (5)

Country Link
US (3) US10615065B2 (enExample)
JP (2) JP6863114B2 (enExample)
KR (2) KR102451387B1 (enExample)
CN (3) CN109148329B (enExample)
TW (2) TWI773764B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7437599B2 (ja) 2020-05-12 2024-02-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7419966B2 (ja) * 2020-05-25 2024-01-23 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102794091B1 (ko) * 2020-05-29 2025-04-15 주성엔지니어링(주) 기판 처리 시스템 및 기판 처리 시스템의 검사 방법
JP7482702B2 (ja) * 2020-06-30 2024-05-14 東京エレクトロン株式会社 基板処理装置
JP7596670B2 (ja) * 2020-08-24 2024-12-10 東京エレクトロン株式会社 基板を処理する装置、及び基板を処理する方法
JP7524736B2 (ja) * 2020-11-25 2024-07-30 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
TWI764851B (zh) * 2021-02-05 2022-05-11 矽碁科技股份有限公司 微型化半導體製程系統
WO2024084715A1 (ja) * 2022-10-21 2024-04-25 株式会社東光高岳 ワーク検査装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335709A (ja) * 1994-06-14 1995-12-22 Hitachi Ltd 真空処理装置
JP2005101029A (ja) * 2003-09-22 2005-04-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のための機能ブロック組合せシステム
JP2005203440A (ja) * 2004-01-13 2005-07-28 Tokyo Electron Ltd 位置調整方法及び基板処理システム
JP2006269672A (ja) * 2005-03-23 2006-10-05 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像方法
JP2012019130A (ja) * 2010-07-09 2012-01-26 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2013098476A (ja) * 2011-11-04 2013-05-20 Tokyo Electron Ltd 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体
TW201620065A (zh) * 2014-09-05 2016-06-01 Rorze Corp 裝載埠及裝載埠的氣氛置換方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801849B2 (ja) * 2000-08-07 2006-07-26 東京エレクトロン株式会社 基板処理装置及びその方法
JP3878441B2 (ja) * 2001-07-18 2007-02-07 大日本スクリーン製造株式会社 基板処理装置
JP3761081B2 (ja) 2001-11-09 2006-03-29 東京エレクトロン株式会社 基板処理装置
JP4408606B2 (ja) * 2002-06-11 2010-02-03 大日本スクリーン製造株式会社 基板処理装置
JP4252935B2 (ja) * 2004-06-22 2009-04-08 東京エレクトロン株式会社 基板処理装置
US8078311B2 (en) * 2004-12-06 2011-12-13 Tokyo Electron Limited Substrate processing apparatus and substrate transfer method adopted in substrate processing apparatus
WO2007108315A1 (ja) * 2006-03-22 2007-09-27 Ebara Corporation 基板処理装置及び基板処理方法
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
CN101071764B (zh) * 2006-05-11 2010-08-18 东京毅力科创株式会社 处理装置
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP2008147583A (ja) * 2006-12-13 2008-06-26 Hitachi High-Tech Control Systems Corp 基板の搬送方法および基板搬送システム
JP2009231627A (ja) * 2008-03-24 2009-10-08 Sokudo Co Ltd 基板処理装置
JP2011003819A (ja) * 2009-06-22 2011-01-06 Tokyo Electron Ltd 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP4913201B2 (ja) * 2009-11-06 2012-04-11 東京エレクトロン株式会社 基板搬送方法
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP5482500B2 (ja) * 2010-06-21 2014-05-07 東京エレクトロン株式会社 基板処理装置
JP5408059B2 (ja) * 2010-07-09 2014-02-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP2012080077A (ja) * 2010-09-06 2012-04-19 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP5978728B2 (ja) * 2012-04-12 2016-08-24 東京エレクトロン株式会社 基板受け渡し装置、基板受け渡し方法及び記憶媒体
JP6040883B2 (ja) * 2012-12-25 2016-12-07 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP6121832B2 (ja) * 2013-07-29 2017-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、および基板処理システム
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335709A (ja) * 1994-06-14 1995-12-22 Hitachi Ltd 真空処理装置
JP2005101029A (ja) * 2003-09-22 2005-04-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のための機能ブロック組合せシステム
JP2005203440A (ja) * 2004-01-13 2005-07-28 Tokyo Electron Ltd 位置調整方法及び基板処理システム
JP2006269672A (ja) * 2005-03-23 2006-10-05 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像方法
JP2012019130A (ja) * 2010-07-09 2012-01-26 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2013098476A (ja) * 2011-11-04 2013-05-20 Tokyo Electron Ltd 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体
TW201620065A (zh) * 2014-09-05 2016-06-01 Rorze Corp 裝載埠及裝載埠的氣氛置換方法

Also Published As

Publication number Publication date
JP2021106279A (ja) 2021-07-26
US20200203202A1 (en) 2020-06-25
US10615065B2 (en) 2020-04-07
KR102552935B1 (ko) 2023-07-07
US20180366356A1 (en) 2018-12-20
JP7070748B2 (ja) 2022-05-18
US20210118711A1 (en) 2021-04-22
US10916463B2 (en) 2021-02-09
KR20220137858A (ko) 2022-10-12
KR102451387B1 (ko) 2022-10-06
CN120809610A (zh) 2025-10-17
CN109148329A (zh) 2019-01-04
CN109148329B (zh) 2025-07-15
JP2019004072A (ja) 2019-01-10
TW201921122A (zh) 2019-06-01
KR20180137409A (ko) 2018-12-27
TWI773764B (zh) 2022-08-11
CN208589418U (zh) 2019-03-08
US11545377B2 (en) 2023-01-03
JP6863114B2 (ja) 2021-04-21
TW202242553A (zh) 2022-11-01

Similar Documents

Publication Publication Date Title
TWI790981B (zh) 基板處理裝置
JP5212165B2 (ja) 基板処理装置
JP5880247B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP5978728B2 (ja) 基板受け渡し装置、基板受け渡し方法及び記憶媒体
KR101022959B1 (ko) 기판처리장치
JP5610009B2 (ja) 基板処理装置
KR101776964B1 (ko) 도포, 현상 장치
KR102877659B1 (ko) 기판 처리 장치 및 기판 처리 방법
CN114551281A (zh) 基片处理装置、基片处理方法和存储介质
TW202236486A (zh) 基板處理裝置及基板處理方法
JP2005101029A (ja) 基板処理装置および基板処理装置のための機能ブロック組合せシステム
CN113721424B (zh) 基板处理装置和基板处理方法
JP7251673B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
CN214042007U (zh) 涂布显影装置
US12391472B2 (en) Substrate processing apparatus and substrate processing method