TWI782819B - 靜電吸盤及處理裝置 - Google Patents

靜電吸盤及處理裝置 Download PDF

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Publication number
TWI782819B
TWI782819B TW110147038A TW110147038A TWI782819B TW I782819 B TWI782819 B TW I782819B TW 110147038 A TW110147038 A TW 110147038A TW 110147038 A TW110147038 A TW 110147038A TW I782819 B TWI782819 B TW I782819B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
ceramic sprayed
dielectric layer
plasma
electrostatic
Prior art date
Application number
TW110147038A
Other languages
English (en)
Chinese (zh)
Other versions
TW202225426A (zh
Inventor
高畠剛
中筋智博
伊藤亮
瀬戸健太郎
大本豊
北田裕穂
田中一海
Original Assignee
日商東華隆股份有限公司
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東華隆股份有限公司, 日商日立全球先端科技股份有限公司 filed Critical 日商東華隆股份有限公司
Publication of TW202225426A publication Critical patent/TW202225426A/zh
Application granted granted Critical
Publication of TWI782819B publication Critical patent/TWI782819B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
TW110147038A 2020-12-24 2021-12-15 靜電吸盤及處理裝置 TWI782819B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2020/048578 2020-12-24
PCT/JP2020/048578 WO2022137467A1 (ja) 2020-12-24 2020-12-24 静電チャック及び処理装置

Publications (2)

Publication Number Publication Date
TW202225426A TW202225426A (zh) 2022-07-01
TWI782819B true TWI782819B (zh) 2022-11-01

Family

ID=82157640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147038A TWI782819B (zh) 2020-12-24 2021-12-15 靜電吸盤及處理裝置

Country Status (6)

Country Link
US (1) US11955360B2 (https=)
JP (1) JP7234459B2 (https=)
KR (1) KR102626584B1 (https=)
CN (1) CN114981949B (https=)
TW (1) TWI782819B (https=)
WO (1) WO2022137467A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024047205A (ja) * 2022-09-26 2024-04-05 株式会社ディスコ 保持テーブル
JP2025181356A (ja) * 2024-05-31 2025-12-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055909A (ja) * 2002-07-22 2004-02-19 Tokyo Electron Ltd 静電チャックおよび処理装置
TW201100578A (en) * 2009-06-19 2011-01-01 Saint Gobain Ceramics & Plastics Inc Sealed plasma coatings
TW201120988A (en) * 2009-08-21 2011-06-16 Komico Ltd Electrostatic chuck and method of manufacturing the same
TW201903206A (zh) * 2017-05-10 2019-01-16 美商應用材料股份有限公司 用於腔室組件之多層電漿腐蝕保護
CN110499486A (zh) * 2018-05-18 2019-11-26 信越化学工业株式会社 喷涂材料、喷涂部件和制造方法
TW201945321A (zh) * 2018-03-07 2019-12-01 美商應用材料股份有限公司 用於電漿環境中的腔室部件的氧化釔-二氧化鋯耐蝕材料

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06737A (ja) 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
US5792562A (en) 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
JP2971369B2 (ja) * 1995-08-31 1999-11-02 トーカロ株式会社 静電チャック部材およびその製造方法
JP2000252351A (ja) * 1999-02-26 2000-09-14 Taiheiyo Cement Corp 静電チャックおよびその製造方法
JP4523134B2 (ja) * 2000-09-06 2010-08-11 太平洋セメント株式会社 真空処理装置用部材および静電チャック
JP2003045952A (ja) * 2001-05-25 2003-02-14 Tokyo Electron Ltd 載置装置及びその製造方法並びにプラズマ処理装置
JP4503270B2 (ja) 2002-11-28 2010-07-14 東京エレクトロン株式会社 プラズマ処理容器内部材
KR100772740B1 (ko) * 2002-11-28 2007-11-01 동경 엘렉트론 주식회사 플라즈마 처리 용기 내부재
JP4486372B2 (ja) 2003-02-07 2010-06-23 東京エレクトロン株式会社 プラズマ処理装置
JP2005150370A (ja) * 2003-11-14 2005-06-09 Kyocera Corp 静電チャック
US10389278B2 (en) * 2013-03-29 2019-08-20 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device with multiple fine protrusions or multiple fine recesses
US20180337026A1 (en) * 2017-05-19 2018-11-22 Applied Materials, Inc. Erosion resistant atomic layer deposition coatings

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055909A (ja) * 2002-07-22 2004-02-19 Tokyo Electron Ltd 静電チャックおよび処理装置
TW201100578A (en) * 2009-06-19 2011-01-01 Saint Gobain Ceramics & Plastics Inc Sealed plasma coatings
TW201120988A (en) * 2009-08-21 2011-06-16 Komico Ltd Electrostatic chuck and method of manufacturing the same
TW201903206A (zh) * 2017-05-10 2019-01-16 美商應用材料股份有限公司 用於腔室組件之多層電漿腐蝕保護
TW201945321A (zh) * 2018-03-07 2019-12-01 美商應用材料股份有限公司 用於電漿環境中的腔室部件的氧化釔-二氧化鋯耐蝕材料
CN110499486A (zh) * 2018-05-18 2019-11-26 信越化学工业株式会社 喷涂材料、喷涂部件和制造方法

Also Published As

Publication number Publication date
CN114981949B (zh) 2025-10-03
US11955360B2 (en) 2024-04-09
US20230154780A1 (en) 2023-05-18
KR102626584B1 (ko) 2024-01-18
WO2022137467A1 (ja) 2022-06-30
JP7234459B2 (ja) 2023-03-07
CN114981949A (zh) 2022-08-30
TW202225426A (zh) 2022-07-01
KR20220093089A (ko) 2022-07-05
JPWO2022137467A1 (https=) 2022-06-30

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