JPWO2022137467A1 - - Google Patents
Info
- Publication number
- JPWO2022137467A1 JPWO2022137467A1 JP2022513924A JP2022513924A JPWO2022137467A1 JP WO2022137467 A1 JPWO2022137467 A1 JP WO2022137467A1 JP 2022513924 A JP2022513924 A JP 2022513924A JP 2022513924 A JP2022513924 A JP 2022513924A JP WO2022137467 A1 JPWO2022137467 A1 JP WO2022137467A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/048578 WO2022137467A1 (ja) | 2020-12-24 | 2020-12-24 | 静電チャック及び処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022137467A1 true JPWO2022137467A1 (https=) | 2022-06-30 |
| JPWO2022137467A5 JPWO2022137467A5 (https=) | 2022-12-05 |
| JP7234459B2 JP7234459B2 (ja) | 2023-03-07 |
Family
ID=82157640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022513924A Active JP7234459B2 (ja) | 2020-12-24 | 2020-12-24 | 静電チャック及び処理装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11955360B2 (https=) |
| JP (1) | JP7234459B2 (https=) |
| KR (1) | KR102626584B1 (https=) |
| CN (1) | CN114981949B (https=) |
| TW (1) | TWI782819B (https=) |
| WO (1) | WO2022137467A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024047205A (ja) * | 2022-09-26 | 2024-04-05 | 株式会社ディスコ | 保持テーブル |
| JP2025181356A (ja) * | 2024-05-31 | 2025-12-11 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06737A (ja) * | 1991-03-29 | 1994-01-11 | Shin Etsu Chem Co Ltd | 静電チャック基板 |
| JPH08274151A (ja) * | 1995-01-12 | 1996-10-18 | Applied Materials Inc | ポリマー含浸静電チャックおよび製造方法 |
| JPH0969554A (ja) * | 1995-08-31 | 1997-03-11 | Tocalo Co Ltd | 静電チャック部材およびその製造方法 |
| JP2002083861A (ja) * | 2000-09-06 | 2002-03-22 | Taiheiyo Cement Corp | 真空処理装置用部材および静電チャック |
| JP2004055909A (ja) * | 2002-07-22 | 2004-02-19 | Tokyo Electron Ltd | 静電チャックおよび処理装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252351A (ja) * | 1999-02-26 | 2000-09-14 | Taiheiyo Cement Corp | 静電チャックおよびその製造方法 |
| JP2003045952A (ja) * | 2001-05-25 | 2003-02-14 | Tokyo Electron Ltd | 載置装置及びその製造方法並びにプラズマ処理装置 |
| JP4503270B2 (ja) | 2002-11-28 | 2010-07-14 | 東京エレクトロン株式会社 | プラズマ処理容器内部材 |
| KR100772740B1 (ko) * | 2002-11-28 | 2007-11-01 | 동경 엘렉트론 주식회사 | 플라즈마 처리 용기 내부재 |
| JP4486372B2 (ja) | 2003-02-07 | 2010-06-23 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2005150370A (ja) * | 2003-11-14 | 2005-06-09 | Kyocera Corp | 静電チャック |
| TW201100578A (en) * | 2009-06-19 | 2011-01-01 | Saint Gobain Ceramics & Plastics Inc | Sealed plasma coatings |
| KR100997374B1 (ko) * | 2009-08-21 | 2010-11-30 | 주식회사 코미코 | 정전척 및 이의 제조 방법 |
| US10389278B2 (en) * | 2013-03-29 | 2019-08-20 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device with multiple fine protrusions or multiple fine recesses |
| US10755900B2 (en) * | 2017-05-10 | 2020-08-25 | Applied Materials, Inc. | Multi-layer plasma erosion protection for chamber components |
| US20180337026A1 (en) * | 2017-05-19 | 2018-11-22 | Applied Materials, Inc. | Erosion resistant atomic layer deposition coatings |
| US11014853B2 (en) * | 2018-03-07 | 2021-05-25 | Applied Materials, Inc. | Y2O3—ZrO2 erosion resistant material for chamber components in plasma environments |
| JP7147675B2 (ja) * | 2018-05-18 | 2022-10-05 | 信越化学工業株式会社 | 溶射材料、及び溶射部材の製造方法 |
-
2020
- 2020-12-24 WO PCT/JP2020/048578 patent/WO2022137467A1/ja not_active Ceased
- 2020-12-24 KR KR1020227008008A patent/KR102626584B1/ko active Active
- 2020-12-24 US US17/642,083 patent/US11955360B2/en active Active
- 2020-12-24 CN CN202080063677.3A patent/CN114981949B/zh active Active
- 2020-12-24 JP JP2022513924A patent/JP7234459B2/ja active Active
-
2021
- 2021-12-15 TW TW110147038A patent/TWI782819B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06737A (ja) * | 1991-03-29 | 1994-01-11 | Shin Etsu Chem Co Ltd | 静電チャック基板 |
| JPH08274151A (ja) * | 1995-01-12 | 1996-10-18 | Applied Materials Inc | ポリマー含浸静電チャックおよび製造方法 |
| JPH0969554A (ja) * | 1995-08-31 | 1997-03-11 | Tocalo Co Ltd | 静電チャック部材およびその製造方法 |
| JP2002083861A (ja) * | 2000-09-06 | 2002-03-22 | Taiheiyo Cement Corp | 真空処理装置用部材および静電チャック |
| JP2004055909A (ja) * | 2002-07-22 | 2004-02-19 | Tokyo Electron Ltd | 静電チャックおよび処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114981949B (zh) | 2025-10-03 |
| US11955360B2 (en) | 2024-04-09 |
| US20230154780A1 (en) | 2023-05-18 |
| KR102626584B1 (ko) | 2024-01-18 |
| WO2022137467A1 (ja) | 2022-06-30 |
| JP7234459B2 (ja) | 2023-03-07 |
| CN114981949A (zh) | 2022-08-30 |
| TW202225426A (zh) | 2022-07-01 |
| KR20220093089A (ko) | 2022-07-05 |
| TWI782819B (zh) | 2022-11-01 |
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