TWI780648B - 感光性元件、及抗蝕圖案之形成方法 - Google Patents
感光性元件、及抗蝕圖案之形成方法 Download PDFInfo
- Publication number
- TWI780648B TWI780648B TW110112219A TW110112219A TWI780648B TW I780648 B TWI780648 B TW I780648B TW 110112219 A TW110112219 A TW 110112219A TW 110112219 A TW110112219 A TW 110112219A TW I780648 B TWI780648 B TW I780648B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive element
- resin composition
- composition layer
- photosensitive resin
- film
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-067927 | 2020-04-03 | ||
JP2020067927 | 2020-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202142962A TW202142962A (zh) | 2021-11-16 |
TWI780648B true TWI780648B (zh) | 2022-10-11 |
Family
ID=77930396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110112219A TWI780648B (zh) | 2020-04-03 | 2021-04-01 | 感光性元件、及抗蝕圖案之形成方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7377343B2 (ja) |
KR (1) | KR102660157B1 (ja) |
CN (1) | CN115398337A (ja) |
TW (1) | TWI780648B (ja) |
WO (1) | WO2021201288A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101166393A (zh) * | 2006-10-20 | 2008-04-23 | 富士胶片株式会社 | 生产印刷电路板用叠层体和使用其生产印刷电路板的方法 |
WO2014021590A1 (ko) * | 2012-08-01 | 2014-02-06 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 |
TW201522044A (zh) * | 2013-09-24 | 2015-06-16 | Lg Chemical Ltd | 防焊乾膜之製備方法及使用其之膜積層體 |
US20150331188A1 (en) * | 2013-09-27 | 2015-11-19 | Panasonic Intellectual Property Management Co., Ltd. | Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film |
WO2019142790A1 (ja) * | 2018-01-18 | 2019-07-25 | Agc株式会社 | 長尺積層体、その製造方法及びプリント配線板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4000544B2 (ja) * | 1998-09-30 | 2007-10-31 | 東レフィルム加工株式会社 | 感光性版用フォトレジストカバーフイルム |
JP2002229200A (ja) * | 2001-02-02 | 2002-08-14 | Hitachi Chem Co Ltd | 感光性フィルム |
JP2004191648A (ja) | 2002-12-11 | 2004-07-08 | Hitachi Chem Co Ltd | 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP2006201546A (ja) * | 2005-01-21 | 2006-08-03 | Showa Denko Kk | フォトレジストフィルム |
KR101444044B1 (ko) * | 2010-12-16 | 2014-09-23 | 히타치가세이가부시끼가이샤 | 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
JP6432283B2 (ja) * | 2014-10-31 | 2018-12-05 | 東レ株式会社 | ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム |
JP2017122818A (ja) * | 2016-01-06 | 2017-07-13 | 旭化成株式会社 | 感光性樹脂積層体 |
JP2018077426A (ja) * | 2016-11-11 | 2018-05-17 | ニッコー・マテリアルズ株式会社 | フォトレジストフィルム、レジストパターンの形成方法、および導体パターンの形成方法 |
MY192472A (en) * | 2016-12-07 | 2022-08-22 | Asahi Chemical Ind | Photosensitive resin composition and photosensitive resin laminate |
JP7124409B2 (ja) | 2018-04-18 | 2022-08-24 | 三菱ケミカル株式会社 | ドライフィルムレジスト用ポリエステルフィルム |
KR102605003B1 (ko) * | 2018-06-22 | 2023-11-22 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
JP7422664B2 (ja) * | 2018-08-09 | 2024-01-26 | 旭化成株式会社 | 感光性樹脂組成物及びレジストパターンの形成方法 |
-
2021
- 2021-04-01 TW TW110112219A patent/TWI780648B/zh active
- 2021-04-02 JP JP2022511165A patent/JP7377343B2/ja active Active
- 2021-04-02 WO PCT/JP2021/014369 patent/WO2021201288A1/ja active Application Filing
- 2021-04-02 CN CN202180025576.1A patent/CN115398337A/zh active Pending
- 2021-04-02 KR KR1020227019356A patent/KR102660157B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101166393A (zh) * | 2006-10-20 | 2008-04-23 | 富士胶片株式会社 | 生产印刷电路板用叠层体和使用其生产印刷电路板的方法 |
WO2014021590A1 (ko) * | 2012-08-01 | 2014-02-06 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 |
TW201522044A (zh) * | 2013-09-24 | 2015-06-16 | Lg Chemical Ltd | 防焊乾膜之製備方法及使用其之膜積層體 |
CN105190442A (zh) * | 2013-09-24 | 2015-12-23 | 株式会社Lg化学 | 阻焊干膜的制备方法以及其中使用的层压膜 |
US20150331188A1 (en) * | 2013-09-27 | 2015-11-19 | Panasonic Intellectual Property Management Co., Ltd. | Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film |
WO2019142790A1 (ja) * | 2018-01-18 | 2019-07-25 | Agc株式会社 | 長尺積層体、その製造方法及びプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
TW202142962A (zh) | 2021-11-16 |
KR20220099114A (ko) | 2022-07-12 |
JPWO2021201288A1 (ja) | 2021-10-07 |
KR102660157B1 (ko) | 2024-04-23 |
JP7377343B2 (ja) | 2023-11-09 |
CN115398337A (zh) | 2022-11-25 |
WO2021201288A1 (ja) | 2021-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4781434B2 (ja) | 感光性樹脂組成物及び積層体 | |
JP5252963B2 (ja) | 感光性樹脂組成物及び積層体 | |
JP4847582B2 (ja) | 感光性樹脂組成物および積層体 | |
KR20170120190A (ko) | 감광성 수지 조성물 | |
JP4749270B2 (ja) | 感光性樹脂組成物及び積層体 | |
JP2010117545A (ja) | 感光性樹脂組成物及びその用途 | |
JP5221543B2 (ja) | 感光性樹脂組成物及びその積層体 | |
JP4885243B2 (ja) | 感光性樹脂組成物及び積層体 | |
JP5646873B2 (ja) | 感光性樹脂組成物及びその積層体 | |
KR20120031086A (ko) | 감광성 수지 조성물, 감광성 수지 적층체 및 레지스트 패턴 형성 방법 | |
JP2007226158A (ja) | ドライフィルムレジスト | |
JP2012220686A (ja) | 感光性樹脂組成物及びその積層体 | |
TWI780648B (zh) | 感光性元件、及抗蝕圖案之形成方法 | |
JP2010181813A (ja) | 感光性樹脂積層体 | |
JP4979341B2 (ja) | 感光性樹脂組成物及びガラスパターンの形成方法 | |
KR101934164B1 (ko) | 감광성 수지 적층체 | |
WO2003077035A1 (fr) | Composition de resine photosensible et utilisation de celle-ci | |
TWI793995B (zh) | 感光性元件、及光阻圖案之形成方法 | |
JP4477077B2 (ja) | 感光性樹脂層への露光方法 | |
TW201728998A (zh) | 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及觸控面板的製造方法 | |
JP2004158648A (ja) | 配線板の製造方法 | |
JP2006225498A (ja) | 光重合開始剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |