TWI780648B - 感光性元件、及抗蝕圖案之形成方法 - Google Patents

感光性元件、及抗蝕圖案之形成方法 Download PDF

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Publication number
TWI780648B
TWI780648B TW110112219A TW110112219A TWI780648B TW I780648 B TWI780648 B TW I780648B TW 110112219 A TW110112219 A TW 110112219A TW 110112219 A TW110112219 A TW 110112219A TW I780648 B TWI780648 B TW I780648B
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TW
Taiwan
Prior art keywords
photosensitive element
resin composition
composition layer
photosensitive resin
film
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TW110112219A
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English (en)
Chinese (zh)
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TW202142962A (zh
Inventor
加持義貴
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日商旭化成股份有限公司
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Publication of TW202142962A publication Critical patent/TW202142962A/zh
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Publication of TWI780648B publication Critical patent/TWI780648B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW110112219A 2020-04-03 2021-04-01 感光性元件、及抗蝕圖案之形成方法 TWI780648B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-067927 2020-04-03
JP2020067927 2020-04-03

Publications (2)

Publication Number Publication Date
TW202142962A TW202142962A (zh) 2021-11-16
TWI780648B true TWI780648B (zh) 2022-10-11

Family

ID=77930396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110112219A TWI780648B (zh) 2020-04-03 2021-04-01 感光性元件、及抗蝕圖案之形成方法

Country Status (5)

Country Link
JP (1) JP7377343B2 (ja)
KR (1) KR102660157B1 (ja)
CN (1) CN115398337A (ja)
TW (1) TWI780648B (ja)
WO (1) WO2021201288A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101166393A (zh) * 2006-10-20 2008-04-23 富士胶片株式会社 生产印刷电路板用叠层体和使用其生产印刷电路板的方法
WO2014021590A1 (ko) * 2012-08-01 2014-02-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
TW201522044A (zh) * 2013-09-24 2015-06-16 Lg Chemical Ltd 防焊乾膜之製備方法及使用其之膜積層體
US20150331188A1 (en) * 2013-09-27 2015-11-19 Panasonic Intellectual Property Management Co., Ltd. Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film
WO2019142790A1 (ja) * 2018-01-18 2019-07-25 Ａｇｃ株式会社 長尺積層体、その製造方法及びプリント配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4000544B2 (ja) * 1998-09-30 2007-10-31 東レフィルム加工株式会社 感光性版用フォトレジストカバーフイルム
JP2002229200A (ja) * 2001-02-02 2002-08-14 Hitachi Chem Co Ltd 感光性フィルム
JP2004191648A (ja) 2002-12-11 2004-07-08 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP2006201546A (ja) * 2005-01-21 2006-08-03 Showa Denko Kk フォトレジストフィルム
KR101444044B1 (ko) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JP6432283B2 (ja) * 2014-10-31 2018-12-05 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
JP2017122818A (ja) * 2016-01-06 2017-07-13 旭化成株式会社 感光性樹脂積層体
JP2018077426A (ja) * 2016-11-11 2018-05-17 ニッコー・マテリアルズ株式会社 フォトレジストフィルム、レジストパターンの形成方法、および導体パターンの形成方法
MY192472A (en) * 2016-12-07 2022-08-22 Asahi Chemical Ind Photosensitive resin composition and photosensitive resin laminate
JP7124409B2 (ja) 2018-04-18 2022-08-24 三菱ケミカル株式会社 ドライフィルムレジスト用ポリエステルフィルム
KR102605003B1 (ko) * 2018-06-22 2023-11-22 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법
JP7422664B2 (ja) * 2018-08-09 2024-01-26 旭化成株式会社 感光性樹脂組成物及びレジストパターンの形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101166393A (zh) * 2006-10-20 2008-04-23 富士胶片株式会社 生产印刷电路板用叠层体和使用其生产印刷电路板的方法
WO2014021590A1 (ko) * 2012-08-01 2014-02-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
TW201522044A (zh) * 2013-09-24 2015-06-16 Lg Chemical Ltd 防焊乾膜之製備方法及使用其之膜積層體
CN105190442A (zh) * 2013-09-24 2015-12-23 株式会社Lg化学 阻焊干膜的制备方法以及其中使用的层压膜
US20150331188A1 (en) * 2013-09-27 2015-11-19 Panasonic Intellectual Property Management Co., Ltd. Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film
WO2019142790A1 (ja) * 2018-01-18 2019-07-25 Ａｇｃ株式会社 長尺積層体、その製造方法及びプリント配線板

Also Published As

Publication number Publication date
TW202142962A (zh) 2021-11-16
KR20220099114A (ko) 2022-07-12
JPWO2021201288A1 (ja) 2021-10-07
KR102660157B1 (ko) 2024-04-23
JP7377343B2 (ja) 2023-11-09
CN115398337A (zh) 2022-11-25
WO2021201288A1 (ja) 2021-10-07

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