KR102660157B1 - 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법 - Google Patents
감광성 엘리먼트, 및 레지스트 패턴의 형성 방법 Download PDFInfo
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- KR102660157B1 KR102660157B1 KR1020227019356A KR20227019356A KR102660157B1 KR 102660157 B1 KR102660157 B1 KR 102660157B1 KR 1020227019356 A KR1020227019356 A KR 1020227019356A KR 20227019356 A KR20227019356 A KR 20227019356A KR 102660157 B1 KR102660157 B1 KR 102660157B1
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- photosensitive element
- resin composition
- composition layer
- photosensitive resin
- photosensitive
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- ZLZAOJXNPKEAQD-UHFFFAOYSA-N tripropyl 2-hydroxy-4-oxopentane-1,2,3-tricarboxylate Chemical compound CCCOC(=O)CC(O)(C(=O)OCCC)C(C(C)=O)C(=O)OCCC ZLZAOJXNPKEAQD-UHFFFAOYSA-N 0.000 description 1
- JEVGKYBUANQAKG-UHFFFAOYSA-N victoria blue R Chemical compound [Cl-].C12=CC=CC=C2C(=[NH+]CC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JEVGKYBUANQAKG-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020067927 | 2020-04-03 | ||
| JPJP-P-2020-067927 | 2020-04-03 | ||
| PCT/JP2021/014369 WO2021201288A1 (ja) | 2020-04-03 | 2021-04-02 | 感光性エレメント、およびレジストパターンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
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| KR20220099114A KR20220099114A (ko) | 2022-07-12 |
| KR102660157B1 true KR102660157B1 (ko) | 2024-04-23 |
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| KR (1) | KR102660157B1 (ja) |
| CN (1) | CN115398337A (ja) |
| TW (1) | TWI780648B (ja) |
| WO (1) | WO2021201288A1 (ja) |
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| JP4000544B2 (ja) * | 1998-09-30 | 2007-10-31 | 東レフィルム加工株式会社 | 感光性版用フォトレジストカバーフイルム |
| JP2002229200A (ja) * | 2001-02-02 | 2002-08-14 | Hitachi Chem Co Ltd | 感光性フィルム |
| JP2004191648A (ja) | 2002-12-11 | 2004-07-08 | Hitachi Chem Co Ltd | 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
| JP2006201546A (ja) * | 2005-01-21 | 2006-08-03 | Showa Denko Kk | フォトレジストフィルム |
| JP2008103622A (ja) * | 2006-10-20 | 2008-05-01 | Fujifilm Corp | プリント配線板作製用積層体及びそれを用いたプリント配線板の作製方法 |
| JP5573961B2 (ja) * | 2010-12-16 | 2014-08-20 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| WO2014021590A1 (ko) * | 2012-08-01 | 2014-02-06 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 |
| KR101734425B1 (ko) * | 2013-09-24 | 2017-05-11 | 주식회사 엘지화학 | 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체 |
| US9535216B2 (en) * | 2013-09-27 | 2017-01-03 | Panasonic Intellectual Property Management Co., Ltd. | Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film |
| JP6432283B2 (ja) * | 2014-10-31 | 2018-12-05 | 東レ株式会社 | ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム |
| JP2017122818A (ja) * | 2016-01-06 | 2017-07-13 | 旭化成株式会社 | 感光性樹脂積層体 |
| JP2018077426A (ja) * | 2016-11-11 | 2018-05-17 | ニッコー・マテリアルズ株式会社 | フォトレジストフィルム、レジストパターンの形成方法、および導体パターンの形成方法 |
| KR20190035864A (ko) * | 2016-12-07 | 2019-04-03 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 감광성 수지 적층체 |
| JP7234944B2 (ja) * | 2018-01-18 | 2023-03-08 | Ａｇｃ株式会社 | 長尺積層体、その製造方法及びプリント配線板 |
| JP7124409B2 (ja) * | 2018-04-18 | 2022-08-24 | 三菱ケミカル株式会社 | ドライフィルムレジスト用ポリエステルフィルム |
| KR102605003B1 (ko) * | 2018-06-22 | 2023-11-22 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
| KR102509152B1 (ko) * | 2018-08-09 | 2023-03-10 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
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| TW202142962A (zh) | 2021-11-16 |
| JP7377343B2 (ja) | 2023-11-09 |
| KR20220099114A (ko) | 2022-07-12 |
| CN115398337A (zh) | 2022-11-25 |
| WO2021201288A1 (ja) | 2021-10-07 |
| JPWO2021201288A1 (ja) | 2021-10-07 |
| TWI780648B (zh) | 2022-10-11 |
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