MY192472A - Photosensitive resin composition and photosensitive resin laminate - Google Patents

Photosensitive resin composition and photosensitive resin laminate

Info

Publication number
MY192472A
MY192472A MYUI2019000585A MYUI2019000585A MY192472A MY 192472 A MY192472 A MY 192472A MY UI2019000585 A MYUI2019000585 A MY UI2019000585A MY UI2019000585 A MYUI2019000585 A MY UI2019000585A MY 192472 A MY192472 A MY 192472A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
support film
laminate
resin laminate
Prior art date
Application number
MYUI2019000585A
Inventor
Takayuki Matsuda
Go Nishizawa
Jun Miyazaki
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY192472A publication Critical patent/MY192472A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a photosensitive resin laminate that is capable of ensuring high resolution and favorable line width reproducibility even when a deviation in focusing occurs during exposure. This photosensitive resin laminate is provided with a support film and a photosensitive resin composition layer that comprises a photosensitive resin composition and that is formed on said support film, wherein when a 5-mm square piece is cut out at arbitrarily-defined ten locations in the support film, the number of fine particles that have a size of not less than 1.5 ?m but less than 4.5 ?m and that are included in each of the pieces is 0-200 on average across the ten locations.
MYUI2019000585A 2016-12-07 2017-12-05 Photosensitive resin composition and photosensitive resin laminate MY192472A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016237556 2016-12-07
JP2017058855 2017-03-24
PCT/JP2017/043680 WO2018105620A1 (en) 2016-12-07 2017-12-05 Photosensitive resin composition and photosensitive resin laminate

Publications (1)

Publication Number Publication Date
MY192472A true MY192472A (en) 2022-08-22

Family

ID=62491417

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2019000585A MY192472A (en) 2016-12-07 2017-12-05 Photosensitive resin composition and photosensitive resin laminate

Country Status (6)

Country Link
JP (2) JP6985291B2 (en)
KR (2) KR20190035864A (en)
CN (1) CN109690404B (en)
MY (1) MY192472A (en)
TW (1) TWI666521B (en)
WO (1) WO2018105620A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780648B (en) * 2020-04-03 2022-10-11 日商旭化成股份有限公司 Photosensitive element, and method of forming resist pattern
US20240012326A1 (en) 2021-01-29 2024-01-11 Asahi Kasei Kabushiki Kaisha Photosensitive element, and method for forming resist pattern

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013681A (en) * 1999-06-28 2001-01-19 Hitachi Chem Co Ltd Photosensitive element, production of resist pattern, and production of printed wiring board
WO2003059995A1 (en) * 2002-01-10 2003-07-24 Toray Industries, Inc. Biaxially oriented thermoplastic resin film
JP2003345000A (en) * 2002-05-29 2003-12-03 Teijin Dupont Films Japan Ltd Laminated film for photoresist
JP4770836B2 (en) * 2005-08-03 2011-09-14 東亞合成株式会社 Photosensitive resin composition, solder resist composition and photosensitive dry film
KR101102186B1 (en) * 2007-01-31 2012-01-02 히다치 가세고교 가부시끼가이샤 Photosensitive element
WO2010013623A1 (en) * 2008-07-31 2010-02-04 日立化成工業株式会社 Photosensitive element, method for forming resist pattern using the same, and method for manufacturing printed wiring board
JP2010249884A (en) 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd Photopolymerizable resin composition and photosensitive film using the same
JP2011048270A (en) * 2009-08-28 2011-03-10 Hitachi Chem Co Ltd Photosensitive element, method for forming resist pattern using the same, and method for manufacturing printed wiring board
CN106918991A (en) * 2010-07-13 2017-07-04 日立化成工业株式会社 Photosensitive element, the forming method of corrosion-resisting pattern, the manufacture method of printed circuit board and printed circuit board
JP5768521B2 (en) * 2010-07-13 2015-08-26 日立化成株式会社 Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method
KR101444044B1 (en) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
JP2014074764A (en) * 2012-10-03 2014-04-24 Hitachi Chemical Co Ltd Photosensitive element, method for forming resist pattern using the same, and method for manufacturing printed wiring board
JP6095337B2 (en) * 2012-11-27 2017-03-15 日本写真印刷株式会社 Dry film resist roll with seal
CN106966074B (en) * 2012-12-27 2020-05-05 旭化成株式会社 Photosensitive resin laminate roll
JP6318484B2 (en) * 2013-07-09 2018-05-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
KR102437195B1 (en) * 2013-12-26 2022-08-26 아사히 가세이 가부시키가이샤 Photosensitive resin composition and photosensitive resin laminate
KR102375653B1 (en) * 2014-02-12 2022-03-16 쇼와덴코머티리얼즈가부시끼가이샤 Photosensitive element
CN111694218B (en) * 2014-05-21 2023-09-08 旭化成株式会社 Photosensitive resin composition and method for forming circuit pattern
TWI763631B (en) * 2015-07-08 2022-05-11 日商昭和電工材料股份有限公司 Photosensitive element, method of forming resist pattern, and method of manufacturing printed wiring board

Also Published As

Publication number Publication date
CN109690404A (en) 2019-04-26
JP2021113984A (en) 2021-08-05
KR102458384B1 (en) 2022-10-24
TWI666521B (en) 2019-07-21
KR20210082545A (en) 2021-07-05
WO2018105620A1 (en) 2018-06-14
KR20190035864A (en) 2019-04-03
JP6985291B2 (en) 2021-12-22
JPWO2018105620A1 (en) 2019-06-24
CN109690404B (en) 2023-04-04
TW201827930A (en) 2018-08-01

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