TWI666521B - Photosensitive resin composition and photosensitive resin laminate - Google Patents

Photosensitive resin composition and photosensitive resin laminate Download PDF

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TWI666521B
TWI666521B TW106142645A TW106142645A TWI666521B TW I666521 B TWI666521 B TW I666521B TW 106142645 A TW106142645 A TW 106142645A TW 106142645 A TW106142645 A TW 106142645A TW I666521 B TWI666521 B TW I666521B
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photosensitive resin
less
mass
resin composition
laminate
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TW106142645A
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TW201827930A (en
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松田隆之
西澤豪
宮崎純
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日商旭化成股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供一種即便於曝光時之焦點偏移時亦表現出高解像性及良好之線寬再現性的感光性樹脂積層體。該感光性樹脂積層體係具備支持膜、及形成於該支持膜上之包含感光性樹脂組合物之感光性樹脂組合物層者，其中於支持膜之任意10處切出一邊5 mm之正方形狀之小片時，各小片中所包含之1.5 μm以上且未達4.5 μm之微粒子之數量以上述10處平均計為0～200個。The present invention provides a photosensitive resin laminate that exhibits high resolution and good line width reproducibility even when the focus is shifted during exposure. The photosensitive resin laminate system includes a support film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the support film, and a square shape with a side of 5 mm is cut out at any 10 positions of the support film. In the case of small pieces, the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in each small piece is 0 to 200 on average in the above 10 places.

Description

感光性樹脂組合物及感光性樹脂積層體Photosensitive resin composition and photosensitive resin laminate

本發明係關於一種感光性樹脂組合物等。The present invention relates to a photosensitive resin composition and the like.

於個人電腦、行動電話等電子機器中，為了安裝零件、半導體等而使用印刷配線板等。作為印刷配線板等之製造用光阻，先前使用於支持膜上積層感光性樹脂層，進而於該感光性樹脂層上視需要積層保護膜而成之感光性樹脂積層體、所謂之乾膜光阻(以下有時亦稱作DF)。作為感光性樹脂層，目前通常為使用弱鹼性水溶液作為顯影液之鹼顯影型者。於使用DF製作印刷配線板等時，例如經過以下步驟。於DF具有保護膜之情形時，首先將保護膜剝離。其後，使用貼合機等將DF層壓於銅箔積層板或軟性基板等永久電路製作用基板上，透過配線圖案光罩膜等進行曝光。繼而，視需要將支持膜剝離，利用顯影液將未硬化部分(例如負型時為未曝光部分)之感光性樹脂層溶解或分散去除，從而於基板上形成硬化光阻圖案(以下有時亦簡稱為光阻圖案)。 形成光阻圖案後，形成電路之製程大體分為2種方法。第一種方法係將未被光阻圖案覆蓋之基板面(例如銅箔積層板之銅面)進行蝕刻去除後，利用較顯影液更強之鹼性水溶液將光阻圖案部分去除之方法(蝕刻法)。第二種方法係於上述基板面進行銅、焊料、鎳、錫等之鍍覆處理後，以與第一種方法相同之方式將光阻圖案部分去除，繼而對出現之基板面(例如銅箔積層板之銅面)進行蝕刻之方法(鍍覆法)。蝕刻時使用氯化銅、氯化鐵、銅氨錯合物溶液等。近年來，隨著電子機器之小型化及輕量化，印刷配線板不斷微細化及高密度化，要求於如上所述之製造步驟中賦予高解像性、良好之線寬再現性等之高性能DF。作為實現此種高解像性者，於專利文獻1中記載有利用特定之熱塑性樹脂、單體、及光聚合性起始劑而提高解像性之感光性樹脂組合物。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2010-249884號公報In electronic devices such as personal computers and mobile phones, printed wiring boards are used for mounting parts, semiconductors, and the like. As a photoresist for the production of printed wiring boards and the like, a photosensitive resin laminated body formed by laminating a photosensitive resin layer on a support film, and further laminating a protective film on the photosensitive resin layer as needed, and a so-called dry film light Resistance (hereinafter sometimes referred to as DF). As the photosensitive resin layer, an alkali developing type using a weakly alkaline aqueous solution as a developing solution is generally used at present. When a printed wiring board is produced using DF, for example, the following steps are performed. When the DF has a protective film, the protective film is first peeled off. Thereafter, DF is laminated on a substrate for permanent circuit production such as a copper foil laminated board or a flexible substrate using a bonding machine or the like, and exposed through a wiring pattern mask film or the like. Then, if necessary, the support film is peeled off, and the photosensitive resin layer of the uncured portion (for example, the unexposed portion in the negative type) is dissolved or dispersed with a developing solution to form a hardened photoresist pattern on the substrate (sometimes also referred to below) (Referred to as a photoresist pattern). After the photoresist pattern is formed, the process of forming a circuit is roughly divided into two methods. The first method is to remove the photoresist pattern portion by etching (removing the substrate surface that is not covered by the photoresist pattern (such as the copper surface of a copper foil laminate) with an alkaline aqueous solution stronger than the developer solution (etching law). The second method is to perform copper, solder, nickel, tin and other plating treatments on the substrate surface, and then remove the photoresist pattern part in the same way as the first method, and then to the substrate surface (such as copper foil) that appears The copper surface of the laminated board) is etched (plating method). For etching, copper chloride, ferric chloride, copper ammonia complex solution, and the like are used. In recent years, with the miniaturization and weight reduction of electronic equipment, printed wiring boards have been continuously miniaturized and densified, and high performance such as high resolution and good line width reproducibility are required in the manufacturing steps described above. DF. As a person achieving such high resolvability, Patent Document 1 describes a photosensitive resin composition that uses a specific thermoplastic resin, a monomer, and a photopolymerizable initiator to improve the resolvability. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2010-249884

[發明所欲解決之問題] 然而，於近年來常用之繪圖圖案之直接繪圖、或使光罩之圖像透過透鏡而投影之曝光方法等情形時，焦點位置對解像性或線寬再現性產生較大影響。例如，若因基板之翹曲及變形、曝光裝置之設定不良等而導致曝光時之焦點位置自基板表面偏移，則解像性或光阻線寬再現性會嚴重變差。其結果，有於利用蝕刻法形成電路時產生短路問題，於利用鍍覆法形成電路時產生缺損、斷線、鍍覆不良等問題之情形。又，亦會產生無法獲得所需之電路寬度之問題。就該觀點而言，上述專利文獻1中所記載之技術仍有改良之餘地。 因此，本發明之課題在於提供一種即便於曝光時之焦點偏移時亦表現出高解像性及良好之線寬再現性之感光性樹脂積層體、及用以形成該感光性樹脂積層體之支持膜及感光性樹脂組合物、以及使用該感光性樹脂積層體之光阻圖案之形成方法及導體圖案之形成方法。 [解決問題之技術手段] 本發明者為了解決上述問題而進行銳意研究並反覆進行實驗。其結果，發現藉由以下技術手段可解決該問題。 即，本發明為如下所述。 [1] 一種感光性樹脂積層體，其係具備支持膜、及形成於該支持膜上之包含感光性樹脂組合物之感光性樹脂組合物層者，其中於上述支持膜之任意10處切出一邊5 mm之正方形狀之小片時，各小片中所包含之1.5 μm以上且未達4.5 μm之微粒子之數量以上述10處平均計為0～200個。 [2] 如[1]記載之感光性樹脂積層體，其中上述5 mm見方之支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為1～200個。 [3] 如[1]記載之感光性樹脂積層體，其中上述5 mm見方之支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為1～100個。 [4] 如[1]記載之感光性樹脂積層體，其中上述5 mm見方之支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為1～50個。 [5] 如[1]記載之感光性樹脂積層體，其中上述5 mm見方之支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為1～20個。 [6] 如[1]記載之感光性樹脂積層體，其中上述5 mm見方之支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為1～10個。 [7] 如[1]至[6]中任一項記載之感光性樹脂積層體，其中上述感光性樹脂組合物以該感光性樹脂組合物之全部固形物成分質量基準計包含以下成分： (A)鹼可溶性高分子：10質量%～90質量%； (B)具有乙烯性不飽和雙鍵之化合物：5質量%～70質量%；及 (C)光聚合起始劑：0.01質量%～20質量%。 [8] 如[7]記載之感光性樹脂積層體，其中上述(A)鹼可溶性高分子之單體成分具有芳香族烴基。 [9] 如[7]或[8]記載之感光性樹脂積層體，其中上述(A)鹼可溶性高分子之玻璃轉移溫度Tg之重量平均值Tgtotal 為30℃以上且135℃以下。 [10] 如[7]至[9]中任一項記載之感光性樹脂積層體，其中以感光性樹脂組合物之全部固形物成分質量基準計進而包含以下成分： (D)酚系衍生物：0.001質量%～10質量%。 [11] 如[1]至[10]中任一項記載之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.7%以下。 [12] 如[11]記載之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.6%以下。 [13] 如[11]記載之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.5%以下。 [14] 如[1]至[13]中任一項記載之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630 nm下之透過率為80%以下。 [15] 如[14]記載之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630 nm下之透過率為70%以下。 [16] 如[14]記載之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630 nm下之透過率為60%以下。 [17] 一種光阻圖案之形成方法，其包括以下步驟： 積層步驟，其係將如[1]至[16]中任一項記載之感光性樹脂積層體積層於基板； 曝光步驟，其係將該感光性樹脂積層體之感光性樹脂層曝光；及 顯影步驟，其係將該感光性樹脂層之未曝光部分顯影去除。 [18] 如[17]記載之光阻圖案之形成方法，其中藉由利用繪圖圖案之直接繪圖之曝光方法、或使光罩之圖像透過透鏡而投影之曝光方法進行上述曝光步驟。 [發明之效果] 根據本發明，可提供一種即便於曝光時之焦點偏移時亦表現出高解像性及良好之線寬再現性之感光性樹脂積層體、及用以形成該感光性樹脂積層體之支持膜及感光性樹脂組合物、以及使用該感光性樹脂積層體之光阻圖案之形成方法及導體圖案之形成方法。其結果，即便於因基板之翹曲及變形、曝光裝置之設定不良等而導致曝光時之焦點位置自基板表面偏移時，亦可於藉由蝕刻法形成電路時減少短路問題，於藉由鍍覆法形成電路時減少缺損、斷線、鍍覆不良等問題。又，亦可獲得所需之電路寬度。[Problems to be Solved by the Invention] However, in cases such as direct drawing of drawing patterns commonly used in recent years, or an exposure method in which a mask image is projected through a lens, the focus position is resolvable or line width reproducible. Have a greater impact. For example, if the focus position at the time of exposure is shifted from the surface of the substrate due to warpage and deformation of the substrate, or a poor setting of the exposure device, the resolution or the reproducibility of the photoresistance line width will be severely deteriorated. As a result, short circuits may occur when a circuit is formed by an etching method, and defects such as defects, disconnection, and poor plating may occur when a circuit is formed by a plating method. In addition, there is a problem that a required circuit width cannot be obtained. From this viewpoint, there is still room for improvement in the technology described in the above-mentioned Patent Document 1. Therefore, an object of the present invention is to provide a photosensitive resin laminate that exhibits high resolution and good line width reproducibility even when the focus is shifted during exposure, and a method for forming the photosensitive resin laminate A supporting film and a photosensitive resin composition, and a method for forming a photoresist pattern and a method for forming a conductor pattern using the photosensitive resin laminate. [Technical Means for Solving the Problem] In order to solve the above problems, the present inventor conducted intensive research and repeated experiments. As a result, it was found that this problem can be solved by the following technical means. That is, this invention is as follows. [1] A photosensitive resin laminate comprising a support film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the support film, wherein the support film is cut out at any of 10 positions of the support film. In the case of 5 mm square small pieces, the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in each small piece is 0 to 200 on average in the above 10 places. [2] The photosensitive resin laminate as described in [1], in which the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film is 1 to 200 on average at 10 locations Each. [3] The photosensitive resin laminate as described in [1], in which the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film is 1 to 100 on average at 10 places Each. [4] The photosensitive resin laminate as described in [1], in which the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film is 1 to 50 on average at 10 places Each. [5] The photosensitive resin laminate as described in [1], in which the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film is 1 to 20 on average at 10 places Each. [6] The photosensitive resin laminate as described in [1], in which the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square support film is 1 to 10 on average at 10 places Each. [7] The photosensitive resin laminate according to any one of [1] to [6], wherein the photosensitive resin composition includes the following components on a mass basis of all solid content components of the photosensitive resin composition: ( A) Alkali-soluble polymers: 10% to 90% by mass; (B) Compounds having ethylenically unsaturated double bonds: 5% to 70% by mass; and (C) Photopolymerization initiators: 0.01% by mass to 20% by mass. [8] The photosensitive resin laminate according to [7], wherein the monomer component of the (A) alkali-soluble polymer has an aromatic hydrocarbon group. [9] The photosensitive resin laminate according to [7] or [8], wherein the weight average value Tg total of the glass transition temperature Tg of the (A) alkali-soluble polymer is 30 ° C or higher and 135 ° C or lower. [10] The photosensitive resin laminate according to any one of [7] to [9], further comprising the following components on a mass basis of the total solid content of the photosensitive resin composition: (D) a phenol derivative : 0.001% by mass to 10% by mass. [11] The photosensitive resin laminate according to any one of [1] to [10], wherein the moisture content contained in the photosensitive resin composition is 0.7% or less. [12] The photosensitive resin laminate according to [11], wherein the moisture content contained in the photosensitive resin composition is 0.6% or less. [13] The photosensitive resin laminate according to [11], wherein the moisture content contained in the photosensitive resin composition is 0.5% or less. [14] The photosensitive resin laminate according to any one of [1] to [13], wherein the transmittance at a wavelength of 630 nm of the laminate of the support film and the photosensitive resin composition layer is 80% or less . [15] The photosensitive resin laminate according to [14], wherein the transmittance at a wavelength of 630 nm of the laminate of the support film and the photosensitive resin composition layer is 70% or less. [16] The photosensitive resin laminate according to [14], wherein the transmittance at a wavelength of 630 nm of the laminate of the support film and the photosensitive resin composition layer is 60% or less. [17] A method for forming a photoresist pattern, which includes the following steps: a lamination step, which is a step of laminating a photosensitive resin as described in any one of [1] to [16] on a substrate; an exposure step, which is Exposing the photosensitive resin layer of the photosensitive resin layered body; and a developing step of developing and removing an unexposed portion of the photosensitive resin layer. [18] The method for forming a photoresist pattern as described in [17], wherein the exposure step is performed by an exposure method using a direct drawing drawing pattern or an exposure method in which an image of a photomask is projected through a lens. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive resin laminated body that exhibits high resolution and good line width reproducibility even when the focus is shifted during exposure, and to form the photosensitive resin. A support film and a photosensitive resin composition for a laminated body, and a method for forming a photoresist pattern and a conductor pattern using the photosensitive resin laminated body. As a result, even when the focus position at the time of exposure is shifted from the surface of the substrate due to the warpage and deformation of the substrate, or the setting of the exposure device, the short circuit problem can be reduced when the circuit is formed by the etching method. The plating method reduces problems such as defects, disconnection, and poor plating when forming circuits. Also, the required circuit width can be obtained.

以下，對用以實施本發明之例示之形態(以下簡稱為「實施形態」)詳細地進行說明。再者，本發明不限定於以下實施形態，可於其主旨之範圍內進行各種變化而實施。又，關於本說明書中之各種測定值，只要未特別說明，則依照本揭示之[實施例]之項中所記載之方法或業者理解與其同等之方法進行測定。 [感光性樹脂積層體] 本發明之感光性樹脂積層體係具備支持膜、及形成於該支持膜上之包含感光性樹脂組合物之感光性樹脂組合物層者，其中於支持膜之任意10處切出一邊5 mm之正方形狀之小片時，各小片中所包含之1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為0～200個。1.5 μm以上且未達4.5 μm之微粒子中包含直徑為1.5 μm以上且未達4.5 μm之一次粒子、及一次粒子之凝聚物之直徑為1.5 μm以上且未達4.5 μm之一次粒子凝聚物。再者，於一次粒子並非完全球體之情形時，將一次粒子之最長寬度設為該一次粒子之直徑。又，於一次粒子凝聚物並非完全球體之情形時，將一次粒子凝聚物之最長寬度設為該一次粒子凝聚物之直徑。感光性樹脂積層體視需要亦可於感光性樹脂層之與支持層側為相反側之表面具有保護層。 隨著近年來之電子機器之小型化、薄型化，配線之高密度化、軟性印刷配線板之應用、以及多層化之需求提高。而且，隨著不斷多層化，表面之起伏放大，有隨著曝光時之焦點偏移而解像性變差或線寬再現性變差之擔憂。其結果，短路不良或缺損、斷線、鍍覆不良之問題、無法形成所需之銅線之問題日益緊要。以大型基板進行曝光時之吸附不良、或面內之膜厚不均一性等亦會產生同樣之問題。因此，本發明者等人發現：著眼於使焦點位置對準基材表面而進行曝光時與使焦點位置對準自該基材表面向該基材之內側偏移後之位置(相對於上述表面之起伏量等焦點位置之偏移量設定為非常大之偏移量的基準值)而進行該曝光時的線寬之差或解像度之差而設計感光性樹脂積層體對於解決上述問題較為有效。 若該支持膜之一邊5 mm之正方形狀之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以任意10處平均計為0～200個，則可抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差。作為對該等性能產生影響之微粒子之大小，若為1.5 μm以上且未達4.5 μm，則於通常之曝光時不會對該等性能產生影響，但於利用直接繪圖之曝光方法等時，若因基板之應變或基板對平台之吸附不足、基板表面之凹凸之影響而導致曝光部分之焦點偏移，則微粒子對光之散射之影響變大。其結果，線寬變寬，解像性(尤其是提取性)變差。於4.5 μm以上之微粒子之情形時，即便於通常之曝光時解像性亦變差。於未達1.5 μm之微粒子之情形時，即便於曝光時之焦點偏移時亦不會出現線寬變寬或解像性變差。 就抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差之觀點而言，支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計較佳為180個以下，較佳為150個以下，較佳為120個以下，較佳為100個以下，更佳為80個以下，更佳為50個以下，進而較佳為30個以下，更佳為20個以下，尤佳為15個以下，進而較佳為10個以下，最佳為6個以下。 又，就支持膜與感光性樹脂層之密接性優異之方面而言，1.5 μm以上且未達4.5 μm之微粒子之數量較佳為1個以上。若支持膜中以任意10處平均計包含1個以上之1.5 μm以上且未達4.5 μm之微粒子，則支持膜之滑動性變佳，可減少支持膜之剝離等。若向基板進行層壓後局部產生支持膜之剝離，則有氧氣進入支持膜與感光性樹脂組合物層之間，因該氧氣而即便進行曝光亦產生感光性樹脂組合物之硬化不良之情形。 支持膜中之1.5 μm以上且未達4.5 μm之微粒子之數量可為2個以上，亦可為3個以上，亦可為5個以上，亦可為8個以上，亦可為10個以上。 再者，於本申請案中，於支持膜中之任意10處測定粒子之數量，若存在滿足本申請案技術方案所規定之粒子數之10處，則其感光性樹脂積層體當作處於本申請案發明之申請專利範圍內。即，於即便於某10處進行測定時不滿足規定之粒子數，但於另外10處進行測定時滿足規定之粒子數之情形時，其感光性樹脂積層體當作處於本申請案發明之申請專利範圍內。 作為支持膜中所包含之1.5 μm以上且未達4.5 μm之微粒子，例如為無機微粒子或有機微粒子，有潤滑劑、添加劑之凝聚物、混入原料中之異物、於製造步驟中混入之異物等。作為微粒子之具體例，可列舉：碳酸鈣、磷酸鈣、氧化矽(二氧化矽)、高嶺土、滑石、二氧化鈦、氧化鋁(alumina)(氧化鋁(aluminium oxide))、硫酸鋇、氟化鈣、氟化鋰、沸石、硫化鉬等無機粒子、交聯高分子粒子、草酸鈣等有機粒子等。該等可單獨，亦可為兩種以上之組合。 微粒子係依照常規方法調配於膜中。為了製造本發明之支持膜，例如可列舉利用4.5 μm以下之目之過濾器過濾樹脂等方法。 作為支持膜，較佳為使自曝光光源放射之光透過之透明支持膜。作為此種支持膜，例如可列舉：聚對苯二甲酸乙二酯膜、聚乙烯醇膜、聚氯乙烯膜、氯乙烯共聚物膜、聚偏二氯乙烯膜、偏二氯乙烯共聚膜、聚甲基丙烯酸甲酯共聚物膜、聚苯乙烯膜、聚丙烯腈膜、苯乙烯共聚物膜、聚醯胺膜、纖維素衍生物膜等。該等膜視需要亦可使用經延伸者。 作為支持膜，就抑制曝光時之光散射之觀點而言，較佳為霧度5%以下者，更佳為2%以下，進而較佳為1.5%以下，尤佳為1.0%以下。就同樣之觀點而言，與感光層接觸之面之表面粗糙度Ra較佳為30 nm以下，更佳為20 nm以下，尤佳為10 nm以下。關於膜之厚度，雖然越薄則圖像形成性及經濟性越高故而較為有利，但為了維持感光性樹脂積層體之強度，較佳為使用10 μm～30 μm者。 又，支持膜可為單層結構，亦可為積層由複數種組成所形成之樹脂層而成之多層結構。於多層結構之情形時，亦可存在抗靜電層。於如2層結構或3層結構之多層結構之情形時，例如可於一面A形成含有微粒子之樹脂層，並於另一面B採用(1)與面A同樣地含有微粒子、(2)含有較面A少量之微粒子、(3)含有較面A細之微粒子、(4)不含有微粒子之結構。於(2)、(3)、(4)之結構之情形時，較佳為於面B側形成感光性樹脂層。此時，若於面A側存在含有微粒子之樹脂層，則就膜之滑動性等觀點而言較佳。作為此時之微粒子之大小，就本發明之效果之觀點而言，亦較佳為未達1.5 μm。 用於感光性樹脂積層體之保護層之重要特性係與感光性樹脂層之密接力較支持層充分較小而可容易地剝離。例如，聚乙烯膜或聚丙烯膜可較佳地用作保護層。又，亦可使用日本專利特開昭59-202457號公報中所示之剝離性優異之膜。保護層之膜厚較佳為10 μm～100 μm，更佳為10 μm～50 μm。 聚乙烯膜表面有時存在被稱作魚眼之凝膠。於使用具有魚眼之聚乙烯膜作為保護層之情形時，有該魚眼被轉印至感光性樹脂層之情形。若魚眼被轉印至感光性樹脂層，則於層壓時有夾帶空氣而成為空隙之情形，會引起光阻圖案之缺損。就防止魚眼之觀點而言，作為保護層之材質，較佳為延伸聚丙烯。作為具體例，可列舉王子製紙(股)製造之Arufun E-200A。 感光性樹脂積層體中之感光性樹脂層之厚度根據用途而不同，較佳為1 μm～300 μm，更佳為3 μm～100 μm，尤佳為5 μm～60 μm，最佳為10 μm～30 μm。感光性樹脂層之厚度越薄，則解像度越高，又，越厚，則膜強度越高。 繼而，對感光性樹脂積層體之製造方法進行說明。 作為依序積層支持層及感光性樹脂層、以及視需要之保護層而製作感光性樹脂積層體之方法，可採用已知之方法。例如，可將用於感光性樹脂層之感光性樹脂組合物與溶解其之溶劑混合而製成均一之溶液，先使用棒式塗佈機或輥式塗佈機塗佈於支持層上，繼而進行乾燥而將上述溶劑去除，藉此而於支持層上積層包含感光性樹脂組合物之感光性樹脂層。繼而視需要可藉由於感光性樹脂層上層壓保護層而製作感光性樹脂積層體。 [感光性樹脂組合物] 於本實施形態中，感光性樹脂組合物較佳為包含(A)鹼可溶性高分子、(B)具有乙烯性不飽和雙鍵之化合物、及(C)光聚合起始劑。感光性樹脂組合物較佳為以該感光性樹脂組合物之全部固形物成分質量基準計包含：(A)鹼可溶性高分子：10質量%～90質量%；(B)具有乙烯性不飽和雙鍵之化合物：5質量%～70質量%；及(C)光聚合起始劑：0.01質量%～20質量%。以下，依次對各成分進行說明。 ＜(A)鹼可溶性高分子＞ 於本揭示中，(A)鹼可溶性高分子包含易溶於鹼性物質之高分子。更具體而言，(A)鹼可溶性高分子中所包含之羧基之量以酸當量計為100～600，較佳為250～450。所謂酸當量，係指於其分子中具有1當量之羧基之聚合物之質量(單位：克)。為了對感光性樹脂層賦予對鹼性水溶液之顯影性及剝離性，(A)鹼可溶性高分子中之羧基是必需的。使酸當量為100以上就提高顯影耐性、解像性、及密接性之觀點而言較佳。而且，更佳為使酸當量為250以上。另一方面，使酸當量為600以下就提高顯影性及剝離性之觀點而言較佳。而且，更佳為使酸當量為450以下。於本揭示中，酸當量係使用電位差滴定裝置，藉由利用0.1 mol/L之NaOH水溶液進行滴定之電位差滴定法所測得之值。 (A)鹼可溶性高分子之重量平均分子量較佳為5,000～500,000。使重量平均分子量為500,000以下就提高解像性及顯影性之觀點而言較佳。更佳為使重量平均分子量為100,000以下，進而較佳為使重量平均分子量為60,000以下，尤佳為使重量平均分子量為50,000以下。另一方面，使重量平均分子量為5,000以上就控制顯影凝聚物之性狀、以及製成感光性樹脂積層體之情形時之邊緣熔融性及切割碎片性等未曝光膜之性狀之觀點而言較佳。更佳為使重量平均分子量為10,000以上，進而較佳為使重量平均分子量為20,000以上。所謂邊緣熔融性，係指以感光性樹脂積層體之形式捲取為捲筒狀之情形時感光性樹脂層(即包含感光性樹脂組合物之層)自捲筒之端面之易露程度。所謂切割碎片性，係指利用切割器將未曝光膜切斷之情形時碎片之易飛程度。若該碎片附著於感光性樹脂積層體之上表面等，則會於之後之曝光步驟等中轉印至光罩而成為不良品之原因。(A)鹼可溶性高分子之分散度較佳為1.0～6.0，更佳為1.0～5.0，進而較佳為1.0～4.0，進而較佳為1.0～3.0。 於本實施形態中，就抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差之觀點而言，感光性樹脂組合物較佳為包含具有芳香族烴基之單體成分作為(A)鹼可溶性高分子者。再者，作為此種芳香族烴基，例如可列舉經取代或未經取代之苯基、或經取代或未經取代之芳烷基。該(A)鹼可溶性高分子中之具有芳香族烴基之單體成分之含有比率以全部單體成分之合計質量為基準較佳為20質量%以上，更佳為40質量%以上，進而較佳為50質量%以上，尤佳為55質量%以上，最佳為60質量%以上。作為上限，並無特別限定，較佳為95質量%以下，更佳為80質量%以下。再者，含有複數種(A)鹼可溶性高分子之情形時之具有芳香族烴基之單體成分的含有比率係以重量平均值之形式求出。 作為上述具有芳香族烴基之單體，例如可列舉：具有芳烷基之單體、苯乙烯、及可聚合之苯乙烯衍生物(例如甲基苯乙烯、乙烯基甲苯、第三丁氧基苯乙烯、乙醯氧基苯乙烯、4-乙烯基苯甲酸、苯乙烯二聚物、苯乙烯三聚物等)。其中，較佳為具有芳烷基之單體、或苯乙烯。 作為芳烷基，可列舉經取代或未經取代之苯烷基(除苄基以外)、或經取代或未經取代之苄基等，較佳為經取代或未經取代之苄基。 作為具有苯烷基之共聚單體，可列舉(甲基)丙烯酸苯乙酯等。 作為具有苄基之共聚單體，可列舉：具有苄基之(甲基)丙烯酸酯、例如(甲基)丙烯酸苄酯、(甲基)丙烯酸氯苄酯等；具有苄基之乙烯基單體、例如乙烯基苄氯、乙烯基苄醇等。其中，較佳為(甲基)丙烯酸苄酯。 含有具有芳香族烴基之單體成分之(A)鹼可溶性高分子較佳為藉由使具有芳香族烴基之單體與下述第一單體之至少1種及/或下述第二單體之至少1種進行聚合而獲得。 不含有具有芳香族烴基之單體成分之(A)鹼可溶性高分子較佳為藉由使下述第一單體之至少1種進行聚合而獲得，更佳為藉由使第一單體之至少1種與下述第二單體之至少1種進行共聚而獲得。 第一單體係分子中具有羧基之單體。作為第一單體，例如可列舉：(甲基)丙烯酸、反丁烯二酸、桂皮酸、丁烯酸、亞甲基丁二酸、4-乙烯基苯甲酸、順丁烯二酸酐、順丁烯二酸半酯等。該等中，較佳為(甲基)丙烯酸。 再者，於本說明書中，所謂「(甲基)丙烯酸」，意指丙烯酸或甲基丙烯酸，所謂「(甲基)丙烯醯基」，意指丙烯醯基或甲基丙烯醯基，且所謂「(甲基)丙烯酸酯」，意指「丙烯酸酯」或「甲基丙烯酸酯」。 第一單體之共聚比率以全部單體成分之合計質量為基準較佳為10～50質量%。使該共聚比率為10質量%以上就表現出良好之顯影性之觀點、控制邊緣熔融性等觀點而言較佳，更佳為15質量%以上，進而較佳為20質量%以上。使該共聚比率為50質量%以下就光阻圖案之高解像性及麓部形狀之觀點而言、進而就光阻圖案之耐化學品性之觀點而言較佳，就該等觀點而言，更佳為35質量%以下，進而較佳為30質量%以下，尤佳為27質量%以下。 第二單體係非酸性且分子中具有至少1個聚合性不飽和基之單體。作為第二單體，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-乙基己酯等(甲基)丙烯酸酯類；乙酸乙烯酯等乙烯醇之酯類；以及(甲基)丙烯腈等。其中，較佳為(甲基)丙烯酸甲酯、(甲基)丙烯酸2-乙基己酯、及(甲基)丙烯酸正丁酯。 含有具有芳烷基之單體及/或苯乙烯作為單體就抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差之觀點而言較佳。例如較佳為包含甲基丙烯酸、甲基丙烯酸苄酯及苯乙烯之共聚物、包含甲基丙烯酸、甲基丙烯酸甲酯、甲基丙烯酸苄酯及苯乙烯之共聚物等。 (A)鹼可溶性高分子可單獨使用1種，或者亦可將2種以上混合而使用。於將2種以上混合而使用之情形時，較佳為混合使用2種包含具有芳香族烴基之單體成分之鹼可溶性高分子、或混合使用包含具有芳香族烴基之單體成分之鹼可溶性高分子與不包含具有芳香族烴基之單體成分之鹼可溶性高分子。於後者之情形時，包含具有芳香族烴基之單體成分之鹼可溶性高分子之使用比率相對於(A)鹼可溶性高分子全部較佳為50質量%以上，更佳為70質量%以上，較佳為80質量%以上，更佳為90質量%以上。 (A)鹼可溶性高分子之合成較佳為藉由如下方式進行：向利用丙酮、甲基乙基酮、異丙醇等溶劑將上述說明之一種或複數種單體稀釋而成之溶液中添加適量之過氧化苯甲醯、偶氮異丁腈等自由基聚合起始劑，並進行加熱攪拌。亦有一面將混合物之一部分滴加至反應液一面進行合成之情形。亦有於反應結束後進而添加溶劑而調整至所需之濃度之情形。作為合成方法，除溶液聚合以外，亦可使用塊狀聚合、懸浮聚合、或乳化聚合。 (A)鹼可溶性高分子之玻璃轉移溫度Tg之重量平均值Tgtotal 較佳為30℃以上且135℃以下。Tgtotal 係藉由下述實施例中所記載之方法而算出。藉由於感光性樹脂組合物中使用具有135℃以下之Tgtotal 之(A)鹼可溶性高分子，可抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差。就該觀點而言，(A)鹼可溶性高分子之Tgtotal 更佳為120℃以下，進而較佳為115℃以下，更佳為110℃以下，進而較佳為105℃以下，尤佳為110℃以下。又，使用具有30℃以上之Tgtotal 之(A)鹼可溶性高分子就提高耐邊緣熔融性之觀點而言較佳。就該觀點而言，(A)鹼可溶性高分子之Tgtotal 更佳為40℃以上，進而較佳為50℃以上，尤佳為60℃以上。 (A)鹼可溶性高分子相對於感光性樹脂組合物之全部固形物成分質量之比率較佳為10質量%～90質量%之範圍，更佳為30質量%～70質量%，進而較佳為40質量%～60質量%。使(A)鹼可溶性高分子相對於感光性樹脂組合物之比率為90質量%以下就控制顯影時間之觀點而言較佳。另一方面，使(A)鹼可溶性高分子相對於感光性樹脂組合物之比率為10質量%以上就提高耐邊緣熔融性之觀點而言較佳。 ＜(B)具有乙烯性不飽和雙鍵之化合物＞ 就硬化性及與(A)鹼可溶性高分子之相容性之觀點而言，(B)具有乙烯性不飽和雙鍵之化合物較佳為包含分子內具有(甲基)丙烯醯基之化合物。(B)化合物中之(甲基)丙烯醯基之數量只要為1個以上即可。 作為具有1個(甲基)丙烯醯基之(B)化合物，例如可列舉：對聚環氧烷之一末端加成(甲基)丙烯酸而成之化合物、或對聚環氧烷之一末端加成(甲基)丙烯酸並使另一末端烷基醚化或烯丙基醚化而成之化合物、苯二甲酸系化合物等；就剝離性或硬化膜柔軟性之觀點而言較佳。 作為此種化合物，例如可列舉： 作為將聚乙二醇加成至苯基而成之化合物之(甲基)丙烯酸酯的苯氧基六乙二醇單(甲基)丙烯酸酯、作為將加成有平均2莫耳之環氧丙烷之聚丙二醇與加成有平均7莫耳之環氧乙烷之聚乙二醇加成至壬基苯酚而成之化合物之(甲基)丙烯酸酯的4-正壬基苯氧基七乙二醇二丙二醇(甲基)丙烯酸酯、作為將加成有平均1莫耳之環氧丙烷之聚丙二醇與加成有平均5莫耳之環氧乙烷之聚乙二醇加成至壬基苯酚而成之化合物之(甲基)丙烯酸酯的4-正壬基苯氧基五乙二醇單丙二醇(甲基)丙烯酸酯、作為將加成有平均8莫耳之環氧乙烷之聚乙二醇加成至壬基苯酚而成之化合物之丙烯酸酯的4-正壬基苯氧基八乙二醇(甲基)丙烯酸酯(例如東亞合成(股)製造，M-114)等。 又，若包含γ-氯-β-羥基丙基-β'-甲基丙烯醯氧基乙基-鄰苯二甲酸酯，則除上述觀點以外，就感度、解像性、密接性之觀點而言亦較佳。 作為分子內具有2個(甲基)丙烯醯基之化合物，例如可列舉：於環氧烷鏈之兩末端具有(甲基)丙烯醯基之化合物、或於環氧乙烷鏈與環氧丙烷鏈以無規或嵌段鍵結而成之環氧烷鏈之兩末端具有(甲基)丙烯醯基之化合物等。 作為此種化合物，例如可列舉：四乙二醇二(甲基)丙烯酸酯、五乙二醇二(甲基)丙烯酸酯、六乙二醇二(甲基)丙烯酸酯、七乙二醇二(甲基)丙烯酸酯、八乙二醇二(甲基)丙烯酸酯、九乙二醇二(甲基)丙烯酸酯、十乙二醇二(甲基)丙烯酸酯、於12莫耳之環氧乙烷鏈之兩末端具有(甲基)丙烯醯基之化合物等之聚乙二醇(甲基)丙烯酸酯等，以及聚丙二醇二(甲基)丙烯酸酯、聚丁二醇二(甲基)丙烯酸酯等。作為化合物中包含環氧乙烷基與環氧丙烷基之聚環氧烷二(甲基)丙烯酸酯化合物，例如可列舉：對加成有平均12莫耳之環氧丙烷之聚丙二醇之兩末端進而分別加成平均3莫耳之環氧乙烷而成之二醇的二甲基丙烯酸酯、對加成有平均18莫耳之環氧丙烷之聚丙二醇之兩末端進而分別加成平均15莫耳之環氧乙烷而成之二醇的二甲基丙烯酸酯、FA-023M、FA-024M、FA-027M(製品名，日立化成工業製造)等。該等就柔軟性、解像性、密接性等觀點而言較佳。 作為分子內具有2個(甲基)丙烯醯基之化合物之其他例，藉由將雙酚A進行環氧烷改性而於兩末端具有(甲基)丙烯醯基之化合物就解像性及密接性之觀點而言較佳。 具體而言，可使用下述通式(I)所表示之化合物。 [化1]{式中，R1及R2分別獨立地表示氫原子或甲基，A為C2 H4 ，B為C3 H6 ，n1及n3分別獨立地為1～39之整數，且n1＋n3為2～40之整數，n2及n4分別獨立地為0～29之整數，且n2＋n4為0～30之整數，-(A-O)-及-(B-O)-之重複單元之排列可為無規，亦可為嵌段；而且，於為嵌段之情形時，-(A-O)-與-(B-O)-均可為聯苯基側} 例如，對雙酚A之兩端分別加成平均各5莫耳之環氧乙烷而成之聚乙二醇之二甲基丙烯酸酯、對雙酚A之兩端分別加成平均各2莫耳之環氧乙烷而成之聚乙二醇之二甲基丙烯酸酯、對雙酚A之兩端分別加成平均各1莫耳之環氧乙烷而成之聚乙二醇之二甲基丙烯酸酯就解像性、密接性之方面而言較佳。 又，亦可使用上述通式(I)中之芳香環具有雜原子及/或取代基之化合物。 作為雜原子，例如可列舉鹵素原子等，而且，作為取代基，可列舉：碳數1～20之烷基、碳數3～10之環烷基、碳數6～18之芳基、苯甲醯甲基、胺基、碳數1～10之烷基胺基、碳數2～20之二烷基胺基、硝基、氰基、羰基、巰基、碳數1～10之烷基巰基、芳基、羥基、碳數1～20之羥基烷基、羧基、烷基之碳數為1～10之羧基烷基、烷基之碳數為1～10之醯基、碳數1～20之烷氧基、碳數1～20之烷氧基羰基、碳數2～10之烷基羰基、碳數2～10之烯基、碳數2～10之N-烷基胺甲醯基或包含雜環之基、或者經該等取代基取代之芳基等。該等取代基可形成縮合環，或者亦可該等取代基中之氫原子被取代為鹵素原子等雜原子。於通式(I)中之芳香環具有複數個取代基之情形時，複數個取代基可相同，或者亦可不同。 作為分子內具有3個以上之(甲基)丙烯醯基之化合物，係藉由如下方式而獲得：作為中心骨架而具有3莫耳以上之可使分子內加成環氧烷基之基，使其加成伸乙氧基、伸丙氧基、伸丁氧基等伸烷氧基而獲得醇，將該醇製成(甲基)丙烯酸酯。於該情形時，作為可成為中心骨架之化合物，例如可列舉：甘油、三羥甲基丙烷、五赤藻糖醇、二-五赤藻糖醇、異氰尿酸酯環等。作為該等化合物，可列舉：三(甲基)丙烯酸酯、例如乙氧基化甘油三(甲基)丙烯酸酯、乙氧基化異三聚氰酸三(甲基)丙烯酸酯、五赤藻糖醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯(例如對三羥甲基丙烷加成平均21莫耳之環氧乙烷而成之三甲基丙烯酸酯、對三羥甲基丙烷加成平均30莫耳之環氧乙烷而成之三甲基丙烯酸酯就柔軟性、密接性、滲出抑制之觀點而言較佳)等；四(甲基)丙烯酸酯、例如二-三羥甲基丙烷四(甲基)丙烯酸酯、五赤藻糖醇四(甲基)丙烯酸酯、二-五赤藻糖醇四(甲基)丙烯酸酯等；五(甲基)丙烯酸酯、例如二-五赤藻糖醇五(甲基)丙烯酸酯等；六(甲基)丙烯酸酯、例如二-五赤藻糖醇六(甲基)丙烯酸酯等。具有3個以上之(甲基)丙烯醯基之化合物就解像性、密接性、光阻麓部形狀之觀點而言較佳，更佳為具有3個以上之甲基丙烯醯基之化合物。 作為四(甲基)丙烯酸酯，較佳為五赤藻糖醇四(甲基)丙烯酸酯。五赤藻糖醇四(甲基)丙烯酸酯可為對五赤藻糖醇之4個末端加成有合計1～40莫耳之環氧烷之四(甲基)丙烯酸酯等。 作為六(甲基)丙烯酸酯，較佳為對二-五赤藻糖醇之6個末端加成有合計1～40莫耳之環氧乙烷之六(甲基)丙烯酸酯、對二-五赤藻糖醇之6個末端加成有合計1～20莫耳之ε-己內酯之六(甲基)丙烯酸酯。 上述所說明之(甲基)丙烯酸酯化合物可分別獨立使用或組合而使用。感光性樹脂組合物亦可包含其他化合物作為(B)具有乙烯性不飽和鍵之化合物。作為其他化合物，可列舉：具有胺基甲酸酯鍵之(甲基)丙烯酸酯、使α,β-不飽和羧酸與多元醇進行反應而獲得之化合物、使α,β-不飽和羧酸與含縮水甘油基化合物進行反應而獲得之化合物、1,6-己二醇二(甲基)丙烯酸酯等。 (B)具有乙烯性不飽和雙鍵之化合物相對於感光性樹脂組合物之全部固形物成分質量的比率較佳為5質量%～70質量%。使該比率為5質量%以上就感度、解像性及密接性之觀點而言較佳。更佳為使該比率為20質量%以上，進而較佳為使該比率為30質量%以上。另一方面，使該比率為70質量%以下就抑制邊緣熔融及硬化光阻之剝離延遲之觀點而言較佳。更佳為使該比率為50質量%以下。 ＜(C)光聚合起始劑＞ (C)光聚合起始劑係利用光使單體聚合之化合物。感光性樹脂組合物包含本技術領域中通常已知之化合物作為(C)光聚合起始劑。 感光性樹脂組合物中之(C)光聚合起始劑之總含量為較佳為0.01～20質量%、更佳為0.05質量%～10質量%、進而較佳為0.1質量%～7質量%、尤佳為0.1質量%～6質量%之範圍內。就獲得充分之感度之觀點而言，(C)光聚合起始劑之總含量較佳為0.01質量%以上，就使光充分地透過至光阻底面而獲得良好之高解像性之觀點而言，較佳為20質量%以下。 作為(C)光聚合起始劑，可列舉醌類、芳香族酮類、苯乙酮類、醯基氧化膦類、苯偶姻或苯偶姻醚類、二烷基縮酮類、9-氧硫&#134079;類、二烷基胺基苯甲酸酯類、肟酯類、吖啶類(例如9-苯基吖啶、雙吖啶基庚烷、9-(對甲基苯基)吖啶、9-(間甲基苯基)吖啶就感度、解像性、密接性之方面而言較佳)，進而可列舉六芳基聯咪唑、吡唑啉化合物、蒽化合物(例如9,10-二丁氧基蒽、9,10-二乙氧基蒽就感度、解像性、密接性之方面而言較佳)、香豆素化合物(例如7-二乙胺基-4-甲基香豆素就感度、解像性、密接性之方面而言較佳)、N-芳基胺基酸或其酯化合物(例如N-苯基甘胺酸就感度、解像性、密接性之方面而言較佳)、及鹵素化合物(例如三溴甲基苯基碸)等。該等可單獨使用1種或將2種以上組合而使用。此外，亦可使用2,2-二甲氧基-1,2-二苯基乙烷-1-酮、2-甲基-1-(4-甲基噻吩基)-2-嗎啉基丙烷-1-酮、2,4,6-三甲基苯甲醯基-二苯基-氧化膦、三苯基氧化膦。 作為芳香族酮類，例如可列舉：二苯甲酮、米其勒酮[4,4'-雙(二甲胺基)二苯甲酮]、4,4'-雙(二乙胺基)二苯甲酮、4-甲氧基-4'-二甲胺基二苯甲酮。該等可單獨使用1種或將2種以上組合而使用。該等中，就密接性之觀點而言，較佳為4,4'-雙(二乙胺基)二苯甲酮。進而，就透過率之觀點而言，感光性樹脂組合物中之芳香族酮類之含量為較佳為0.01質量%～0.5質量%、進而較佳為0.02質量%～0.3質量%之範圍內。 作為六芳基聯咪唑之例，可列舉：2-(鄰氯苯基)-4,5-二苯基聯咪唑、2,2',5-三-(鄰氯苯基)-4-(3,4-二甲氧基苯基)-4',5'-二苯基聯咪唑、2,4-雙-(鄰氯苯基)-5-(3,4-二甲氧基苯基)-二苯基聯咪唑、2,4,5-三-(鄰氯苯基)-二苯基聯咪唑、2-(鄰氯苯基)-雙-4,5-(3,4-二甲氧基苯基)-聯咪唑、2,2'-雙-(2-氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3-二氟甲基苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,4-二氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,5-二氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,6-二氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3,4-三氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3,5-三氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3,6-三氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,4,5-三氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,4,6-三氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3,4,5-四氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、2,2'-雙-(2,3,4,6-四氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑、及2,2'-雙-(2,3,4,5,6-五氟苯基)-4,4',5,5'-四-(3-甲氧基苯基)-聯咪唑等；該等可單獨使用1種或將2種以上組合而使用。就高感度、解像性及密接性之觀點而言，較佳為2-(鄰氯苯基)-4,5-二苯基咪唑二聚物。 於本實施形態中，就提高感光性樹脂層之剝離特性及/或感度之觀點而言，感光性樹脂組合物中之六芳基聯咪唑化合物之含量較佳為0.05質量%～7質量%、更佳為0.1質量%～6質量%、進而較佳為1質量%～5質量%之範圍內。 就感光性樹脂層之剝離特性或感度、解像性、密接性之觀點而言，感光性樹脂組合物較佳為亦包含吡唑啉化合物作為光增感劑。 作為吡唑啉化合物，就上述觀點而言，例如可較佳地列舉：1-苯基-3-(4-第三丁基-苯乙烯基)-5-(4-第三丁基-苯基)-吡唑啉、1-(4-(苯并㗁唑-2-基)苯基)-3-(4-第三丁基-苯乙烯基)-5-(4-第三丁基-苯基)-吡唑啉、1-苯基-3-(4-聯苯)-5-(4-第三丁基-苯基)-吡唑啉、1-苯基-3-(4-聯苯)-5-(4-第三辛基-苯基)-吡唑啉、1-苯基-3-(4-異丙基苯乙烯基)-5-(4-異丙基苯基)-吡唑啉、1-苯基-3-(4-甲氧基苯乙烯基)-5-(4-甲氧基苯基)-吡唑啉、1-苯基-3-(3,5-二甲氧基苯乙烯基)-5-(3,5-二甲氧基苯基)-吡唑啉、1-苯基-3-(3,4-二甲氧基苯乙烯基)-5-(3,4-二甲氧基苯基)-吡唑啉、1-苯基-3-(2,6-二甲氧基苯乙烯基)-5-(2,6-二甲氧基苯基)-吡唑啉、1-苯基-3-(2,5-二甲氧基苯乙烯基)-5-(2,5-二甲氧基苯基)-吡唑啉、1-苯基-3-(2,3-二甲氧基苯乙烯基)-5-(2,3-二甲氧基苯基)-吡唑啉、1-苯基-3-(2,4-二甲氧基苯乙烯基)-5-(2,4-二甲氧基苯基)-吡唑啉等。該等中，更佳為1-苯基-3-(4-聯苯)-5-(4-第三丁基-苯基)-吡唑啉。 於本實施形態中，就提高感光性樹脂層之剝離特性及/或感度之觀點而言，感光性樹脂組合物中之光增感劑之含量較佳為0.05質量%～5質量%、更佳為0.1質量%～3質量%之範圍內。 ＜(D)酚系衍生物＞ 於本實施形態中，感光性樹脂組合物較佳為進而包含(D)酚系衍生物。作為(D)酚系衍生物，例如可列舉：對甲氧基苯酚、對苯二酚、鄰苯三酚、第三丁基兒茶酚、2,6-二-第三丁基-對甲酚、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-第三丁基苯酚)、2,6-二-第三丁基-4-甲基苯酚、2,5-二-第三戊基對苯二酚、2,5-二-第三丁基對苯二酚、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、雙(2-羥基-3-第三丁基-5-乙基苯基)甲烷、三乙二醇-雙[3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯]、1,6-己二醇-雙[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、季戊四醇基-四[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、2,2-硫基-二伸乙基雙[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、十八烷基-3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯、N,N'-六亞甲基雙(3,5-二-第三丁基-4-羥基-氫桂皮醯胺)、3,5-二-第三丁基-4-羥基苄基膦酸酯-二乙基酯、1,3,5-三甲基-2,4,6-三(3,5-二-第三丁基-4-羥基苄基)苯、三-(3,5-二-第三丁基-4-羥基苄基)-異氰尿酸酯、4,4'-硫代雙(6-第三丁基-間甲酚)、4,4'-亞丁基雙(3-甲基-6-第三丁基苯酚)、1,1,3-三(2-甲基-4-羥基-5-第三丁基苯基)丁烷、苯乙烯化苯酚(例如川口化學工業(股)製造，Antage SP)、三苄基苯酚(例如川口化學工業(股)製造，TBP，具有1～3個苄基之苯酚)、聯苯酚等。含有(D)酚系衍生物就可抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差之觀點而言較佳，就同樣之觀點而言，較佳為受阻酚或聯苯酚。又，就同樣之觀點而言，(D)酚系衍生物較佳為具有2核以上之酚核。 (D)酚系衍生物相對於感光性樹脂組合物之全部固形物成分質量之比率較佳為0.001質量%～10質量%。就可抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差之觀點而言，該比率較佳為0.001質量%以上，更佳為0.005質量%以上，進而較佳為0.01質量%以上，更佳為0.05質量%以上，尤佳為0.1質量%以上。另一方面，就感度降低較少之方面及解像性提高之方面而言，該比率較佳為10質量%以下，更佳為5質量%以下，進而較佳為3質量%以下，尤佳為2質量%以下，最佳為1.5質量%以下。 ＜添加劑＞ 感光性樹脂組合物視需要可包含染料、塑化劑、抗氧化劑、穩定化劑等添加劑。例如可使用日本專利特開2013-156369號公報中所列舉之添加劑。 (染料及著色物質) 於本實施形態中，感光性樹脂組合物視需要亦可進而含有選自由染料(例如隱色染料、螢光黃母體染料等)及著色物質所組成之群中之至少1種。 作為著色物質，例如可列舉：一品紅、酞菁綠、金黃胺鹼、對品紅、結晶紫、甲基橙、尼羅藍2B、維多利亞藍、孔雀綠(例如保土谷化學(股)製造 Aizen(註冊商標) MALACHITE GREEN)、鹼性藍20、鑽石綠(例如保土谷化學(股)製造 Aizen(註冊商標) DIAMOND GREEN GH)。感光性樹脂組合物中之著色物質之含量於將感光性樹脂組合物之全部固形物成分質量設為100質量%時較佳為0.001質量%～1質量%。使該含量為0.001質量%以上就提高感光性樹脂組合物之操作性之觀點而言較佳。另一方面，使該含量為1質量%以下就維持感光性樹脂組合物之保存穩定性之觀點而言較佳。 感光性樹脂組合物藉由含有染料而曝光部分顯色，故而就視認性之方面而言較佳，又，於檢查機等讀取用於曝光之位置對準標記之情形時，曝光部分與未曝光部分之對比度較大時容易識別而較為有利。作為就該觀點而言較佳之染料，可列舉隱色染料及螢光黃母體染料。 作為隱色染料，可列舉三(4-二甲胺基苯基)甲烷[隱色結晶紫]、雙(4-二甲胺基苯基)苯基甲烷[隱色孔雀綠]等。尤其，就對比度變得良好之觀點而言，作為隱色染料，較佳為使用隱色結晶紫。感光性樹脂組合物中之隱色染料之含量相對於感光性樹脂組合物之全部固形物成分質量較佳為0.1質量%～10質量%。使該含量為0.1質量%以上就使曝光部分與未曝光部分之對比度良好之觀點而言較佳。該含量更佳為設為0.2質量%以上，尤佳為設為0.4質量%以上。另一方面，使該含量為10質量%以下就維持保存穩定性之觀點而言較佳。該含量更佳為設為5質量%以下，尤佳為設為2質量%以下。 又，於感光性樹脂組合物中將隱色染料與(C)光聚合起始劑中上述之鹵素化合物組合而使用就使密接性及對比度最佳化之觀點而言較佳。於將隱色染料與該鹵素化合物併用之情形時，感光性樹脂組合物中之該鹵素化合物之含量於將感光性樹脂組合物之全部固形物成分質量設為100質量%時為0.01質量%～3質量%就維持感光層中之色相之保存穩定性之觀點而言較佳。 (其他添加劑) 為了提高熱穩定性及保存穩定性，感光性樹脂組合物亦可進而含有選自由自由基聚合抑制劑、苯并三唑類及羧基苯并三唑類所組成之群中之至少1種化合物。 作為自由基聚合抑制劑，例如可列舉：萘胺、氯化亞銅、亞硝基苯基羥基胺鋁鹽、二苯基亞硝基胺等。為了不損害感光性樹脂組合物之感度，較佳為亞硝基苯基羥基胺鋁鹽。 作為苯并三唑類，例如可列舉：1,2,3-苯并三唑、1-氯-1,2,3-苯并三唑、雙(N-2-乙基己基)胺基亞甲基-1,2,3-苯并三唑、雙(N-2-乙基己基)胺基亞甲基-1,2,3-甲苯并三唑、雙(N-2-羥基乙基)胺基亞甲基-1,2,3-苯并三唑等。 作為羧基苯并三唑類，例如可列舉：4-羧基-1,2,3-苯并三唑、5-羧基-1,2,3-苯并三唑、N-(N,N-二-2-乙基己基)胺基亞甲基羧基苯并三唑、N-(N,N-二-2-羥基乙基)胺基亞甲基羧基苯并三唑、N-(N,N-二-2-乙基己基)胺基伸乙基羧基苯并三唑等。 自由基聚合抑制劑、苯并三唑類及羧基苯并三唑類之合計含量於將感光性樹脂組合物之全部固形物成分質量設為100質量%時較佳為0.01質量%～3質量%，更佳為0.05質量%～1質量%。使該含量為0.01質量%以上就對感光性樹脂組合物賦予保存穩定性之觀點而言較佳。另一方面，使該含量為3質量%以下就維持感度且抑制染料之脫色之觀點而言較佳。 染料之脫色可利用波長630 nm之透過率進行測定。波長630 nm之透過率較高表示染料脫色。支持膜與感光性樹脂組合物層之積層體之波長630 nm下之透過率較佳為80%以下，較佳為78%以下，較佳為75%以下，較佳為72%以下，較佳為70%以下，較佳為68%以下，較佳為65%以下，較佳為62%以下，較佳為60%以下，較佳為58%以下，較佳為55%以下，較佳為52%以下，較佳為50%以下。該透過率為支持膜與感光性樹脂組合物層之積層體之透過率，不包含保護層。 於本實施形態中，感光性樹脂組合物亦可進而含有雙酚A之環氧化合物類。作為雙酚A之環氧化合物類，例如可列舉利用聚丙二醇修飾雙酚A使末端環氧化而成之化合物等。 於本實施形態中，感光性樹脂組合物亦可進而含有塑化劑。作為塑化劑，例如可列舉：苯二甲酸酯類(例如鄰苯二甲酸二乙酯等)、鄰甲苯磺醯胺、對甲苯磺醯胺、檸檬酸三丁酯、檸檬酸三乙酯、乙醯檸檬酸三乙酯、乙醯檸檬酸三正丙酯、乙醯檸檬酸三正丁酯、聚乙二醇、聚丙二醇、聚乙二醇烷基醚、聚丙二醇烷基醚等。又，亦可列舉：ADEKA NOL SDX-1569、ADEKA NOL SDX-1570、ADEKA NOL SDX-1571、ADEKA NOL SDX-479(以上為旭電化(股)製造)、NEWPOL BP-23P、NEWPOL BP-3P、NEWPOL BP-5P、NEWPOL BPE-20T、NEWPOL BPE-60、NEWPOL BPE-100、NEWPOL BPE-180(以上為三洋化成(股)製造)、Uniol DB-400、Uniol DAB-800、Uniol DA-350F、Uniol DA-400、Uniol DA-700(以上為日本油脂(股)製造)、BA-P4U Glycol、BA-P8 Glycol(以上為日本乳化劑(股)製造)等具有雙酚骨架之化合物。 感光性樹脂組合物中之塑化劑之含量係相對於感光性樹脂組合物之全部固形物成分質量較佳為1質量%～50質量%，更佳為1質量%～30質量%。使該含量為1質量%以上就抑制顯影時間之延遲且對硬化膜賦予柔軟性之觀點而言較佳。另一方面，使該含量為50質量%以下就抑制硬化不足及冷流之觀點而言較佳。 若感光性樹脂組合物中之水分量較多，則會急遽地促進感光性樹脂組合物之局部塑化，從而發生邊緣熔融。就抑制邊緣熔融之觀點而言，以將感光性樹脂組合物調合液塗佈於支持膜並乾燥後之感光性樹脂組合物為基準，感光性樹脂組合物中之水分量較佳為0.7%以下。感光性樹脂組合物中之水分量較佳為0.65%以下，較佳為0.6%以下，較佳為0.55%以下，較佳為0.5%以下，較佳為0.45%以下，較佳為0.4%以下，較佳為0.35%以下，較佳為0.3%以下，較佳為0.25%以下，較佳為0.2%以下。 [溶劑] 感光性樹脂組合物可溶解於溶劑而以感光性樹脂組合物調合液之形態用於感光性樹脂積層體之製造。作為溶劑，可列舉酮類、醇類等。上述酮類係以甲基乙基酮(MEK)、丙酮為代表。上述醇類係以甲醇、乙醇、及異丙醇為代表。於製造感光性樹脂積層體時，溶劑較佳為以塗佈於支持層上之感光性樹脂組合物調合液於25℃下之黏度成為500 mPa・s～4,000 mPa・s般之量添加至感光性樹脂組合物中。 ＜光阻圖案之形成方法＞ 繼而，對使用本實施形態之感光性樹脂積層體製造光阻圖案之方法之一例進行說明。該方法可包括：層壓步驟，其係將感光性樹脂積層體積層於基板；曝光步驟，其係將該感光性樹脂積層體之感光性樹脂層進行曝光；及顯影步驟，其係將該感光性樹脂層之未曝光部分顯影去除。作為光阻圖案，例如可列舉：印刷配線板、半導體元件、印刷版、液晶顯示面板、軟性基板、引線框架基板、COF(chip on film，薄膜覆晶)用基板、半導體封裝用基板、液晶用透明電極、液晶用TFT(thin-film transistor，薄膜電晶體)用配線、PDP(plasma display panel，電漿顯示面板)用電極等圖案。作為一例，如下所述般對印刷配線板之製造方法進行說明。 印刷配線板係經由以下各步驟而製造。 (1)層壓步驟 首先，於層壓步驟中使用貼合機於基板上形成感光性樹脂層。具體而言，於感光性樹脂積層體具有保護層之情形時，將保護層剝離後，利用貼合機將感光性樹脂層加熱壓接於基板表面而進行層壓。作為基板之材料，例如可列舉：銅、不鏽鋼(SUS)、玻璃、氧化銦錫(ITO)等。 於本實施形態中，感光性樹脂層可僅層壓於基板表面之單面，或者視需要亦可層壓於兩面。層壓時之加熱溫度通常為40℃～160℃。又，藉由進行2次以上層壓時之加熱壓接，可提高所獲得之光阻圖案對基板之密接性。於加熱壓接時，可使用具備雙聯輥之二級式貼合機，或者亦可藉由使基板與感光性樹脂層之積層物於輥上重複通過數次而進行壓接。 (2)曝光步驟 於本步驟中，藉由如下之曝光方法將感光性樹脂層進行曝光：使具有所需之配線圖案之光罩膜密接於支持層上並使用活性光源進行之曝光方法；藉由將作為所需之配線圖案之繪圖圖案直接繪圖而進行之曝光方法；或藉由使光罩之圖像透過透鏡進行投影而進行之曝光方法。本實施形態之感光性樹脂組合物之優點於利用繪圖圖案之直接繪圖之曝光方法、或使光罩之圖像透過透鏡而投影之曝光方法中更為顯著，於利用繪圖圖案之直接繪圖之曝光方法中尤為顯著。 (3)顯影步驟 於本步驟中，於曝光後將感光性樹脂層上之支持層剝離，繼而使用鹼性水溶液之顯影液將未曝光部分顯影去除，藉此於基板上形成光阻圖案。 作為鹼性水溶液，使用Na2 CO3 或K2 CO3 之水溶液。鹼性水溶液係根據感光性樹脂層之特性而適當地選擇，較佳為約0.2質量%～約2質量%之濃度且約20℃～約40℃之Na2 CO3 水溶液。 經由上述(1)～(3)之各步驟可獲得光阻圖案。該等步驟後，視情況亦可進而進行約100℃～約300℃之加熱步驟。藉由實施該加熱步驟，可進一步提高耐化學品性。加熱時可使用熱風、紅外線、或遠紅外線方式之加熱爐。又，該加熱步驟亦可於曝光步驟後實施。 (4)蝕刻步驟或鍍覆步驟 對藉由顯影而露出之基板表面(例如銅箔積層板之銅面)進行蝕刻或鍍覆而製造導體圖案。 (5)剝離步驟 其後，利用具有較顯影液強之鹼性之水溶液使光阻圖案自基板剝離。關於剝離用之鹼性水溶液，並無特別限制，較佳為約2質量%～約5質量%之濃度且約40～約70℃之溫度之NaOH或KOH之水溶液。剝離液中亦可添加少量之水溶性溶劑。 本實施形態之感光性樹脂積層體係適合製造印刷配線板、軟性基板、引線框架基板、COF用基板、半導體封裝用基板、液晶用透明電極、液晶用TFT用配線、PDP用電極等導體圖案之感光性樹脂積層體。 再者，關於上述各種參數，只要未特別說明，則依照下述實施例中之測定方法或業者理解與其同等之方法進行測定。 [實施例] 繼而，列舉實施例及比較例更加具體地對本實施形態進行說明。然而，本實施形態只要不脫離其主旨，則不限定於以下實施例。實施例中之物性係藉由以下方法進行測定。 對高分子之物性值之測定、高分子之玻璃轉移溫度之計算、以及實施例及比較例之評價用樣品之製作方法進行說明。又，示出針對所獲得之樣品之評價方法及其評價結果。 (1)物性值之測定或計算 ＜高分子之重量平均分子量或數量平均分子量之測定＞ 高分子之重量平均分子量或數量平均分子量係利用日本分光(股)製造之凝膠滲透層析儀(GPC)(使用利用泵：Gulliver、PU-1580型，管柱：昭和電工(股)製造之Shodex(註冊商標)(KF-807、KF-806M、KF-806M、KF-802.5)4根串聯，移動層溶劑：四氫呋喃、聚苯乙烯標準樣品(昭和電工(股)製造之Shodex STANDARD SM-105)獲得之校準曲線)而以聚苯乙烯換算之形式求出。 進而，高分子之分散度係以重量平均分子量相對於數量平均分子量之比(重量平均分子量/數量平均分子量)之形式算出。 ＜酸當量＞ 於本說明書中，所謂酸當量，意指分子中具有1當量之羧基之聚合物之質量(克)。使用平沼產業(股)製造之平沼自動滴定裝置(COM-555)，使用0.1 mol/L之氫氧化鈉水溶液藉由電位差滴定法測定酸當量。 ＜玻璃轉移溫度Tg之重量平均值Tgtotal ＞ 鹼可溶性高分子之玻璃轉移溫度Tg之重量平均值Tgtotal 係依照下述式所求出之值。 [數1]{式中，Wi 為各鹼可溶性高分子之固形物重量，Tgi 為各鹼可溶性高分子之利用Fox式所求出之玻璃轉移溫度，Wtotal 為各鹼可溶性高分子之合計固形物重量，且n為感光性樹脂組合物中所包含之鹼可溶性高分子之種類之數量} 此處，於求出玻璃轉移溫度Tgi時，作為包含形成對應之鹼可溶性高分子之共聚單體之均聚物的玻璃轉移溫度，使用Brandrup, J. Immergut, E. H.編輯之「Polymer handbook, Third edition, John wiley & sons, 1989, p. 209 Chapter VI 『Glass transition temperatures of polymers』」中所示之值。再者，將於實施例中用於計算之包含各共聚單體之均聚物之玻璃轉移溫度示於表3。 (2)評價用樣品之製作方法 評價用樣品係以如下方式進行製作。 ＜感光性樹脂積層體之製作＞ 將下文所載之表1中所示之成分(其中，各成分之數字表示以固形物成分計之調配量(質量份))及溶劑充分地攪拌、混合而獲得感光性樹脂組合物調合液。將表1中以略號表示之成分之名稱示於下述表2。 作為支持膜，準備表1所示之16 μm厚之聚對苯二甲酸乙二酯膜。各聚對苯二甲酸乙二酯膜中所包含之1.5 μm以上且未達4.5 μm之微粒子之總數係藉由以下方法而求出。 即，使用光學顯微鏡於整個厚度方向上測定聚對苯二甲酸乙二酯膜之一邊5 mm之正方形狀之小片內存在的1.5 μm以上且未達4.5 μm之微粒子之個數。再者，於微粒子並非完全之球體之情形時，將微粒子之最長寬度設為該微粒子之直徑。於聚對苯二甲酸乙二酯膜之面內對任意10處進行該測定，算出其平均值。 使用棒式塗佈機於聚對苯二甲酸乙二酯膜之表面均勻地塗佈該調合液，並於95℃之乾燥機中乾燥2.5分鐘而形成感光性樹脂組合物層。感光性樹脂組合物層之乾燥厚度為25 μm。 繼而，於感光性樹脂組合物層之未積層聚對苯二甲酸乙二酯膜之側之表面上貼合19 μm厚之聚乙烯膜(TAMAPOLY(股)製造，GF-818)作為保護層而獲得感光性樹脂積層體。 ＜基板整面＞ 於實施例1～13及比較例1中，作為圖像性之評價基板，利用軟蝕刻劑(菱江化學(股)製造，CPE-900)對積層有35 μm壓延銅箔之0.4 mm厚之銅箔積層板進行處理，並利用10質量%H2 SO4 將基板表面洗淨。 ＜層壓＞ 一面將感光性樹脂積層體之聚乙烯膜(保護層)剝離，一面利用加熱輥貼合機(旭化成(股)公司製造，AL-700)以輥溫度105℃將感光性樹脂積層體層壓於預熱至60℃之銅箔積層板。氣壓係設為0.35 MPa，層壓速度係設為1.5 m/min。 ＜曝光＞ 利用直接繪圖曝光機(日立Via Mechanics(股)製造，DE-1DH，光源：GaN藍紫二極體，主波長405±5 nm)，使用Stouffer41級階段式曝光表或特定之直接成像(DI)曝光用光罩圖案於照度85 mW/cm2之條件下進行曝光。曝光係以將上述Stouffer41級階段式曝光表作為光罩進行曝光、顯影時之最高殘膜級數成為14級之曝光量而進行。 ＜顯影＞ 將聚對苯二甲酸乙二酯膜(支持層)剝離後，使用鹼顯影機(FUJIKIKO製造，乾式膜用顯影機)，歷時特定時間噴射30℃之1質量%Na2 CO3 水溶液，以最短顯影時間之2倍之時間將感光性樹脂層之未曝光部分溶解去除。此時，將未曝光部分之感光性樹脂層完全溶解所需之最短時間設為最短顯影時間。 ＜線寬(通常)之評價＞ 使用具有曝光部分與未曝光部分之寬度為1：1之比率之線圖案的繪圖資料將層壓後經過2小時後之評價用基板進行曝光。此時，使曝光時之焦點位置對準聚對苯二甲酸乙二酯膜表面。繼而，將聚對苯二甲酸乙二酯膜(支持層)剝離後，以最短顯影時間之2倍之顯影時間進行顯影。而且，利用光學顯微鏡測定L/S＝70 μm/70 μm之圖案之線寬。再者，對5條線進行該測定，測定各線中寬度最寬之部分之線寬，將該5個線寬之平均值作為線寬(通常)之值。 ＜線寬變寬A之評價＞ 使曝光時之焦點位置自聚對苯二甲酸乙二酯膜表面沿該評價基板之厚度方向向基板內側偏移400 μm。除此以外，與上述線寬(通常)之測定相同。而且，將此時之線寬減去上述線寬(通常)所得之值作為線寬變寬A之值。 ＜線寬變寬B之評價＞ 使曝光時之焦點位置自聚對苯二甲酸乙二酯膜表面沿該評價基板之厚度方向向基板內側偏移800 μm。除此以外與上述線寬(通常)之測定相同。而且，將此時之線寬減去上述線寬(通常)所得之值作為線寬變寬B之值。 ＜解像度A之評價＞ 使用具有未曝光部分成為圓孔之圖案之繪圖資料將層壓後經過2小時後之評價用基板進行曝光。此時，使曝光時之焦點位置對準聚對苯二甲酸乙二酯膜表面。繼而，將聚對苯二甲酸乙二酯膜(支持層)剝離後，以最短顯影時間之2倍之顯影時間進行顯影。而且，將未曝光部分之圓孔(32個)全部正常形成之最小之圓孔徑設為解像度A之值。再者，對硬化光阻圖案中於未曝光部分之基板表面無殘留光阻而基板表面露出，亦無自硬化光阻之光阻成分之突起而正常形成之最小之圓孔徑進行評價。作為解像度之值，30 μm以下時使用以2 μm刻紋所獲得之繪圖圖案進行曝光，30 μm以上且50 μm以下時使用以5 μm刻紋所獲得之繪圖圖案進行曝光，50 μm以上時使用以10 μm刻紋所獲得之繪圖圖案進行曝光。再者，未曝光部分成為圓孔之圖案因未曝光部分之周圍被曝光部分包圍而未曝光部分難以顯影，故而為與通常之解像度評價相比非常嚴格之評價。 ＜解像度B之評價＞ 使曝光時之焦點位置自聚對苯二甲酸乙二酯膜表面沿該評價基板之厚度方向向基板內側偏移200 μm。除此以外與上述解像度A之測定相同而評價解像度B。 ＜解像度C之評價＞ 使曝光時之焦點位置自聚對苯二甲酸乙二酯膜表面沿該評價基板之厚度方向向基板內側偏移400 μm。除此以外與上述解像度A之測定相同而評價解像度C。 [表1] [表2] [表3] 自表1及2之結果讀取以下內容。 可知於支持膜之小片中所包含的1.5 μm以上且未達4.5 μm之微粒子之數量以10處平均計為0～200個之實施例1～13中，通常時與聚焦時之解像度之差、即解像度B－解像度A、解像度C－解像度A與微粒子之數量多於200之比較例1相比被抑制得較小，又，線寬變寬A、線寬變寬B亦被抑制得較小。 又，使用1.5 μm以上且未達4.5 μm之微粒子之數量與實施例3相同之16 μm厚之聚對苯二甲酸乙二酯膜(Toray(股)製造，16QS68)，並使用與實施例3相同之感光性樹脂組合物進行評價，結果為與實施例3相同之結果。 再者，關於實施例1，向基板層壓後未觀察到局部之聚對苯二甲酸乙二酯膜之剝離，但關於實施例7，向基板層壓後局部觀察到聚對苯二甲酸乙二酯膜之剝離。若於曝光前支持膜自感光性樹脂組合物層剝離，則有氧氣進入支持膜與感光性樹脂組合物層之間，因該氧氣而即便進行曝光亦產生感光性樹脂組合物之硬化不良之情形。 由實施例與比較例之對比可知：若使用本實施形態之支持膜或感光性樹脂組合物，則即便於曝光時之焦點偏移時，線寬變寬亦較少，且亦可減少解像性變差。藉由使用該聚對苯二甲酸乙二酯膜或感光性樹脂組合物而利用蝕刻法或鍍覆法形成圖案時，即便於基板表面存在凹凸或起伏之情形時，光罩線寬再現性亦良好，可形成無短路不良或缺損、斷線、鍍覆不良等問題之高精細之電路。 以上對本發明之實施形態進行了說明，但本發明不限定於此，可於不脫離發明之主旨之範圍內適當地進行變更。 [產業上之可利用性] 本發明之感光性樹脂積層體由於可抑制曝光時之焦點位置偏移時之線寬變寬或解像度變差，故而即便於因基板之翹曲及變形、曝光裝置之設定不良等而導致曝光時之焦點位置自基板表面偏移時，亦可於藉由蝕刻法形成電路時防止短路問題，於藉由鍍覆法形成電路時防止缺損、斷線、鍍覆不良等問題，又，亦可獲得所需之電路寬度。因此，該感光性樹脂積層體可較佳地用於製造印刷配線板、軟性基板、引線框架基板、COF(薄膜覆晶)用基板、半導體封裝用基板、液晶用透明電極、液晶用TFT用配線、PDP(電漿顯示面板)用電極等導體圖案。Hereinafter, an exemplary embodiment (hereinafter referred to simply as an “embodiment”) for implementing the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with various changes within the scope of the gist thereof. In addition, as for the various measurement values in this specification, unless otherwise specified, the measurement is performed according to the method described in the [Example] of the present disclosure or a method equivalent to that understood by the supplier. [Photosensitive resin laminated body] The photosensitive resin laminated system of the present invention includes a supporting film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the supporting film, of which at any 10 positions of the supporting film When a 5 mm square small piece is cut out, the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in each small piece is 0 to 200 on average at 10 locations. The particles having a diameter of 1.5 μm or more and less than 4.5 μm include primary particles having a diameter of 1.5 μm or more and less than 4.5 μm, and primary particle aggregates having a diameter of 1.5 μm or more and less than 4.5 μm. When the primary particle is not completely spherical, the maximum width of the primary particle is set to the diameter of the primary particle. When the primary particle aggregates are not completely spherical, the maximum width of the primary particle aggregates is set to the diameter of the primary particle aggregates. The photosensitive resin laminated body may have a protective layer on the surface of the photosensitive resin layer opposite to the support layer side, if necessary. With the recent miniaturization and thinning of electronic devices, the demand for high-density wiring, the application of flexible printed wiring boards, and multilayering has increased. In addition, as the multilayering continues, the undulations on the surface become larger, and there is a concern that the resolution becomes worse or the line width reproducibility deteriorates as the focus shifts during exposure. As a result, problems such as short-circuit defects or defects, disconnection, and poor plating, and the problem of failing to form the required copper wires have become increasingly important. The same problems also occur with poor adsorption when exposed on a large substrate, or non-uniform film thickness within a plane. Therefore, the present inventors have found that when focusing on the position of the focus on the surface of the substrate and performing exposure, the position after the focus position is shifted from the surface of the substrate toward the inside of the substrate (relative to the surface described above) The offset amount of the focus position such as the undulation amount is set as a reference value of a very large offset amount), and the design of the photosensitive resin laminated body is effective for solving the above-mentioned problems by designing a difference in line width or a difference in resolution when performing the exposure. If the number of particles of 1.5 μm or more and less than 4.5 μm contained in a small piece of 5 mm on one side of the support film is 0 to 200 on average at any 10 locations, the focus position deviation during exposure can be suppressed When moving, the line width becomes wider or the resolution becomes worse. If the size of the fine particles that affect these properties is 1.5 μm or more and less than 4.5 μm, the performance will not be affected during normal exposure. However, if the exposure method using direct drawing is used, Due to the strain of the substrate or the insufficient adsorption of the substrate to the platform and the unevenness of the substrate surface, the focal point of the exposed portion is shifted, and the effect of the particles on the scattering of light becomes larger. As a result, the line width becomes wider, and the resolvability (especially the extractability) deteriorates. In the case of fine particles of 4.5 μm or more, the resolution is deteriorated even in normal exposure. In the case of particles smaller than 1.5 μm, the line width does not appear to be widened or the resolution is deteriorated even when the focus is shifted during exposure. From the viewpoint of suppressing a wider line width or a worse resolution when the focal position shifts during exposure, the number of particles of 1.5 μm or more and less than 4.5 μm included in the film supporting film is preferably an average of 10 It is 180 or less, preferably 150 or less, preferably 120 or less, preferably 100 or less, more preferably 80 or less, more preferably 50 or less, still more preferably 30 or less, more preferably The number is 20 or less, particularly preferably 15 or less, more preferably 10 or less, and most preferably 6 or less. Further, in terms of excellent adhesion between the support film and the photosensitive resin layer, the number of fine particles of 1.5 μm or more and less than 4.5 μm is preferably one or more. If the support film contains 1 or more particles of 1.5 μm or more and less than 4.5 μm on average at any 10 locations, the sliding property of the supporting film is improved, and peeling of the supporting film can be reduced. If the support film is partially peeled off after lamination to the substrate, oxygen may enter between the support film and the photosensitive resin composition layer, and even if exposure is caused by the oxygen, poor curing of the photosensitive resin composition may occur. The number of fine particles of 1.5 μm or more and less than 4.5 μm in the support film may be 2 or more, 3 or more, 5 or more, 8 or more, or 10 or more. Furthermore, in this application, the number of particles is measured at any 10 locations in the support film. If there are 10 locations that meet the number of particles specified in the technical solution of this application, the photosensitive resin laminate is deemed to be located at this location. Within the scope of the patent application for the invention of the application. That is, even if the predetermined number of particles is not satisfied when the measurement is performed at one of the ten places, the photosensitive resin laminated body is deemed to be an application in the present invention when the predetermined number of particles is satisfied at the other ten measurements. Within the scope of the patent. As the fine particles of 1.5 μm or more and less than 4.5 μm contained in the supporting film, for example, inorganic fine particles or organic fine particles, there are lubricants, aggregates of additives, foreign materials mixed in raw materials, foreign materials mixed in manufacturing steps, and the like. Specific examples of the fine particles include calcium carbonate, calcium phosphate, silicon oxide (silicon dioxide), kaolin, talc, titanium dioxide, alumina (aluminium oxide), barium sulfate, calcium fluoride, Inorganic particles such as lithium fluoride, zeolite, molybdenum sulfide, crosslinked polymer particles, organic particles such as calcium oxalate, and the like. These may be individual or a combination of two or more. The fine particles are prepared in a film according to a conventional method. In order to produce the support film of the present invention, for example, a method of filtering a resin with a filter having a mesh size of 4.5 μm or less can be cited. As the supporting film, a transparent supporting film that transmits light emitted from an exposure light source is preferred. Examples of such a support film include a polyethylene terephthalate film, a polyvinyl alcohol film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyvinylidene chloride film, a vinylidene chloride copolymer film, Polymethyl methacrylate copolymer film, polystyrene film, polyacrylonitrile film, styrene copolymer film, polyamide film, cellulose derivative film, etc. These films can also be extended as needed. As a support film, from the viewpoint of suppressing light scattering during exposure, a haze of 5% or less is preferred, 2% or less is more preferred, 1.5% or less is more preferred, and 1.0% or less is particularly preferred. From the same viewpoint, the surface roughness Ra of the surface in contact with the photosensitive layer is preferably 30 nm or less, more preferably 20 nm or less, and even more preferably 10 nm or less. Regarding the thickness of the film, although the thinner it is, the more advantageous it is in terms of image formation and economy, but in order to maintain the strength of the photosensitive resin laminate, it is preferable to use 10 to 30 μm. In addition, the supporting film may have a single-layer structure or a multi-layer structure in which a resin layer formed of a plurality of types is laminated. In the case of a multilayer structure, an antistatic layer may also be present. In the case of a multilayer structure such as a two-layer structure or a three-layer structure, for example, a resin layer containing fine particles can be formed on one side A, and (1) containing fine particles similar to face A, and (2) containing The surface A has a small amount of fine particles, (3) contains finer particles than the surface A, and (4) has no fine particles. In the case of the structures of (2), (3), and (4), it is preferable to form a photosensitive resin layer on the surface B side. At this time, if a resin layer containing fine particles is present on the surface A side, it is preferable from the viewpoint of the sliding properties of the film. The size of the fine particles at this time is also preferably less than 1.5 μm from the viewpoint of the effect of the present invention. An important characteristic of the protective layer used for the photosensitive resin laminated body is that the adhesion with the photosensitive resin layer is sufficiently smaller than that of the support layer and can be easily peeled off. For example, a polyethylene film or a polypropylene film can be preferably used as the protective layer. In addition, a film having excellent peelability as shown in Japanese Patent Laid-Open No. Sho 59-202457 may be used. The film thickness of the protective layer is preferably 10 μm to 100 μm, and more preferably 10 μm to 50 μm. There is sometimes a gel called fisheye on the surface of the polyethylene film. When a polyethylene film having a fisheye is used as a protective layer, the fisheye may be transferred to a photosensitive resin layer. If the fish eye is transferred to the photosensitive resin layer, air may be trapped during lamination, which may cause voids, which may cause a defect in the photoresist pattern. From the viewpoint of preventing fish eyes, the material of the protective layer is preferably stretched polypropylene. Specific examples include Arufun E-200A manufactured by Oji Paper Co., Ltd. The thickness of the photosensitive resin layer in the photosensitive resin laminate varies depending on the application, preferably 1 μm to 300 μm, more preferably 3 μm to 100 μm, particularly preferably 5 μm to 60 μm, and most preferably 10 μm ~ 30 μm. The thinner the thickness of the photosensitive resin layer, the higher the resolution, and the thicker the film strength. Next, the manufacturing method of the photosensitive resin laminated body is demonstrated. A known method can be adopted as a method of sequentially manufacturing a photosensitive resin laminated body by sequentially stacking a support layer and a photosensitive resin layer, and a protective layer as necessary. For example, a photosensitive resin composition for a photosensitive resin layer can be mixed with a solvent to dissolve the same to prepare a homogeneous solution, firstly coated on a support layer using a bar coater or a roll coater, and then The photosensitive resin layer containing a photosensitive resin composition is laminated | stacked on a support layer by removing the said solvent by drying. Then, if necessary, a photosensitive resin laminate can be produced by laminating a protective layer on the photosensitive resin layer. [Photosensitive resin composition] In this embodiment, the photosensitive resin composition preferably contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) photopolymerization Starting agent. The photosensitive resin composition preferably includes (A) an alkali-soluble polymer: 10% to 90% by mass based on the total solid content of the photosensitive resin composition; (B) having an ethylenically unsaturated double Bonded compounds: 5 to 70% by mass; and (C) Photopolymerization initiator: 0.01 to 20% by mass. Hereinafter, each component is demonstrated sequentially. <(A) Alkali-soluble polymer> In the present disclosure, (A) the alkali-soluble polymer includes a polymer that is easily soluble in an alkaline substance. More specifically, the amount of the carboxyl group contained in the (A) alkali-soluble polymer is 100 to 600, preferably 250 to 450, in terms of acid equivalent. The so-called acid equivalent refers to the mass (unit: gram) of a polymer having one equivalent of a carboxyl group in its molecule. In order to provide the photosensitive resin layer with developability and peelability to an alkaline aqueous solution, (A) the carboxyl group in the alkali-soluble polymer is necessary. Setting the acid equivalent to 100 or more is preferable from the viewpoint of improving development resistance, resolution, and adhesion. Furthermore, it is more preferable that the acid equivalent is 250 or more. On the other hand, making the acid equivalent to 600 or less is preferable from the viewpoint of improving developability and peelability. The acid equivalent is more preferably 450 or less. In the present disclosure, the acid equivalent is a value measured by a potentiometric titration method using a potentiometric titration device and titrated with a 0.1 mol / L aqueous NaOH solution. (A) The weight-average molecular weight of the alkali-soluble polymer is preferably 5,000 to 500,000. A weight average molecular weight of 500,000 or less is preferable from the viewpoint of improving resolution and developability. The weight average molecular weight is more preferably 100,000 or less, the weight average molecular weight is more preferably 60,000 or less, and even more preferably the weight average molecular weight is 50,000 or less. On the other hand, setting the weight average molecular weight to 5,000 or more is preferable from the viewpoints of controlling the properties of the developed aggregates and the properties of the unexposed film such as edge melting properties and cutting chip properties when the photosensitive resin laminate is made. . The weight average molecular weight is more preferably 10,000 or more, and the weight average molecular weight is more preferably 20,000 or more. The so-called edge melting property refers to the degree of exposure of the photosensitive resin layer (that is, the layer containing the photosensitive resin composition) from the end surface of the roll when the photosensitive resin laminate is wound into a roll shape. The so-called cutting fragmentation refers to the degree of flying of the fragments when the unexposed film is cut by a cutter. If the debris adheres to the upper surface of the photosensitive resin laminate, etc., it will be transferred to a photomask in a subsequent exposure step or the like and cause a defective product. (A) The degree of dispersion of the alkali-soluble polymer is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, still more preferably 1.0 to 4.0, and still more preferably 1.0 to 3.0. In this embodiment, the photosensitive resin composition preferably contains a monomer component having an aromatic hydrocarbon group as (A ) Alkali soluble polymer. Examples of such an aromatic hydrocarbon group include a substituted or unsubstituted phenyl group and a substituted or unsubstituted aralkyl group. The content ratio of the monomer component having an aromatic hydrocarbon group in the (A) alkali-soluble polymer is preferably 20% by mass or more, more preferably 40% by mass or more based on the total mass of all the monomer components, and more preferably It is 50% by mass or more, more preferably 55% by mass or more, and most preferably 60% by mass or more. The upper limit is not particularly limited, but is preferably 95% by mass or less, and more preferably 80% by mass or less. In addition, the content ratio of the monomer component which has an aromatic hydrocarbon group when several (A) alkali-soluble polymers are contained is calculated | required as a weight average value. Examples of the monomer having an aromatic hydrocarbon group include a monomer having an aralkyl group, styrene, and a polymerizable styrene derivative (for example, methylstyrene, vinyltoluene, and third butoxybenzene). Ethylene, ethoxylated styrene, 4-vinylbenzoic acid, styrene dimer, styrene terpolymer, etc.). Among them, a monomer having an aralkyl group or styrene is preferred. Examples of the aralkyl group include a substituted or unsubstituted benzyl group (other than a benzyl group), a substituted or unsubstituted benzyl group, and the like, and a substituted or unsubstituted benzyl group is preferred. Examples of the comonomer having a phenalkyl group include phenethyl (meth) acrylate. Examples of the comonomer having a benzyl group include (meth) acrylates having a benzyl group, such as benzyl (meth) acrylate, chlorobenzyl (meth) acrylate, and the like; vinyl monomers having a benzyl group , Such as vinyl benzyl chloride, vinyl benzyl alcohol, and the like. Among these, benzyl (meth) acrylate is preferred. The (A) alkali-soluble polymer containing a monomer component having an aromatic hydrocarbon group is preferably a monomer having an aromatic hydrocarbon group and at least one of the following first monomer and / or the second monomer described below. At least one of them is obtained by polymerization. The (A) alkali-soluble polymer not containing a monomer component having an aromatic hydrocarbon group is preferably obtained by polymerizing at least one of the following first monomers, and more preferably by making the first monomer It is obtained by copolymerizing at least one species with at least one species of the second monomer described below. A monomer having a carboxyl group in the first single-system molecule. Examples of the first monomer include (meth) acrylic acid, fumaric acid, cinnamic acid, butenoic acid, methylene succinic acid, 4-vinylbenzoic acid, maleic anhydride, and cis Butenedioic acid half esters and the like. Among these, (meth) acrylic acid is preferred. In addition, in this specification, the "(meth) acrylic acid" means acrylic acid or methacrylic acid, the "(meth) acrylfluorenyl" means acrylfluorenyl or methacrylfluorenyl, and the so-called "(Meth) acrylate" means "acrylate" or "methacrylate". The copolymerization ratio of the first monomer is preferably 10 to 50% by mass based on the total mass of all the monomer components. Setting the copolymerization ratio to 10% by mass or more is preferable from the viewpoint of exhibiting good developability and controlling the melting of edges, more preferably 15% by mass or more, and still more preferably 20% by mass or more. Setting the copolymerization ratio to 50% by mass or less is preferable from the viewpoint of the high resolution of the photoresist pattern and the shape of the foot portion, and further from the viewpoint of the chemical resistance of the photoresist pattern. It is more preferably 35% by mass or less, still more preferably 30% by mass or less, and even more preferably 27% by mass or less. The second monosystem is a monomer which is non-acidic and has at least one polymerizable unsaturated group in the molecule. Examples of the second monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and n- (meth) acrylate Butyl ester, isobutyl (meth) acrylate, third butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and (meth) acrylic ring (Meth) acrylates such as hexyl ester, 2-ethylhexyl (meth) acrylate; vinyl alcohol esters such as vinyl acetate; and (meth) acrylonitrile. Among these, methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and n-butyl (meth) acrylate are preferred. Containing a monomer having an aralkyl group and / or styrene as a monomer is preferable from the viewpoint of suppressing a wider line width or a lower resolution when the focus position shifts during exposure. For example, a copolymer including methacrylic acid, benzyl methacrylate, and styrene, a copolymer including methacrylic acid, methyl methacrylate, benzyl methacrylate, and styrene are preferable. (A) An alkali-soluble polymer may be used individually by 1 type, and may mix and use 2 or more types. When two or more kinds are mixed and used, it is preferred that two kinds of alkali-soluble polymers containing a monomer component having an aromatic hydrocarbon group are used in combination, or alkali-soluble polymers containing a monomer component having an aromatic hydrocarbon group are used in combination. Molecules and alkali-soluble polymers that do not contain a monomer component having an aromatic hydrocarbon group. In the latter case, the use ratio of the alkali-soluble polymer containing a monomer component having an aromatic hydrocarbon group is preferably 50% by mass or more, more preferably 70% by mass or more, relative to all of the (A) alkali-soluble polymer. It is preferably 80% by mass or more, and more preferably 90% by mass or more. (A) The synthesis of the alkali-soluble polymer is preferably performed by adding to a solution obtained by diluting one or more of the monomers described above with a solvent such as acetone, methyl ethyl ketone, and isopropanol. Appropriate amounts of free radical polymerization initiators such as benzamidine peroxide and azoisobutyronitrile are heated and stirred. There is also a case where a part of the mixture is added dropwise to the reaction solution for synthesis. There may be a case where a solvent is added after the completion of the reaction to adjust to a desired concentration. As the synthesis method, in addition to solution polymerization, block polymerization, suspension polymerization, or emulsion polymerization may be used. (A) Weight average Tg of glass transition temperature Tg of alkali-soluble polymer total It is preferably 30 ° C or higher and 135 ° C or lower. Tg total It is calculated by the method described in the following examples. By using a Tg having a temperature of 135 ° C or lower in the photosensitive resin composition total (A) Alkali-soluble polymer can prevent the line width from being widened or the resolution from deteriorating when the focal position shifts during exposure. From this viewpoint, (A) the Tg of the alkali-soluble polymer total It is more preferably 120 ° C or lower, still more preferably 115 ° C or lower, even more preferably 110 ° C or lower, even more preferably 105 ° C or lower, and even more preferably 110 ° C or lower. In addition, a Tg having a temperature of 30 ° C or higher is used. total The (A) alkali-soluble polymer is preferred from the viewpoint of improving edge melting resistance. From this viewpoint, (A) the Tg of the alkali-soluble polymer total More preferably, it is 40 degreeC or more, More preferably, it is 50 degreeC or more, Most preferably, it is 60 degreeC or more. (A) The ratio of the alkali-soluble polymer to the mass of all solid components of the photosensitive resin composition is preferably in a range of 10% to 90% by mass, more preferably 30% to 70% by mass, and even more preferably 40% to 60% by mass. It is preferable from the viewpoint of controlling the development time that the ratio of the (A) alkali-soluble polymer to the photosensitive resin composition is 90% by mass or less. On the other hand, setting the ratio of the (A) alkali-soluble polymer to the photosensitive resin composition to be 10% by mass or more is preferable from the viewpoint of improving edge melting resistance. <(B) a compound having an ethylenically unsaturated double bond> In terms of hardenability and compatibility with (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond is preferably It includes compounds having a (meth) acrylfluorenyl group in the molecule. The number of (meth) acrylfluorenyl groups in the compound (B) need only be one or more. Examples of the (B) compound having one (meth) acrylfluorenyl group include a compound obtained by adding (meth) acrylic acid to one end of a polyalkylene oxide, or one end of a polyalkylene oxide A compound, a phthalic acid compound, or the like obtained by addition of (meth) acrylic acid and etherification or allyl etherification of the other terminal alkyl group is preferred from the viewpoint of peelability or flexibility of the cured film. Examples of such compounds include phenoxyhexaethylene glycol mono (meth) acrylate, which is a (meth) acrylate of a compound obtained by adding polyethylene glycol to a phenyl group, and 4 of (meth) acrylic acid esters of polypropylene glycol with an average of 2 moles of propylene oxide and polyethylene glycol with an average of 7 moles of ethylene oxide added to nonylphenol -N-nonylphenoxy heptaethylene glycol dipropylene glycol (meth) acrylate, a polypropylene glycol with an average of 1 mol of propylene oxide and an ethylene oxide of an average of 5 mols 4- (n) nonylphenoxypentaethylene glycol (propylene) (meth) acrylate, a (meth) acrylate of a compound obtained by adding polyethylene glycol to nonylphenol, has an average addition of 8 4-N-nonylphenoxy octaethylene glycol (meth) acrylate (e.g. East Asia Synthetic Co., Ltd.) ), M-114), etc. In addition, if γ-chloro-β-hydroxypropyl-β'-methacryloxyethyl-phthalate is included, in addition to the above viewpoints, the viewpoints of sensitivity, resolution, and adhesiveness are included. It is also better. Examples of the compound having two (meth) acrylfluorenyl groups in the molecule include a compound having (meth) acrylfluorenyl groups at both ends of the alkylene oxide chain, or an ethylene oxide chain and propylene oxide. A compound having a (meth) acrylfluorenyl group at both ends of an alkylene oxide chain in which chains are randomly or block-bonded. Examples of such compounds include tetraethylene glycol di (meth) acrylate, pentaethylene glycol di (meth) acrylate, hexaethylene glycol di (meth) acrylate, and heptaethylene glycol di (Meth) acrylate, octaethylene glycol di (meth) acrylate, nonaethylene glycol di (meth) acrylate, decaethylene glycol di (meth) acrylate, 12 mol epoxy Polyethylene glycol (meth) acrylates, etc. of compounds having a (meth) acrylfluorenyl group at both ends of the ethane chain, and polypropylene glycol di (meth) acrylate, polybutylene glycol di (meth) Acrylate, etc. Examples of the polyalkylene oxide di (meth) acrylate compound containing an ethylene oxide group and a propylene oxide group in the compound include two ends of a polypropylene glycol to which an average amount of 12 mol of propylene oxide is added. Dimethacrylates of diols obtained by adding an average of 3 moles of ethylene oxide to the two ends of polypropylene glycol with an average of 18 mols of propylene oxide were added to each end to further add an average of 15 mols. Dimethacrylate of diol made from ethylene oxide, FA-023M, FA-024M, FA-027M (product name, manufactured by Hitachi Chemical Industries), and the like. These are preferable from the viewpoints of flexibility, resolution, and adhesion. As another example of a compound having two (meth) acrylfluorenyl groups in the molecule, a compound having a (meth) acrylfluorene group at both ends is modified by alkylene oxide modification of bisphenol A, and the resolution and From the standpoint of adhesion, it is preferable. Specifically, a compound represented by the following general formula (I) can be used. [Chemical 1] {Wherein R1 and R2 each independently represent a hydrogen atom or a methyl group, and A is C 2 H 4 , B is C 3 H 6 , N1 and n3 are each independently an integer from 1 to 39, and n1 + n3 is an integer from 2 to 40, n2 and n4 are each independently an integer from 0 to 29, and n2 + n4 is an integer from 0 to 30,-(AO)- The arrangement of the repeating units of-and (BO)-may be random or block; and, in the case of block,-(AO)-and-(BO)-may be biphenyl side. } For example, the two ends of bisphenol A are added with an average of 5 moles of ethylene oxide dimethacrylate, and the two ends of bisphenol A are added with an average of 2 Polyethylene glycol dimethacrylate made from Mohr's ethylene oxide, and two polyethylene glycols made from the addition of an average of 1 mole of ethylene oxide to each end of bisphenol A Methacrylate is preferable in terms of resolvability and adhesiveness. In addition, a compound having an aromatic ring having a hetero atom and / or a substituent in the general formula (I) may be used. Examples of the hetero atom include a halogen atom and the like. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an aryl group having 6 to 18 carbon atoms, and benzyl. Fluorenylmethyl, amine, alkyl amine having 1 to 10 carbons, dialkyl amine having 2 to 20 carbons, nitro, cyano, carbonyl, mercapto, alkyl thiol having 1 to 10 carbons, Aryl, hydroxy, hydroxyalkyl with 1 to 20 carbons, carboxyl, carboxyalkyl with 1 to 10 carbons, fluorenyl with 1 to 10 carbons and 1 to 20 carbons Alkoxy, alkoxycarbonyl having 1 to 20 carbons, alkylcarbonyl having 2 to 10 carbons, alkenyl having 2 to 10 carbons, N-alkylamine formamyl having 2 to 10 carbons or including A heterocyclic group, or an aryl group substituted with such a substituent. These substituents may form a condensed ring, or a hydrogen atom in the substituent may be substituted with a hetero atom such as a halogen atom. When the aromatic ring in the general formula (I) has a plurality of substituents, the plurality of substituents may be the same or different. A compound having three or more (meth) acrylfluorenyl groups in the molecule is obtained by having, as a central skeleton, a group capable of adding 3 mol or more of an epoxy alkyl group in the molecule, so that It is obtained by adding an alkoxy group such as ethoxy group, propyloxy group, and butyloxy group to obtain an alcohol, and the alcohol is converted into a (meth) acrylate. In this case, examples of compounds that can serve as a central skeleton include glycerol, trimethylolpropane, pentaerythritol, di-pentaerythritol, and an isocyanurate ring. Examples of such compounds include tri (meth) acrylates, for example, ethoxylated glycerol tri (meth) acrylate, ethoxylated isotricyanate tri (meth) acrylate, and pentaerythrium Sugar alcohol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate (e.g. trimethacrylate obtained by adding an average of 21 moles of ethylene oxide to trimethylolpropane, Trimethacrylate obtained by adding trimethylolpropane to an average of 30 moles of ethylene oxide is preferred from the viewpoints of flexibility, adhesion, and suppression of bleeding); etc .; tetra (meth) acrylate , Such as di-trimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, di-pentaerythritol tetra (meth) acrylate, etc .; penta (methyl) ) Acrylate, such as di-pentaerythritol penta (meth) acrylate, etc .; hexa (meth) acrylate, such as di-pentaerythritol hexa (meth) acrylate, etc. A compound having three or more (meth) acrylfluorenyl groups is preferable from the viewpoints of resolvability, adhesion, and shape of a photoresist foot part, and a compound having three or more methacrylfluorenyl groups is more preferable. As the tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate is preferred. Pentaerythritol tetra (meth) acrylate may be tetrakis (meth) acrylate, etc., having a total of 1 to 40 moles of alkylene oxide added to the four terminals of pentaerythritol. The hexa (meth) acrylate is preferably a hexa (meth) acrylate having a total of 1 to 40 moles of ethylene oxide added to the 6 ends of di-pentaerythritol, and Pentaerythritol has 6 (meth) acrylic acid esters at a total of 1 to 20 mol of ε-caprolactone at the 6 terminals. The (meth) acrylate compounds described above can be used individually or in combination. The photosensitive resin composition may contain other compounds as (B) a compound having an ethylenically unsaturated bond. Examples of the other compounds include a (meth) acrylate having a urethane bond, a compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol, and an α, β-unsaturated carboxylic acid A compound obtained by reacting with a glycidyl group-containing compound, 1,6-hexanediol di (meth) acrylate, and the like. (B) The ratio of the compound having an ethylenically unsaturated double bond to the mass of the entire solid content of the photosensitive resin composition is preferably 5 to 70% by mass. It is preferable to set this ratio to 5 mass% or more from a viewpoint of sensitivity, resolution, and adhesiveness. The ratio is more preferably 20% by mass or more, and even more preferably the ratio is 30% by mass or more. On the other hand, setting the ratio to 70% by mass or less is preferable from the viewpoint of suppressing the peeling delay of edge melting and hardening photoresist. The ratio is more preferably 50% by mass or less. <(C) Photopolymerization initiator> (C) A photopolymerization initiator is a compound which polymerizes a monomer by light. The photosensitive resin composition contains a compound generally known in the art as a (C) photopolymerization initiator. The total content of the (C) photopolymerization initiator in the photosensitive resin composition is preferably 0.01 to 20% by mass, more preferably 0.05 to 10% by mass, and still more preferably 0.1 to 7% by mass. It is particularly preferably within a range of 0.1% to 6% by mass. From the viewpoint of obtaining sufficient sensitivity, the total content of the (C) photopolymerization initiator is preferably 0.01% by mass or more. From the viewpoint of sufficiently transmitting light to the bottom surface of the photoresist to obtain good high resolution. In other words, it is preferably 20% by mass or less. Examples of the (C) photopolymerization initiator include quinones, aromatic ketones, acetophenones, fluorenylphosphine oxides, benzoin or benzoin ethers, dialkyl ketals, and 9- Oxygen &#134079; Type, dialkylaminobenzoates, oxime esters, acridines (e.g. 9-phenylacridine, bisacridylheptane, 9- (p-methylphenyl) acridine, 9- ( M-methylphenyl) acridine is preferred in terms of sensitivity, resolution, and adhesion), and further includes hexaarylbiimidazole, pyrazoline compounds, and anthracene compounds (for example, 9,10-dibutoxy Anthracene, 9,10-diethoxyanthracene are preferred in terms of sensitivity, resolution, and adhesion), coumarin compounds (e.g., 7-diethylamino-4-methylcoumarin Sensitivity, resolution, and adhesion are preferred), N-arylamino acid or an ester compound thereof (e.g., N-phenylglycine is better in terms of sensitivity, resolution, and adhesion Preferred), and halogen compounds (such as tribromomethylphenylphosphonium). These can be used individually by 1 type or in combination of 2 or more types. Alternatively, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1- (4-methylthienyl) -2-morpholinylpropane may be used. 1-one, 2,4,6-trimethylbenzylidene-diphenyl-phosphine oxide, triphenylphosphine oxide. Examples of the aromatic ketones include benzophenone, Michelin [4,4'-bis (dimethylamino) benzophenone], and 4,4'-bis (diethylamino). Benzophenone, 4-methoxy-4'-dimethylaminobenzophenone. These can be used individually by 1 type or in combination of 2 or more types. Among these, 4,4'-bis (diethylamino) benzophenone is preferable from a viewpoint of adhesiveness. Furthermore, from the viewpoint of transmittance, the content of the aromatic ketones in the photosensitive resin composition is preferably in a range of 0.01% by mass to 0.5% by mass, and more preferably in a range of 0.02% by mass to 0.3% by mass. Examples of hexaarylbiimidazole include 2- (o-chlorophenyl) -4,5-diphenylbiimidazole, 2,2 ', 5-tri- (o-chlorophenyl) -4- ( 3,4-dimethoxyphenyl) -4 ', 5'-diphenylbiimidazole, 2,4-bis- (o-chlorophenyl) -5- (3,4-dimethoxyphenyl) ) -Diphenylbiimidazole, 2,4,5-tri- (o-chlorophenyl) -diphenylbiimidazole, 2- (o-chlorophenyl) -bis-4,5- (3,4-di (Methoxyphenyl) -biimidazole, 2,2'-bis- (2-fluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,3-difluoromethylphenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'- Bis- (2,4-difluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,5- Difluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,6-difluorophenyl) -4 , 4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,3,4-trifluorophenyl) -4,4', 5 , 5'-tetra- (3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,3,5-trifluorophenyl) -4,4 ', 5,5'-tetra -(3-methoxyphenyl) -biimidazole, 2,2'-bis- (2,3,6-trifluorophenyl) -4,4 ', 5,5'-tetra- (3-methyl (Oxyphenyl) -biimidazole, 2,2'-bis- (2,4,5-trifluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxy (Phenyl) -biimidazole, 2,2'-bis- (2,4,6-trifluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -bi Imidazole, 2,2'-bis- (2,3,4,5-tetrafluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, 2 , 2'-bis- (2,3,4,6-tetrafluorophenyl) -4,4 ', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, and 2,2 '-Bis- (2,3,4,5,6-pentafluorophenyl) -4,4', 5,5'-tetra- (3-methoxyphenyl) -biimidazole, etc .; these may These are used individually by 1 type or in combination of 2 or more types. From the viewpoints of high sensitivity, resolution, and adhesion, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer is preferred. In this embodiment, from the viewpoint of improving the peeling characteristics and / or sensitivity of the photosensitive resin layer, the content of the hexaarylbiimidazole compound in the photosensitive resin composition is preferably from 0.05% by mass to 7% by mass, More preferably, it is in the range of 0.1 to 6% by mass, and more preferably in the range of 1 to 5% by mass. From the standpoint of the peeling characteristics or sensitivity, resolution, and adhesion of the photosensitive resin layer, the photosensitive resin composition preferably also contains a pyrazoline compound as a photosensitizer. As the pyrazoline compound, from the above viewpoint, for example, 1-phenyl-3- (4-third-butyl-styryl) -5- (4-third-butyl-benzene) can be preferably mentioned. ) -Pyrazoline, 1- (4- (benzoxazol-2-yl) phenyl) -3- (4-third-butyl-styryl) -5- (4-third-butyl -Phenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) -5- (4-third butyl-phenyl) -pyrazoline, 1-phenyl-3- (4 -Biphenyl) -5- (4-third octyl-phenyl) -pyrazoline, 1-phenyl-3- (4-isopropylstyryl) -5- (4-isopropylbenzene ) -Pyrazoline, 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (3 , 5-dimethoxystyryl) -5- (3,5-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (3,4-dimethoxystyryl ) -5- (3,4-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2,6-dimethoxystyryl) -5- (2,6-di (Methoxyphenyl) -pyrazoline, 1-phenyl-3- (2,5-dimethoxystyryl) -5- (2,5-dimethoxyphenyl) -pyrazoline 1-phenyl-3- (2,3-dimethoxystyryl) -5- (2,3-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2 , 4-dimethoxystyryl) -5- (2,4-dimethoxyphenyl) -pyridine Morpholine and so on. Among these, 1-phenyl-3- (4-biphenyl) -5- (4-third butyl-phenyl) -pyrazoline is more preferable. In this embodiment, from the viewpoint of improving the peeling characteristics and / or sensitivity of the photosensitive resin layer, the content of the photosensitizer in the photosensitive resin composition is preferably from 0.05% by mass to 5% by mass, and more preferably It is in the range of 0.1% by mass to 3% by mass. <(D) Phenol Derivative> In the present embodiment, the photosensitive resin composition preferably further contains (D) a phenol derivative. Examples of the (D) phenol-based derivative include p-methoxyphenol, hydroquinone, pyrogallol, tert-butylcatechol, and 2,6-di-tert-butyl-p-methylol. Phenol, 2,2'-methylenebis (4-methyl-6-tert-butylphenol), 2,2'-methylenebis (4-ethyl-6-tert-butylphenol), 2,6-di-tert-butyl-4-methylphenol, 2,5-di-tert-pentylhydroquinone, 2,5-di-tert-butylhydroquinone, 2,2 '-Methylenebis (4-methyl-6-tert-butylphenol), bis (2-hydroxy-3-tert-butyl-5-ethylphenyl) methane, triethylene glycol-bis [ 3- (3-Third-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [3- (3,5-di-third-butyl- 4-hydroxyphenyl) propionate], pentaerythritol-tetrakis [3- (3,5-di-tertiarybutyl-4-hydroxyphenyl) propionate], 2,2-thio-diphenylene Ethylbis [3- (3,5-di-third-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-third-butyl-4- Hydroxyphenyl) propionate, N, N'-hexamethylenebis (3,5-di-third-butyl-4-hydroxy-hydrocinnamidine), 3,5-di-third-butyl 4-hydroxybenzyl phosphonate-diethyl ester, 1,3,5-trimethyl-2,4,6-tri (3,5-di-third-butyl- 4-hydroxybenzyl) benzene, tri- (3,5-di-third-butyl-4-hydroxybenzyl) -isocyanurate, 4,4'-thiobis (6-third-butyl) -M-cresol), 4,4'-butylenebis (3-methyl-6-third butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-third Butylphenyl) butane, styrenated phenol (for example, manufactured by Kawaguchi Chemical Industry Co., Ltd., Antage SP), tribenzylphenol (for example, manufactured by Kawaguchi Chemical Industry Co., Ltd., TBP) Phenol), biphenol and the like. Containing a (D) phenol-based derivative is preferable from the viewpoint of suppressing a wider line width or a lower resolution when the focus position shifts during exposure, and from the same viewpoint, a hindered phenol or biphenol is preferred. . From the same viewpoint, the phenol derivative (D) is preferably a phenol core having two or more cores. (D) The ratio of the phenol-based derivative to the mass of the entire solid content of the photosensitive resin composition is preferably 0.001% by mass to 10% by mass. From the viewpoint of suppressing wider line width or poor resolution when the focus position shifts during exposure, the ratio is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and still more preferably 0.01% by mass. Above, more preferably 0.05% by mass or more, particularly preferably 0.1% by mass or more. On the other hand, in terms of a small decrease in sensitivity and an improvement in resolution, the ratio is preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less. It is 2% by mass or less, and most preferably 1.5% by mass or less. <Additives> The photosensitive resin composition may contain additives, such as a dye, a plasticizer, an antioxidant, and a stabilizer, as needed. For example, additives listed in Japanese Patent Laid-Open No. 2013-156369 can be used. (Dye and Coloring Substance) In this embodiment, the photosensitive resin composition may further contain at least one selected from the group consisting of a dye (for example, a leuco dye, a fluorescent yellow parent dye, and the like) and a coloring substance as necessary. Species. Examples of the coloring substance include poinsettia, phthalocyanine green, golden amine base, paramagenta, crystal violet, methyl orange, Nile Blue 2B, Victoria blue, and malachite green (e.g., Aizen manufactured by Hodogaya Chemical Co., Ltd.) (Registered trademark) MALACHITE GREEN), basic blue 20, diamond green (for example, Aizen (registered trademark) DIAMOND GREEN GH manufactured by Hodogaya Chemical Co., Ltd.). The content of the coloring substance in the photosensitive resin composition is preferably 0.001% by mass to 1% by mass when the mass of the entire solid content of the photosensitive resin composition is 100% by mass. The content is preferably 0.001% by mass or more from the viewpoint of improving the handleability of the photosensitive resin composition. On the other hand, the content is preferably 1% by mass or less from the viewpoint of maintaining the storage stability of the photosensitive resin composition. The photosensitive resin composition develops a color in the exposed portion by containing a dye, so it is better in terms of visibility, and when the position alignment mark for exposure is read by an inspection machine or the like, the exposed portion and the When the contrast of the exposed part is large, it is easy to identify and advantageous. Preferable dyes from this viewpoint include leuco dyes and fluorescent yellow parent dyes. Examples of the leuco dye include tris (4-dimethylaminophenyl) methane [crypto crystal violet], bis (4-dimethylaminophenyl) phenylmethane [leuco malachite green], and the like. In particular, from the viewpoint of good contrast, it is preferable to use leuco crystal violet as the leuco dye. The content of the leuco dye in the photosensitive resin composition is preferably from 0.1% by mass to 10% by mass based on the mass of the entire solid component content of the photosensitive resin composition. The content is preferably 0.1% by mass or more from the viewpoint of making the contrast between the exposed portion and the unexposed portion good. The content is more preferably 0.2% by mass or more, and even more preferably 0.4% by mass or more. On the other hand, the content is preferably 10% by mass or less from the viewpoint of maintaining storage stability. The content is more preferably 5 mass% or less, and even more preferably 2 mass% or less. In addition, the use of a leuco dye in the photosensitive resin composition in combination with the above-mentioned halogen compound in the (C) photopolymerization initiator is preferred from the viewpoint of optimizing adhesion and contrast. When a leuco dye is used in combination with the halogen compound, the content of the halogen compound in the photosensitive resin composition is 0.01% by mass to 100% by mass of the total solid component content of the photosensitive resin composition. 3% by mass is preferable from the viewpoint of maintaining the storage stability of the hue in the photosensitive layer. (Other additives) In order to improve thermal stability and storage stability, the photosensitive resin composition may further contain at least one selected from the group consisting of a radical polymerization inhibitor, benzotriazoles, and carboxybenzotriazoles. 1 compound. Examples of the radical polymerization inhibitor include naphthylamine, cuprous chloride, aluminum nitrosophenylhydroxylamine, and diphenylnitrosamine. In order not to damage the sensitivity of the photosensitive resin composition, an aluminum nitrosophenylhydroxylamine salt is preferred. Examples of the benzotriazoles include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, and bis (N-2-ethylhexyl) amino Methyl-1,2,3-benzotriazole, bis (N-2-ethylhexyl) aminomethylene-1,2,3-toluotriazole, bis (N-2-hydroxyethyl) ) Aminomethylene-1,2,3-benzotriazole and the like. Examples of the carboxybenzotriazoles include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, N- (N, N-di 2-ethylhexyl) aminomethylenecarboxybenzotriazole, N- (N, N-di-2-hydroxyethyl) aminomethylenecarboxybenzotriazole, N- (N, N -Di-2-ethylhexyl) aminoethylethylcarboxybenzotriazole and the like. When the total content of the radical polymerization inhibitor, benzotriazoles, and carboxybenzotriazoles is 100% by mass, the total solid content of the photosensitive resin composition is preferably 0.01% to 3% by mass. , More preferably from 0.05% by mass to 1% by mass. The content is preferably 0.01% by mass or more from the viewpoint of imparting storage stability to the photosensitive resin composition. On the other hand, the content is preferably 3% by mass or less from the viewpoint of maintaining sensitivity and suppressing discoloration of the dye. Decoloration of the dye can be measured using a transmittance at a wavelength of 630 nm. A higher transmittance at a wavelength of 630 nm indicates dye discoloration. The transmittance at a wavelength of 630 nm of the laminated body of the support film and the photosensitive resin composition layer is preferably 80% or less, preferably 78% or less, preferably 75% or less, preferably 72% or less, and more preferably 70% or less, 68% or less, 65% or less, 62% or less, 60% or less, 58% or less, 55% or less, preferably 52% or less, preferably 50% or less. This transmittance is the transmittance of a laminate of a support film and a photosensitive resin composition layer, and does not include a protective layer. In this embodiment, the photosensitive resin composition may further contain an epoxy compound of bisphenol A. Examples of the epoxy compounds of bisphenol A include compounds obtained by modifying bisphenol A with polypropylene glycol and epoxidizing the terminals. In this embodiment, the photosensitive resin composition may further contain a plasticizer. Examples of the plasticizer include phthalates (for example, diethyl phthalate), o-tosylamide, p-toluenesulfonamide, tributyl citrate, triethyl citrate, Ethyl triethyl citrate, tri-n-propyl ethyl citrate, tri-n-butyl ethyl citrate, polyethylene glycol, polypropylene glycol, polyethylene glycol alkyl ether, polypropylene glycol alkyl ether, and the like. In addition, ADEKA NOL SDX-1569, ADEKA NOL SDX-1570, ADEKA NOL SDX-1571, ADEKA NOL SDX-479 (the above are manufactured by Asahi Kasei Corporation), NEWPOL BP-23P, NEWPOL BP-3P, NEWPOL BP-5P, NEWPOL BPE-20T, NEWPOL BPE-60, NEWPOL BPE-100, NEWPOL BPE-180 (the above are manufactured by Sanyo Chemical Co., Ltd.), Uniol DB-400, Uniol DAB-800, Uniol DA-350F, Compounds having a bisphenol skeleton, such as Uniol DA-400, Uniol DA-700 (above, manufactured by Nippon Oil & Fat Co., Ltd.), BA-P4U Glycol, BA-P8 Glycol (above, manufactured by Japan Emulsifier (Co.)). The content of the plasticizer in the photosensitive resin composition is preferably 1% by mass to 50% by mass, and more preferably 1% by mass to 30% by mass with respect to the mass of the total solid component content of the photosensitive resin composition. Setting the content to 1% by mass or more is preferable from the viewpoint of suppressing the delay of the development time and imparting flexibility to the cured film. On the other hand, the content is preferably 50% by mass or less from the viewpoint of suppressing insufficient hardening and cold flow. If the moisture content in the photosensitive resin composition is large, local plasticization of the photosensitive resin composition is rapidly promoted, and edge melting occurs. From the viewpoint of suppressing edge melting, based on the photosensitive resin composition in which the photosensitive resin composition preparation liquid is applied to a support film and dried, the water content in the photosensitive resin composition is preferably 0.7% or less. . The moisture content in the photosensitive resin composition is preferably 0.65% or less, preferably 0.6% or less, preferably 0.55% or less, more preferably 0.5% or less, preferably 0.45% or less, and preferably 0.4% or less. It is preferably 0.35% or less, preferably 0.3% or less, more preferably 0.25% or less, and more preferably 0.2% or less. [Solvent] The photosensitive resin composition can be dissolved in a solvent and used for the production of a photosensitive resin laminate in the form of a photosensitive resin composition preparation solution. Examples of the solvent include ketones and alcohols. The ketones are typified by methyl ethyl ketone (MEK) and acetone. The alcohols are typified by methanol, ethanol, and isopropanol. When manufacturing a photosensitive resin laminate, the solvent is preferably added to the photosensitive resin in such an amount that the viscosity of the photosensitive resin composition blend solution applied on the support layer becomes 500 mPa · s to 4,000 mPa · s at 25 ° C. Sex resin composition. <Method for Forming Photoresist Pattern> Next, an example of a method for producing a photoresist pattern using the photosensitive resin laminate of this embodiment will be described. The method may include: a laminating step of layering a photosensitive resin layer on a substrate; an exposing step of exposing the photosensitive resin layer of the photosensitive resin layered body; and a developing step of exposing the photosensitive resin layer The unexposed portion of the flexible resin layer is removed by development. Examples of the photoresist pattern include a printed wiring board, a semiconductor element, a printing plate, a liquid crystal display panel, a flexible substrate, a lead frame substrate, a substrate for COF (chip on film), a substrate for semiconductor packaging, and a liquid crystal. Patterns such as transparent electrodes, wirings for thin-film transistors (thin-film transistors) for liquid crystals, and electrodes for plasma display panels (PDP). As an example, the manufacturing method of a printed wiring board is demonstrated as follows. The printed wiring board is manufactured through the following steps. (1) Laminating step First, in the laminating step, a photosensitive resin layer is formed on a substrate using a laminator. Specifically, when the photosensitive resin laminated body has a protective layer, the protective layer is peeled off, and then the photosensitive resin layer is heated and pressure-bonded to the substrate surface by a laminator to be laminated. Examples of the material of the substrate include copper, stainless steel (SUS), glass, and indium tin oxide (ITO). In this embodiment, the photosensitive resin layer may be laminated on only one side of the substrate surface, or may be laminated on both sides if necessary. The heating temperature during lamination is usually 40 ° C to 160 ° C. In addition, the heat-pressure bonding during lamination of two or more times can improve the adhesion of the obtained photoresist pattern to the substrate. In the case of thermal compression bonding, a two-stage laminator equipped with a double roller may be used, or the laminated material of the substrate and the photosensitive resin layer may be repeatedly pressed on the roller for several times to perform the pressure bonding. (2) Exposure step In this step, the photosensitive resin layer is exposed by the following exposure method: an exposure method in which a mask film having a desired wiring pattern is closely adhered to a support layer and an active light source is used; An exposure method performed by directly drawing a drawing pattern as a desired wiring pattern; or an exposure method performed by projecting an image of a photomask through a lens. The advantages of the photosensitive resin composition of this embodiment are more significant in an exposure method using direct drawing using a drawing pattern or an exposure method in which an image of a photomask is projected through a lens, and in the exposure using direct drawing using a drawing pattern. This method is particularly significant. (3) Development step In this step, the support layer on the photosensitive resin layer is peeled off after exposure, and then the unexposed portion is developed and removed using a developing solution of an alkaline aqueous solution, thereby forming a photoresist pattern on the substrate. As an alkaline aqueous solution, use Na 2 CO 3 Or K 2 CO 3 Of an aqueous solution. The alkaline aqueous solution is appropriately selected depending on the characteristics of the photosensitive resin layer, and is preferably a concentration of about 0.2% to about 2% by mass and Na of about 20 ° C to about 40 ° C. 2 CO 3 Aqueous solution. A photoresist pattern can be obtained through each of the steps (1) to (3) above. After these steps, a heating step of about 100 ° C to about 300 ° C may be further performed as appropriate. By implementing this heating step, chemical resistance can be further improved. When heating, a hot air, infrared, or far-infrared heating furnace can be used. The heating step may be performed after the exposure step. (4) Etching step or plating step The substrate surface exposed by development (for example, the copper surface of a copper foil laminate) is etched or plated to produce a conductor pattern. (5) Peeling step After that, the photoresist pattern is peeled from the substrate using an aqueous solution having an alkali stronger than the developing solution. The alkaline aqueous solution for peeling is not particularly limited, but is preferably an aqueous solution of NaOH or KOH at a concentration of about 2% to about 5% by mass and a temperature of about 40 to about 70 ° C. A small amount of a water-soluble solvent may be added to the peeling solution. The photosensitive resin multilayer system of this embodiment is suitable for the production of printed wiring boards, flexible substrates, lead frame substrates, substrates for COF, substrates for semiconductor packaging, transparent electrodes for liquid crystal, TFT wiring for liquid crystal, and electrodes for PDP. Resin laminate. In addition, as for the above-mentioned various parameters, unless otherwise specified, the measurement is performed in accordance with the measurement method in the following examples or a method equivalent to that understood by the supplier. [Examples] Next, the present embodiment will be described more specifically with reference to examples and comparative examples. However, this embodiment is not limited to the following examples as long as it does not deviate from the gist thereof. The physical properties in the examples were measured by the following methods. The measurement of the physical property value of the polymer, the calculation of the glass transition temperature of the polymer, and the method for preparing the samples for evaluation in Examples and Comparative Examples will be described. In addition, the evaluation methods and the evaluation results of the obtained samples are shown. (1) Measurement or calculation of physical property value <Measurement of weight average molecular weight or number average molecular weight of a polymer> Weight average molecular weight or number average molecular weight of a polymer is a gel permeation chromatography (GPC) manufactured by JASCO Corporation ) (Using pump: Gulliver, PU-1580 type, column: Shodex (registered trademark) (KF-807, KF-806M, KF-806M, KF-802.5) manufactured by Showa Denko Co., Ltd.) Layer solvent: Tetrahydrofuran, polystyrene standard sample (calibration curve obtained by Shodex STANDARD SM-105, manufactured by Showa Denko Corporation) was calculated in terms of polystyrene. Furthermore, the degree of dispersion of the polymer is calculated as the ratio of the weight average molecular weight to the number average molecular weight (weight average molecular weight / number average molecular weight). <Acid equivalent> In this specification, the term "acid equivalent" means the mass (g) of a polymer having 1 equivalent of a carboxyl group in a molecule. An Hiranuma automatic titration device (COM-555) manufactured by Hiranuma Sangyo Co., Ltd. was used, and an acid equivalent was measured by a potentiometric titration method using a 0.1 mol / L sodium hydroxide aqueous solution. <Weight average Tg of glass transition temperature Tg total ＞ Alkali soluble polymer glass transition temperature Tg weight average Tg total It is a value calculated | required according to the following formula. [Number 1] {Where W i Solid weight of each alkali-soluble polymer, Tg i It is the glass transition temperature of each alkali-soluble polymer obtained by using Fox formula, W total Is the total solids weight of each alkali-soluble polymer, and n is the number of types of alkali-soluble polymers contained in the photosensitive resin composition} Here, when the glass transition temperature Tgi is obtained, it is included as a correspondence The glass transition temperature of the homopolymer of a comonomer of an alkali-soluble polymer is used in Brand handbook, Third edition, John Wiley & sons, 1989, p. 209, edited by Brandrup, J. Immergut, EH, Chapter 『Glass transition temperatures of polymers "". Moreover, the glass transition temperature of the homopolymer containing each comonomer used for calculation in an Example is shown in Table 3. (2) Preparation method of evaluation sample The evaluation sample was prepared as follows. <Production of Photosensitive Resin Laminate> The components shown in Table 1 described below (where the number of each component represents the compounding amount (parts by mass) as a solid content component) and the solvent are sufficiently stirred and mixed to A photosensitive resin composition preparation liquid was obtained. The names of the components indicated by abbreviations in Table 1 are shown in Table 2 below. As a supporting film, a 16 μm-thick polyethylene terephthalate film shown in Table 1 was prepared. The total number of fine particles of 1.5 μm or more and less than 4.5 μm contained in each polyethylene terephthalate film was determined by the following method. That is, the number of fine particles existing in a square piece of 5 mm on one side of a polyethylene terephthalate film with a thickness of 1.5 μm or more and less than 4.5 μm was measured in the entire thickness direction using an optical microscope. When the fine particles are not completely spherical, the longest width of the fine particles is set to the diameter of the fine particles. This measurement was performed in 10 arbitrary places in the surface of a polyethylene terephthalate film, and the average value was calculated. This blend solution was uniformly coated on the surface of a polyethylene terephthalate film using a bar coater, and dried in a dryer at 95 ° C. for 2.5 minutes to form a photosensitive resin composition layer. The dry thickness of the photosensitive resin composition layer was 25 μm. Next, a 19 μm-thick polyethylene film (manufactured by TAMAPOLY Co., Ltd., GF-818) was laminated on the surface of the side of the non-laminated polyethylene terephthalate film of the photosensitive resin composition layer as a protective layer. A photosensitive resin laminate was obtained. <The entire surface of the substrate> In Examples 1 to 13 and Comparative Example 1, as a substrate for evaluating the imageability, a soft etchant (manufactured by Lingjiang Chemical Co., Ltd., CPE-900) was used to laminate 35 μm rolled copper foil to the laminate. 0.4 mm thick copper foil laminated board for processing and use 10% by mass of H 2 SO 4 Wash the substrate surface. <Lamination> While peeling the polyethylene film (protective layer) of the photosensitive resin laminate, the photosensitive resin was laminated at a roll temperature of 105 ° C. using a heated roll laminator (manufactured by Asahi Kasei Corporation, AL-700). The body was laminated on a copper foil laminated board preheated to 60 ° C. The air pressure is set to 0.35 MPa, and the lamination speed is set to 1.5 m / min. <Exposure> Using a direct drawing exposure machine (manufactured by Hitachi Via Mechanics, Ltd., DE-1DH, light source: GaN blue-violet diode, dominant wavelength 405 ± 5 nm), using Stouffer 41 stage exposure meter or specific direct imaging (DI) The photomask pattern for exposure is exposed under the condition of 85 mW / cm2 illumination. The exposure was performed by using the Stouffer 41-stage stepwise exposure meter as a mask to perform exposure, and the highest residual film level during development was an exposure amount of 14 steps. <Development> After peeling the polyethylene terephthalate film (supporting layer), an alkali developing machine (manufactured by FUJIKIKO, developing machine for dry film) was used, and 1% by mass of Na at 30 ° C was sprayed for a specific time. 2 CO 3 The aqueous solution dissolves and removes the unexposed portion of the photosensitive resin layer in a time that is twice the minimum development time. At this time, the shortest time required for the photosensitive resin layer in the unexposed portion to be completely dissolved is set as the shortest developing time. <Evaluation of Line Width (Normal)> Using the drawing data of a line pattern having a ratio of 1: 1 between the exposed portion and the unexposed portion, the evaluation substrate after 2 hours after lamination was exposed. At this time, the focal position at the time of exposure was aligned with the surface of the polyethylene terephthalate film. Then, after the polyethylene terephthalate film (support layer) was peeled off, development was performed with a development time which was twice the shortest development time. Furthermore, the line width of the pattern of L / S = 70 μm / 70 μm was measured with an optical microscope. The measurement was performed on five lines, and the line width of the widest portion of each line was measured. The average value of the five line widths was used as the line width (normal) value. <Evaluation of Line Width Widening A> The focal position at the time of exposure was shifted from the surface of the polyethylene terephthalate film to the inside of the substrate by 400 μm in the thickness direction of the evaluation substrate. Other than that, it is the same as the above-mentioned measurement of the line width (normal). Further, the value obtained by subtracting the line width (usually) from the line width at this time is taken as the value of the line width widening A. <Evaluation of Line Width Widening B> The focal position at the time of exposure was shifted from the surface of the polyethylene terephthalate film to the inside of the substrate by 800 μm in the thickness direction of the evaluation substrate. Otherwise, it is the same as the above-mentioned measurement of the line width (normal). A value obtained by subtracting the line width (usually) from the line width at this time is taken as the value of the line width B. <Evaluation of Resolution A> Using a drawing material having a pattern in which an unexposed portion becomes a circular hole, the evaluation substrate after 2 hours has elapsed after lamination is exposed. At this time, the focal position at the time of exposure was aligned with the surface of the polyethylene terephthalate film. Then, after the polyethylene terephthalate film (support layer) was peeled off, development was performed with a development time which was twice the shortest development time. In addition, the smallest circular aperture in which all the circular holes (32) in the unexposed portion are normally formed is set to the value of the resolution A. In addition, the smallest circular aperture normally formed in the hardened photoresist pattern on the surface of the substrate in the unexposed portion without any remaining photoresist and the substrate surface being exposed, and without protrusions of the photoresist component of the hardened photoresist, was evaluated. As the value of the resolution, a drawing pattern obtained with a 2 μm engraving is used for exposure below 30 μm, and a drawing pattern obtained with a 5 μm engraving is used for exposure above 30 μm and 50 μm or less. The pattern obtained by μm engraving is exposed. In addition, the pattern of the unexposed portion as a circular hole is surrounded by the unexposed portion by the exposed portion, and the unexposed portion is difficult to develop. Therefore, it is an evaluation that is very strict compared with the ordinary resolution evaluation. <Evaluation of Resolution B> The focal position at the time of exposure was shifted from the surface of the polyethylene terephthalate film by 200 μm toward the inside of the substrate along the thickness direction of the evaluation substrate. Other than that, the resolution B was evaluated in the same manner as the measurement of the resolution A described above. <Evaluation of Resolution C> The focal position at the time of exposure was shifted from the surface of the polyethylene terephthalate film to the inside of the substrate in the thickness direction of the evaluation substrate by 400 μm. Other than that, the resolution C was evaluated in the same manner as the measurement of the resolution A described above. [Table 1] [Table 2] [table 3] Read the following from the results of Tables 1 and 2. It can be seen that in Examples 1 to 13 in which the number of fine particles of 1.5 μm or more and less than 4.5 μm included in the small piece of the supporting film is 0 to 200 on average at 10 places, the difference in resolution between normal time and focusing time, That is, the resolution B—resolution A, resolution C—resolution A is suppressed smaller than in Comparative Example 1 in which the number of particles is more than 200, and the line width A and line width B are also suppressed to be smaller. . In addition, a 16 μm-thick polyethylene terephthalate film (manufactured by Toray Co., Ltd., 16QS68) with the same number of fine particles as 1.5 μm and less than 4.5 μm was used as in Example 3. When the same photosensitive resin composition was evaluated, it was the same result as Example 3. In addition, in Example 1, no local peeling of the polyethylene terephthalate film was observed after laminating to the substrate, but in Example 7, local polyethylene terephthalate film was observed after laminating to the substrate. Delamination of the diester film. If the support film is peeled from the photosensitive resin composition layer before exposure, oxygen enters between the support film and the photosensitive resin composition layer, and the oxygen may cause poor curing of the photosensitive resin composition even when exposed. . From the comparison between the examples and the comparative examples, it can be seen that if the support film or photosensitive resin composition of this embodiment is used, even when the focus is shifted during exposure, the line width becomes smaller and the resolution can be reduced. Sexual deterioration. When a pattern is formed by the etching method or the plating method by using the polyethylene terephthalate film or the photosensitive resin composition, the mask line width reproducibility is improved even when there is unevenness or undulation on the substrate surface. Good, can form a high-definition circuit without problems such as short circuit defects or defects, disconnection, and poor plating. As mentioned above, although embodiment of this invention was described, this invention is not limited to this, It can change suitably in the range which does not deviate from the meaning of invention. [Industrial Applicability] Since the photosensitive resin multilayer body of the present invention can suppress the line width and resolution from being deteriorated when the focal position shifts during exposure, the substrate can be exposed to warping and deformation even by the exposure device. If the focus position at the time of exposure is shifted from the substrate surface due to poor setting, etc., short-circuit problems can also be prevented when forming circuits by etching, and defects, disconnections, and poor plating can be prevented when forming circuits by plating. And other problems, and the required circuit width can be obtained. Therefore, this photosensitive resin laminated body can be suitably used for manufacturing printed wiring boards, flexible substrates, lead frame substrates, substrates for COF (film-on-chip), substrates for semiconductor packages, transparent electrodes for liquid crystal, and wirings for TFT for liquid crystal , PDP (Plasma Display Panel) electrodes and other conductor patterns.

Claims (18)

一種感光性樹脂積層體，其係具備支持膜、及形成於該支持膜上之包含感光性樹脂組合物之感光性樹脂組合物層者，其中於上述支持膜之任意10處切出一邊5mm之正方形狀之小片時，各小片中所包含之1.5μm以上且未達4.5μm之微粒子之數量以上述10處平均計為0~200個。A photosensitive resin laminate comprising a support film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the support film, wherein a side of 5 mm is cut out at any of 10 positions of the support film. In the case of the square-shaped pieces, the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in each piece is 0 to 200 on average in the above 10 places. 如請求項1之感光性樹脂積層體，其中上述5mm見方之支持膜之小片中所包含的1.5μm以上且未達4.5μm之微粒子之數量以10處平均計為1~200個。For example, the photosensitive resin laminate according to claim 1, wherein the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film sheet is 1 to 200 on average at 10 locations. 如請求項1之感光性樹脂積層體，其中上述5mm見方之支持膜之小片中所包含的1.5μm以上且未達4.5μm之微粒子之數量以10處平均計為1~100個。For example, the photosensitive resin laminated body according to claim 1, wherein the number of fine particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film sheet is 1 to 100 on average in 10 places. 如請求項1之感光性樹脂積層體，其中上述5mm見方之支持膜之小片中所包含的1.5μm以上且未達4.5μm之微粒子之數量以10處平均計為1~50個。For example, the photosensitive resin laminate according to claim 1, wherein the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film sheet is 1 to 50 on average in 10 places. 如請求項1之感光性樹脂積層體，其中上述5mm見方之支持膜之小片中所包含的1.5μm以上且未達4.5μm之微粒子之數量以10處平均計為1~20個。For example, the photosensitive resin laminate according to claim 1, wherein the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film sheet is 1 to 20 on average at 10 locations. 如請求項1之感光性樹脂積層體，其中上述5mm見方之支持膜之小片中所包含的1.5μm以上且未達4.5μm之微粒子之數量以10處平均計為1~10個。For example, the photosensitive resin laminate according to claim 1, wherein the number of particles of 1.5 μm or more and less than 4.5 μm contained in the above-mentioned 5 mm square supporting film sheet is 1 to 10 on average in 10 places. 如請求項1至6中任一項之感光性樹脂積層體，其中上述感光性樹脂組合物以該感光性樹脂組合物之全部固形物成分質量基準計包含以下成分：(A)鹼可溶性高分子：10質量%~90質量%；(B)具有乙烯性不飽和雙鍵之化合物：5質量%~70質量%；及(C)光聚合起始劑：0.01質量%~20質量%。The photosensitive resin laminate according to any one of claims 1 to 6, wherein the above-mentioned photosensitive resin composition includes the following components based on the total solids component mass basis of the photosensitive resin composition: (A) an alkali-soluble polymer : 10% by mass to 90% by mass; (B) a compound having an ethylenically unsaturated double bond: 5% by mass to 70% by mass; and (C) a photopolymerization initiator: 0.01% by mass to 20% by mass. 如請求項7之感光性樹脂積層體，其中上述(A)鹼可溶性高分子之單體成分具有芳香族烴基。The photosensitive resin laminate according to claim 7, wherein the monomer component of the (A) alkali-soluble polymer has an aromatic hydrocarbon group. 如請求項7之感光性樹脂積層體，其中上述(A)鹼可溶性高分子之玻璃轉移溫度Tg之重量平均值Tgtotal為30℃以上且135℃以下。For example, the photosensitive resin laminate of claim 7, wherein the weight average value Tg total of the glass transition temperature Tg of the (A) alkali-soluble polymer is 30 ° C or higher and 135 ° C or lower. 如請求項7之感光性樹脂積層體，其中以感光性樹脂組合物之全部固形物成分質量基準計進而包含以下成分：(D)酚系衍生物：0.001質量%~10質量%。For example, the photosensitive resin laminated body of claim 7, further comprising the following components based on the total solid content of the photosensitive resin composition: (D) a phenol derivative: 0.001% to 10% by mass. 如請求項1至6中任一項之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.7%以下。The photosensitive resin laminated body according to any one of claims 1 to 6, wherein the moisture content contained in the photosensitive resin composition is 0.7% or less. 如請求項11之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.6%以下。The photosensitive resin laminated body according to claim 11, wherein the moisture content contained in the photosensitive resin composition is 0.6% or less. 如請求項11之感光性樹脂積層體，其中上述感光性樹脂組合物中所包含之水分量為0.5%以下。The photosensitive resin laminated body according to claim 11, wherein the moisture content contained in the photosensitive resin composition is 0.5% or less. 如請求項1至6中任一項之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630nm下之透過率為80%以下。The photosensitive resin laminate according to any one of claims 1 to 6, wherein the transmittance of the laminate of the support film and the photosensitive resin composition layer at a wavelength of 630 nm is 80% or less. 如請求項14之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630nm下之透過率為70%以下。For example, the photosensitive resin laminate of claim 14, wherein the transmittance of the laminate of the support film and the photosensitive resin composition layer at a wavelength of 630 nm is 70% or less. 如請求項14之感光性樹脂積層體，其中上述支持膜與上述感光性樹脂組合物層之積層體之波長630nm下之透過率為60%以下。For example, the photosensitive resin laminate of claim 14, wherein the transmittance of the laminate of the support film and the photosensitive resin composition layer at a wavelength of 630 nm is 60% or less. 一種光阻圖案之形成方法，其包括以下步驟：積層步驟，其係將如請求項1至16中任一項之感光性樹脂積層體積層於基板；曝光步驟，其係將該感光性樹脂積層體之感光性樹脂層進行曝光；及顯影步驟，其係將該感光性樹脂層之未曝光部分顯影去除。A method for forming a photoresist pattern includes the following steps: a lamination step, which is a step of laminating a photosensitive resin as described in any one of claims 1 to 16 on a substrate; and an exposing step, which is a step of laminating the photosensitive resin The photosensitive resin layer of the body is exposed; and a developing step, which involves developing and removing the unexposed portion of the photosensitive resin layer. 如請求項17之光阻圖案之形成方法，其中藉由利用繪圖圖案之直接繪圖之曝光方法、或使光罩之圖像透過透鏡而投影之曝光方法進行上述曝光步驟。For example, the method for forming a photoresist pattern according to claim 17, wherein the exposure step is performed by an exposure method using a direct drawing drawing pattern or an exposure method in which an image of a photomask is projected through a lens.
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