TWI771500B - 聚醯亞胺膜、覆金屬層疊板及電路基板 - Google Patents

聚醯亞胺膜、覆金屬層疊板及電路基板 Download PDF

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Publication number
TWI771500B
TWI771500B TW107134209A TW107134209A TWI771500B TW I771500 B TWI771500 B TW I771500B TW 107134209 A TW107134209 A TW 107134209A TW 107134209 A TW107134209 A TW 107134209A TW I771500 B TWI771500 B TW I771500B
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TW
Taiwan
Prior art keywords
polyimide
layer
polyimide film
thermal expansion
diamine
Prior art date
Application number
TW107134209A
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English (en)
Chinese (zh)
Other versions
TW201915069A (zh
Inventor
樹
菊池伊織
西山哲平
平石克文
安藤敏男
一郎
Original Assignee
日商日鐵化學材料股份有限公司
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Publication of TW201915069A publication Critical patent/TW201915069A/zh
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Publication of TWI771500B publication Critical patent/TWI771500B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW107134209A 2017-09-29 2018-09-28 聚醯亞胺膜、覆金屬層疊板及電路基板 TWI771500B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-191992 2017-09-29
JP2017191992 2017-09-29

Publications (2)

Publication Number Publication Date
TW201915069A TW201915069A (zh) 2019-04-16
TWI771500B true TWI771500B (zh) 2022-07-21

Family

ID=65919938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107134209A TWI771500B (zh) 2017-09-29 2018-09-28 聚醯亞胺膜、覆金屬層疊板及電路基板

Country Status (4)

Country Link
JP (1) JP7212480B2 (ko)
KR (1) KR102635402B1 (ko)
CN (1) CN109575283B (ko)
TW (1) TWI771500B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022098042A1 (ko) * 2020-11-04 2022-05-12 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법
KR102617724B1 (ko) * 2020-11-04 2023-12-27 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법
KR20230063057A (ko) * 2021-11-01 2023-05-09 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법

Citations (2)

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CN106553352A (zh) * 2015-09-30 2017-04-05 新日铁住金化学株式会社 具有聚酰亚胺层的层叠体的制造方法、聚酰亚胺膜的制造方法
CN106893121A (zh) * 2015-12-17 2017-06-27 深圳瑞华泰薄膜科技有限公司 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法

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JP2005259790A (ja) * 2004-03-09 2005-09-22 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板とその製造方法
JP4564336B2 (ja) 2004-11-04 2010-10-20 新日鐵化学株式会社 Ｃｏｆ用銅張積層板及びｃｏｆ用キャリアテープ
KR20070058812A (ko) * 2005-12-05 2007-06-11 주식회사 코오롱 폴리이미드 필름
JP2007165525A (ja) 2005-12-13 2007-06-28 Toyobo Co Ltd 表示機器
JP5976588B2 (ja) * 2013-03-29 2016-08-23 新日鉄住金化学株式会社 フレキシブル銅張積層板の製造方法
KR101593267B1 (ko) * 2013-03-29 2016-02-11 코오롱인더스트리 주식회사 폴리이미드 수지 및 이를 이용한 폴리이미드 필름
JP2014201632A (ja) 2013-04-03 2014-10-27 東レ・デュポン株式会社 ポリイミドフィルム、および、その製造方法
JP6370609B2 (ja) * 2014-05-29 2018-08-08 東レ・デュポン株式会社 ポリイミドフィルム
AU2014100840B4 (en) 2014-07-24 2015-03-12 Holden, Annette DR A Bra Assembly
JP6559027B2 (ja) 2014-09-30 2019-08-14 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板
KR102305624B1 (ko) 2015-01-22 2021-09-27 유니티카 가부시끼가이샤 적층체와 그의 제조 방법 및 사용 방법, 및 유리 기판 적층용 폴리이미드 전구체 용액
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CN106553352A (zh) * 2015-09-30 2017-04-05 新日铁住金化学株式会社 具有聚酰亚胺层的层叠体的制造方法、聚酰亚胺膜的制造方法
CN106893121A (zh) * 2015-12-17 2017-06-27 深圳瑞华泰薄膜科技有限公司 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法

Also Published As

Publication number Publication date
CN109575283B (zh) 2022-08-09
KR20190038383A (ko) 2019-04-08
JP7212480B2 (ja) 2023-01-25
TW201915069A (zh) 2019-04-16
KR102635402B1 (ko) 2024-02-13
JP2019065266A (ja) 2019-04-25
CN109575283A (zh) 2019-04-05

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